10M04DCF256A7G - MAX 10 FPGA 4K LE 256-FBGA | Intel
부품 번호: 10M04DCF256A7G ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $17.35 | $17.35 |
| 10 | $15.62 | $156.20 |
| 100 | $13.88 | $1,388.00 |
| 500 | $12.45 | $6,225.00 |
| 1,000 | $11.1 | $11,100.00 |
10M04DCF256A7G 개요
What is a MAX 10 FPGA? The MAX 10 family belongs to the low-cost, non-volatile FPGA product line within Intel's programmable logic portfolio. As an FPGA (Field Programmable Gate Array), the device provides programmable logic blocks, embedded memory, and DSP blocks that can be reconfigured post-manufacturing. MAX 10 specifically targets small-form-factor, low-power applications by integrating hard IP such as ADCs, PLLs, and configuration memory into the same die, blurring the line between traditional FPGAs and microcontrollers in embedded designs.
The 10M04 variant delivers 4,000 logic elements (LEs), 16 Kbits of user flash memory (UFM) for data storage, 1.5 Mbits of total embedded block RAM, and 178 maximum user I/O pins. Additional features include up to 72 Kbits of distributed RAM (in MLABs), a 12-bit 1 MSPS analog-to-digital converter (ADC), and on-chip voltage regulation supporting single 3.0 V or 3.3 V supply operation.
Architecturally, MAX 10 devices combine a LUT-based logic fabric with hardened analog and memory blocks, allowing single-chip implementation of glue logic, state machines, and sensor interfacing. The integrated dual-configuration flash supports remote field updates and design version rollback without external memory. Internal flash and SRAM-based configuration cells enable instant-on behavior, making the device suitable for deterministic boot applications.
Typical applications include industrial control and I/O expansion, low-cost video processing bridges, motor control and drive interfaces, portable test and measurement, automotive infotainment and body controllers, and consumer electronics requiring custom logic or interface translation. The 256-FBGA package and high I/O count target PCB designs with moderate routing complexity.
Designers should leverage the Quartus Prime software for synthesis and place-and-route, and consult the MAX 10 device handbook for pinout, configuration scheme, and ADC calibration procedures. The exposed pad must be soldered to the PCB ground plane for thermal dissipation and signal integrity.
This page synthesizes distributor pricing, same-family MAX 10 alternatives, and practical design notes not found in the manufacturer datasheet alone, enabling faster component selection and BOM validation.
드롭인 대체품: 10M04DCF256A7G — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: 10M04DCF256A7G (동일 폼 팩터 및 풋프린트) — 차이점: Package, Process Technology, Logic Elements (LE), User Flash Memory, User I/O Count.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
10M04DAF256A7G
✅ 드롭인✓ 재고 있음
$3.53 / 개
데이터시트 보기 →10M04DAF256C7G
✅ 드롭인✓ 재고 있음
$9.45 / 개
데이터시트 보기 →10M04DCF256C8G
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
10M02DCU324A7G
✅ 드롭인✓ 재고 있음
$6.3 / 개
데이터시트 보기 →10M04DAU324I7G
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$13.5 / 개
데이터시트 보기 →10M04DCF256A7G 최대 정격 & 전기적 특성
| Series | MAX 10 |
| Logic Elements (LE) | 4,000 |
| Maximum User I/O | 178 |
| Embedded Memory (M9K) | 193,536 bits |
| Total RAM | 1.5 Mbit |
| User Flash Memory (UFM) | 16 Kbit |
| Process Technology | 55 nm |
| Core Voltage | 1.2 V |
| 패키지 | 256-LBGA (FBGA) |
| 실장 유형 | Surface Mount |
| 동작 온도 | -40C to +125C (Industrial) |
| Configuration Memory | Internal dual-configuration flash (instant-on) |
| Integrated ADC | 12-bit, 1 MSPS |
| RoHS 상태 | Compliant |
10M04DCF256A7G 256-lbga (fbga) 핀 구성 가이드
10M04DCF256A7G(256-lbga (fbga) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: 10M04DCF256A7G.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
10M04DCF256A7G 적합 용도: 7 애플리케이션s: Industrial Control and I/O Expansion, Motor Control and Drive Interfaces, Portable Test and Measurement, Automotive Infotainment and Body Controllers, Video Processing Bridges and Format Conversion, Consumer Electronics Custom Logic, Communication Protocol Bridging.
Industrial Control and I/O Expansion
The 10M04DCF256A7G suits industrial PLC and I/O expansion modules where deterministic logic and 178 GPIO enable multi-protocol interfacing. The MAX 10's instant-on dual-configuration flash eliminates boot delay, critical for factory automation requiring sub-100ms power-up. Integrated 12-bit ADC supports sensor signal conditioning, while 55nm process ensures low power dissipation under continuous industrial operation. Compared to discrete MCU + CPLD designs, the 10M04 consolidates glue logic, state machines, and protocol bridging (RS-485, CAN, SPI, I2C) into a single 256-FBGA device, reducing BOM and PCB area.
추천
Motor Control and Drive Interfaces
The 10M04DCF256A7G's 4K logic elements and 178 I/O enable field-oriented control (FOC) and PWM generation for 3-phase motor drives up to several kW. Hardware multipliers and DSP blocks accelerate Park/Clarke transforms, while 1.5 Mbit embedded RAM stores lookup tables and filter coefficients. The integrated ADC samples current and voltage feedback synchronously to PWM, reducing latency versus external ADC chains. Industrial temperature grade (-40C to +125C) and 256-FBGA thermal performance support enclosed drive enclosures with forced-air cooling.
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Portable Test and Measurement
The 10M04DCF256A7G is well-suited for handheld oscilloscopes, logic analyzers, and portable data acquisition systems. Its 12-bit integrated ADC samples at 1 MSPS for mid-bandwidth signal capture, while 4K logic elements implement triggering, protocol decoding (I2C/SPI/UART), and display drivers. Single 3.3V supply operation with internal voltage regulation simplifies power tree design. The 256-FBGA package offers 178 I/O for multi-channel front-end multiplexing, and instant-on flash configuration reduces battery drain during standby.
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Automotive Infotainment and Body Controllers
The 10M04DCF256A7G's industrial temperature range and 178 GPIO enable body control modules, lighting controllers, and infotainment I/O bridging in automotive designs. MAX 10 non-volatile flash supports OTA (over-the-air) firmware updates with design rollback capability, critical for vehicle recall mitigation. The integrated ADC monitors battery voltage, temperature, and illumination sensors directly. Note: this part is industrial-grade; AEC-Q100 qualified variants in the MAX 10 family should be selected for safety-critical automotive applications.
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Video Processing Bridges and Format Conversion
The 10M04DCF256A7G provides LVDS, CMOS, and DDR memory interfaces for video format conversion (RGB to MIPI, HDMI to LVDS) in display panels and embedded vision systems. With 1.5 Mbit embedded block RAM, the device buffers video frames while 4K logic elements implement scaling, color space conversion, and timing generation. The 256-FBGA package supports the high pin count required for parallel video buses, and internal flash stores default boot images for instant-on display initialization.
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Consumer Electronics Custom Logic
The 10M04DCF256A7G integrates custom user interfaces, LED matrix driving, and peripheral glue logic in consumer products like smart appliances, gaming peripherals, and home audio. The 12-bit ADC reads capacitive touch sensors and analog control knobs, while PWM outputs drive LED dimming at up to hundreds of kHz. Instant-on flash configuration enables immediate user response at power-up, a UX advantage over MCU boot sequences. The 256-FBGA and -40C to +125C rating suit thermally constrained consumer enclosures.
추천
Communication Protocol Bridging
The 10M04DCF256A7G bridges legacy and modern serial interfaces (UART, SPI, I2C, CAN, USB, Ethernet) in embedded gateways. Its 178 GPIO accommodate multiple parallel protocol buses, while 4K logic elements implement protocol stack layers and timing-critical state machines. Dual-configuration flash allows field upgrades of bridge firmware without external memory, and the 55nm process ensures low standby power for always-on IoT edge devices. Industrial temperature grade supports outdoor and industrial installations.
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추천 제품 요약
엔지니어링 참조 데이터: 10M04DCF256A7G — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | 10M04DAF256A7G | 10M04DAF256C7G | 10M04DCF256C8G |
|---|---|---|---|---|
| Package | 256-LBGA (F256) | 256-LBGA (F256) - same | 256-LBGA (F256) - same | 256-LBGA (F256) - same |
| Brand | Intel | Intel - same | Intel - same | Intel - same |
| Logic Elements | 4,000 | 4,000 | 4,000 | 4,000 |
| Maximum User I/O | 178 | 178 | 178 | 178 |
| Embedded Memory (M9K) | 193,536 bits | 193,536 bits | 193,536 bits | 193,536 bits |
| Speed Grade | A7 (standard) | A7 (standard) | C7 (commercial) | C8 (commercial) |
| Operating Temperature | -40C to +125C (Industrial) | -40C to +125C (Industrial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) |
| Integrated ADC | 12-bit, 1 MSPS | 12-bit, 1 MSPS | 12-bit, 1 MSPS | 12-bit, 1 MSPS |
주요 차별점
- Internal dual-configuration flash eliminates external boot PROM (vs 10M04DAF256A7G)
- Industrial temperature grade for harsh environments (vs 10M04DCF256C8G)
- Integrated 12-bit ADC eliminates external sampling ICs (vs Lattice MachXO2)
설계 노트
The 256-FBGA package requires the central exposed pad to be soldered to a PCB ground plane for thermal dissipation. Estimated: at typical 1.2V core and 100mA active current, power dissipation is approximately 120mW, well within passive cooling limits. For continuous high-utilization designs (above 80% LE and DSP usage), provide at least 4 thermal vias under the exposed pad to a 2oz copper inner ground layer to keep junction temperature below 100C in enclosed industrial enclosures.
Route differential pairs (LVDS, DDR) with 100 ohm differential impedance and length-matched within 150 mils for signal integrity. Place decoupling capacitors (100nF + 10uF bulk) within 100 mils of each power pin. For MAX 10 devices, separate analog AVDD and digital VCCINT supplies with ferrite beads to prevent ADC noise coupling. According to the MAX 10 hardware design guidelines, JTAG pins (TCK, TMS, TDI, TDO) require 4.7k pull-ups on TCK and TMS for reliable configuration.
Do not confuse the 10M04DCF256A7G (industrial, A7 speed) with the 10M04DCF256C8G (commercial, C8 speed) when sourcing for industrial applications - the C8 variant lacks the -40C to +125C rating. Configuration mode (AS, PS, JTAG) must be set via MSEL pins at power-up; incorrect MSEL strapping causes silent configuration failure. The dual-configuration flash requires Quartus Prime conversion to .pof format - .sof files only program SRAM and are lost at power-down.
Place the 256-FBGA on the top side of the PCB with a 4-layer stack-up (signal-ground-power-signal) for optimal signal integrity. Use microvia or via-in-pad technology for inner-row balls to route out from the dense 1.0mm pitch array. Per Intel's MAX 10 layout guidelines, keep all high-speed traces on the top layer directly above a continuous ground plane to minimize return path inductance.
규정 준수 정보
RoHS compliant per Altera/Intel product page. Industrial temperature grade (-40C to +125C) but NOT AEC-Q100 qualified; for automotive safety-critical applications use MAX 10 AEC-Q100 variants. Halogen-free status not explicitly stated in verified data.
