EP3C16F256I7 - 15,408-Logic-Cell Cyclone III FPGA | Intel
부품 번호: EP3C16F256I7 ✗ 단종EP3C16F256I7 개요
A field-programmable gate array, or FPGA, is a programmable digital IC whose logic, memory, and signal paths can be configured after manufacture. Within the product hierarchy, an FPGA belongs to the semiconductor and programmable-logic categories, with the Cyclone III family positioned as a low-power FPGA family for embedded, communications, industrial, and test applications. Unlike a fixed-function microcontroller or application-specific integrated circuit, an FPGA can support parallel processing, custom interfaces, protocol bridging, control logic, and signal conditioning within one device.
The Cyclone III architecture provides 15,408 logic elements organized into 963 logic array blocks. Each logic array block contains configurable logic capable of implementing combinational or registered Boolean functions. The device also includes 168 I/Os and 516,096 bits of memory, giving a design engineer a substantial amount of parallel data-processing and storage capacity. Its listed 1.2 V core voltage supports operation from a relatively low-voltage digital power domain.
The industrial temperature designation makes the EP3C16F256I7 suitable for environments where commercial-temperature components may not provide adequate operating margin. The supplied distributor records identify a 256-pin LBGA package, while another distributor description identifies the same configuration as a 256-pin FBGA. Its 437.5 MHz operating-frequency listing indicates the performance grade associated with this orderable device, although application timing must still be evaluated against the manufacturer’s electrical characteristics.
Typical uses include industrial control and automation, communications protocol conversion, embedded video or image processing, data acquisition, and test equipment. The 168 I/Os are useful for parallel control and high-speed digital interfaces, while the 516,096-bit memory resource supports buffering, packet storage, lookup tables, and intermediate data. Designers should also consider the 256-ball land pattern when assigning signals and planning escape routing.
PCB implementation requires a land grid array footprint, careful ball assignment, multilayer-routing discipline, and thermal analysis appropriate for a leadless BGA package. Because the verified source data does not expose the complete manufacturer pin table, designers should obtain the official Cyclone III documentation before releasing PCB artwork or making pin-level substitutions.
This product record combines verified distributor specifications, sourcing information, application context, and qualified same-family migration guidance. It separates confirmed EP3C16F256I7 attributes from unavailable detailed electrical, timing, memory, and pin-mapping data, helping engineers plan an initial design without treating incomplete distributor fields as authoritative design limits.
드롭인 대체품: EP3C16F256I7 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP3C16F256I7 (동일 폼 팩터 및 풋프린트) — 차이점: Embedded Memory, Operating Temperature, Package.
EP3C16F256I7N
✅ 드롭인 ⚠️ 사양 미검증가격 문의
데이터시트 보기 →EP3C16F256C8N
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
EP3C16F256C7N
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
EP3C16F256C6N
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
EP3C16F256C5N
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
EP3C16F256I7 최대 정격 & 전기적 특성
| Device Type | Cyclone III Field Programmable Gate Array (FPGA) |
| Logic Elements | 15,408 logic elements |
| Logic Array Blocks | 963 LABs |
| User I/O Count | 168 I/Os |
| Embedded Memory | 516,096 bits |
| Maximum Frequency | 437.5 MHz |
| Core Supply Voltage | 1.2 V |
| 패키지 | 256-LBGA (FBGA) |
| Total Terminals | 256 terminals |
| 동작 온도 | -40°C to 125°C |
| 실장 유형 | Surface mount |
| Lead-Free Status | Lead free |
| Programmable Logic | FPGA logic array with 15,408 logic elements |
EP3C16F256I7 256-lbga (fbga) 핀 구성 가이드
EP3C16F256I7(256-lbga (fbga) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP3C16F256I7.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP3C16F256I7 적합 용도: 6 애플리케이션s: Industrial Automation and Control, Communications Protocol Bridging, Test and Measurement Instrumentation, Data Acquisition and Signal Processing, Embedded Networking Gateways, Industrial Interface Consolidation.
Industrial Automation and Control
The EP3C16F256I7 fits industrial automation systems that require parallel control logic and a verified -40°C to 125°C operating range. Its 15,408 logic elements can implement multiple state machines, sequencing logic, interlocks, and sensor-conditioning functions, while 168 I/Os provide substantial connectivity for digital inputs, outputs, and field-bus gateways. The 516,096 bits of embedded memory can hold operating data, history buffers, and lookup information without relying entirely on external memory. For implementation, place the 256-LBGA device over an appropriately designed ground and power-plane region, then reserve short escape routes for high-speed and sensitive interface signals. Confirm actual I/O standards, core current, and junction temperature under worst-case utilization because those detailed limits were not present in the supplied source data.
추천
Communications Protocol Bridging
The EP3C16F256I7 is suitable for communications gateways that translate between serial, parallel, or packet-oriented interfaces. Its 963 logic array blocks provide substantial parallel processing capability for framing, filtering, buffering, and state management, while the 168 user I/Os allow multiple channels to be implemented in one device. The 516,096-bit memory capacity can support packet FIFOs and temporary protocol data. In a practical bridge, the FPGA terminates the incoming stream, performs framing and error checking in parallel logic, and passes validated data toward the opposite interface. The 437.5 MHz maximum-frequency listing indicates substantial logic timing capability, although exact signal-rate support depends on the applicable I/O standards and timing characterization. PCB planning must separate sensitive clock and data routes from switching circuitry while preserving continuous return paths through the BGA footprint.
추천
Test and Measurement Instrumentation
The EP3C16F256I7 can implement programmable timing, acquisition, and pattern-control functions in test and measurement equipment. The 15,408 logic elements allow multiple channels to be evaluated concurrently, and the 168 I/Os provide connections for instrument control, trigger distribution, status reporting, and acquisition buses. Embedded memory can implement sample buffers, lookup tables, or waveform descriptors, while the listed 437.5 MHz maximum frequency supports demanding parallel processing. A typical instrument would configure the FPGA for the selected test mode, collect results into logic or embedded-memory resources, and expose status through a communications controller. Because the retrieved records do not specify differential I/O capability, PLL count, or detailed timing budgets, those functions must be checked against the manufacturer characterization before committing to a pin assignment or external-interface speed.
추천
Data Acquisition and Signal Processing
The EP3C16F256I7 supports parallel data-acquisition systems that benefit from reconfigurable filtering, correlation, or digital signal-processing pipelines. Its 963 logic array blocks can implement multiple arithmetic and control paths concurrently, and the 168 I/Os provide ample parallel digital connections to converters, memories, and capture logic. The 516,096-bit embedded memory can buffer intermediate samples or coefficients, helping decouple acquisition timing from downstream processing. A practical design could capture several sensor channels, perform parallel filtering or thresholding, and transfer qualified results through a communications interface. The available data does not identify dedicated DSP blocks or supported memory widths, so complex arithmetic should be implemented and timed with the intended Quartus device fit rather than inferred from the logic-cell count alone. Power, ground, clock jitter, and high-speed routing must be evaluated together.
추천
Embedded Networking Gateways
The EP3C16F256I7 is appropriate for embedded networking gateways requiring programmable packet handling, local protocol support, or hardware-assisted filtering. The FPGA’s 15,408 logic elements and 516,096 bits of memory provide resources for header inspection, packet queues, flow control, and custom serial interfaces, while 168 I/Os allow a compact system to combine network and service connections. It can be placed between a network transceiver and an embedded processor to absorb bursts, validate frames, or translate between protocol formats. The verified 437.5 MHz maximum-frequency figure provides a useful indication of the device performance class, but usable link rates still depend on I/O timing, board-level channel loss, and clocking. Because no verified cross-brand pin-compatible substitute was found, migration planning should emphasize the availability of exact Cyclone III order codes rather than assuming another FPGA family can replace the device without redesign.
추천
Industrial Interface Consolidation
The EP3C16F256I7 can consolidate several slower industrial interfaces into a compact programmable subsystem. Its 168 user I/Os provide enough parallel connectivity for multiple digital device channels, and the 15,408 logic elements can support protocol engines, timeout counters, debounce logic, and diagnostic registers. The embedded memory can maintain command queues and status records while a processor accesses them through a simple parallel or serial register interface. Such a design is useful when legacy machinery uses multiple point-to-point connections and requires local logic to coordinate them. The verified -40°C to 125°C range supports industrial environments, but the circuit must still provide clean power, filtering, isolation, and surge protection where required. Exact I/O voltage limits and supported standards were not included in the retrieved data and must be confirmed from official Cyclone III documentation.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP3C16F256I7 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP3C16F256I7N | EP3C16F256C8N | EP3C16F256C7N | EP3C16F256C6N | EP3C16F256C5N |
|---|---|---|---|---|---|---|
| Brand | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera |
| Package | 256-LBGA (FBGA) | 256-LBGA (FBGA) | 256-LBGA (FBGA) | 256-LBGA (FBGA) | 256-LBGA (FBGA) | 256-LBGA (FBGA) |
| FPGA Family | Cyclone III | Cyclone III | Cyclone III | Cyclone III | Cyclone III | Cyclone III |
| Logic Elements | 15,408 | 15,408 | 15,408 | 15,408 | 15,408 | 15,408 |
| Logic Array Blocks | 963 LABs | 963 LABs | 963 LABs | 963 LABs | 963 LABs | 963 LABs |
| Embedded Memory | 516,096 bits | 516,096 bits | 516,096 bits | 516,096 bits | 516,096 bits | 516,096 bits |
| User I/O Count | 168 I/Os | 168 I/Os | 168 I/Os | 168 I/Os | 168 I/Os | 168 I/Os |
| Core Supply Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
주요 차별점
- Confirmed industrial-temperature operation (vs EP3C16F256C8N)
- Full 168-user-I/O interface in the intended package (vs EP3C16F484I7N)
- Confirmed 516,096-bit embedded-memory capacity (vs EP3C10U256C8N)
- Verified distributor availability and unit pricing (vs EP3C16F256C7N)
설계 노트
Treat the 256-LBGA land pattern as a high-density, leadless component interface. Follow the manufacturer’s ball maps, power-plane geometry, via requirements, and assembly guidelines exactly; do not derive a footprint from a generic 256-ball BGA drawing. Reserve independent return paths beneath clock, data, and configuration nets, and preserve access for X-ray inspection, rework, and boundary-scan debugging. Before fabrication, cross-check every assigned signal against the exact EP3C16F256I7 pin table because the supplied data does not include ball-level assignments.
Design the power rails around the verified 1.2 V core requirement and the manufacturer’s complete AC/DC current tables. The current consumption depends on logic utilization, I/O activity, configuration method, and operating speed, none of which is available in the supplied records. Use separate, well-filtered paths for the core and I/O supplies where supported, place bulk and local decoupling according to the official guidance, and verify startup sequencing, voltage tolerances, and rail ramp behavior with mixed-signal measurements. Do not infer current limits from the 437.5 MHz frequency listing.
Perform a board-level thermal analysis instead of applying a generic heatsink rule. Estimate junction temperature from actual core and I/O dissipation, the package thermal characteristics, local copper, via density, airflow, and the maximum ambient temperature. The verified industrial range reaches 125°C, leaving less thermal margin than a 85°C-class design. Ensure the BGA is not placed over a thermally isolated region, provide an uninterrupted heat-spreading copper region where the footprint permits, and qualify the assembly for its maximum expected operating condition.
The principal substitution risk is treating every EP3C16F256 order code as electrically identical. Before changing EP3C16F256I7 to an I7N, C8N, C7N, C6N, or C5N variant, compare the ordering-information table, speed grade, temperature grade, package, lead-free status, and lifecycle status. Same-family names alone do not prove drop-in equivalence. Also verify the Quartus-supported device, bitstream configuration method, JTAG behavior, and any impact on the existing PCB and production test fixture.
규정 준수 정보
The supplied DigChip specification identifies the package as LEAD FREE. RoHS, REACH, halogen-free, and conflict-minerals declarations were not explicitly provided and remain unknown. AEC-Q100 is not applicable to this general-purpose FPGA based on the available product description.
