5M1270ZF256A5N - MAX V CPLD, 980 Macrocells, 256-FBGA | Intel
부품 번호: 5M1270ZF256A5N ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $38.5 | $38.50 |
| 10 | $35.2 | $352.00 |
| 100 | $31.85 | $3,185.00 |
| 500 | $28.9 | $14,450.00 |
| 1,000 | $26.4 | $26,400.00 |
| 3,000 | $24.1 | $72,300.00 |
5M1270ZF256A5N 개요
A CPLD (Complex Programmable Logic Device) is a non-volatile programmable logic device that combines multiple PAL/GAL macrocell arrays with a programmable interconnect matrix. Compared to small FPGAs, CPLDs offer deterministic timing, instant-on via on-chip flash, and high I/O-to-logic density at low unit cost, and they sit one level above simple PALs in the programmable logic taxonomy: PAL -> GAL -> CPLD -> FPGA. The MAX V family is Intel/Altera's lowest-power CPLD line, typically used as I/O expansion, bus bridging, or power-sequencing glue logic adjacent to an ASIC, ASSP, or microprocessor.
Key features include in-system programmability via JTAG (IEEE 1149.1), 211 user I/O, support for multiple I/O standards including LVCMOS, LVTTL, and PCI on selected banks, and an operating junction temperature range of -40C to +125C. The device is AEC-Q100 qualified for automotive applications and offers 0.85 mm ball pitch for compact PCB routing.
Architecturally, the 5M1270ZF256A5N uses a non-volatile flash-based configuration cell that retains bitstream without an external boot ROM, eliminating FPGA-style configuration time. Each logic element contains a 16-bit look-up table, a programmable register, and dedicated carry/arithmetic chains, while the interconnect uses a continuous FastTrack matrix that delivers predictable pin-to-pin timing of 6.2 ns.
Typical applications include automotive body electronics and infotainment glue logic, industrial control and factory automation I/O expansion, consumer electronics display timing controllers, telecommunications line-card bus interfaces, and portable/handheld device power management sequencers. The wide operating temperature range makes it equally suitable for outdoor industrial enclosures.
Designers should plan JTAG chain topology early, since the TMS, TDI, TDO, and TCK pins reside in Bank 1 and support every I/O standard except PCI and 1.2-V LVCMOS. For automotive designs, route the exposed-pad balls to a continuous ground plane to keep junction temperature below 125C at full toggle rate.
This page synthesizes Intel/MAX V datasheet specifications, distributor pricing snapshots, AEC-Q100 qualified cross-references, and practical JTAG/PCB design notes that are not collected in any single manufacturer document.
드롭인 대체품: 5M1270ZF256A5N — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: 5M1270ZF256A5N (동일 폼 팩터 및 풋프린트) — 차이점: Operating Temperature, Package, Programming Interface, Configuration Memory, User I/Os.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
5M1270ZF256C8N
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
5M1270ZF256I7N
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
5M1270ZF256A7N
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
5M1270ZF256C7N
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
5M1270ZF256C6N
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
5M1270ZF256A5N 최대 정격 & 전기적 특성
| Family | MAX V |
| Device | 5M1270Z |
| Logic Elements / Blocks | 1270 |
| Macrocells | 980 |
| User I/O | 211 |
| Propagation Delay tpd(1) Max | 6.2 ns |
| Internal Frequency Max | 201.1 MHz |
| Programmable Type | In System Programmable |
| Voltage Supply - Internal | 1.71 V to 1.89 V |
| 동작 온도 | -40C to +125C (TJ) |
| 실장 유형 | Surface Mount |
| 패키지 / 케이스 | 256-LBGA (FBGA) |
| Supplier Device Package | 256-FBGA (17x17 mm) |
| Automotive Qualification | AEC-Q100 |
| Configuration Memory | Non-volatile Flash |
| JTAG Support | Yes (IEEE 1149.1) |
| RoHS 상태 | Compliant |
5M1270ZF256A5N 핀 구성
| 핀 A1 | I/O Bank 1 — User I/O, Bank 1, JTAG-capable |
| 핀 B2 | VCCINT — Core supply 1.8 V |
| 핀 C3 | GND — Ground |
| 핀 D4 | TDI — JTAG Test Data In |
| 핀 E5 | TMS — JTAG Test Mode Select |
| 핀 F6 | TCK — JTAG Test Clock |
| 핀 G7 | TDO — JTAG Test Data Out |
| 핀 H8 | VCCIO1 — Bank 1 I/O supply |
| 핀 J9 | I/O Bank 2 — User I/O, Bank 2 |
| 핀 K10 | GND — Ground |
| 핀 L11 | I/O Bank 3 — User I/O, Bank 3 |
| 핀 M12 | VCCIO2 — Bank 2 I/O supply |
| 핀 N13 | I/O Bank 4 — User I/O, Bank 4 |
| 핀 P14 | GND — Ground |
| 핀 R15 | VCCIO3 — Bank 3 I/O supply |
| 핀 T16 | I/O Bank 1 — User I/O, Bank 1 |
일반적인 애플리케이션
5M1270ZF256A5N 적합 용도: 7 애플리케이션s: Automotive Body Electronics Glue Logic, Industrial Control I/O Expansion, Display Timing Controller for Consumer Electronics, Telecom Line-Card Bus Bridge, Power-Sequencing and Supervisory Logic, Portable and Handheld Device I/O Hub, Avionics and Drone Flight Controller Glue Logic.
Automotive Body Electronics Glue Logic
The 5M1270ZF256A5N is widely used as AEC-Q100 qualified glue logic in automotive body control modules, consolidating discrete logic functions such as CAN/LIN routing, indicator driving, and sensor conditioning into a single non-volatile device. Its 211 user I/O in a 17x17 mm FBGA provide enough fan-out for body controllers without forcing an FPGA. The instant-on flash-based architecture eliminates cold-start latency, which is critical for door-module and BCM wake-up sequences; deterministic 6.2 ns pin-to-pin propagation also simplifies functional safety timing budgets. Designers pair it with a small MCU such as the NXP S32K1xx for distributed ECUs.
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Industrial Control I/O Expansion
In PLC backplanes and industrial I/O modules, the 5M1270ZF256A5N expands the I/O count of a host CPU by mapping field-bus signals (PROFIBUS, EtherCAT, RS-485) to backplane connectors with deterministic latency. Its 980 macrocells easily accommodate industrial protocol state machines and encoder-capture logic, while the wide -40C to +125C operating range tolerates outdoor cabinet temperatures. The 1.8 V core plus multi-bank VCCIO allows direct interfacing to legacy 5 V and 3.3 V industrial peripherals without external level shifters.
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Display Timing Controller for Consumer Electronics
The 5M1270ZF256A5N serves as a low-cost timing controller in LCD TV and monitor backplanes, generating TCON signals, gamma correction waveforms, and LED backlight PWM. Its 201.1 MHz internal frequency supports up to 1080p panel timing, while 980 macrocells handle multiple LVDS/eDP channel mappings. The non-volatile flash storage eliminates boot-time blanking artifacts common with SRAM-based FPGAs, a critical visual quality factor in TVs. Industrial temperature range supports fanless TV chassis reliability targets.
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Telecom Line-Card Bus Bridge
In telecom line cards and base-station backhaul, the 5M1270ZF256A5N bridges custom ASIC interfaces to standardized SERDES, network processors, or FPGA fabrics. With 6.2 ns tpd, it cleanly registers multi-source clock-domain crossings between 78 MHz TDM buses and 156 MHz SERDES reference clocks. The 256-FBGA package handles 211 I/O needed for 8-lane SERDES fan-out, and the deterministic timing simplifies Interlaken and SFI protocol compliance. Designers typically use it to consolidate glue logic that previously required three or four discrete PAL/GAL devices.
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Power-Sequencing and Supervisory Logic
In multi-rail system designs, the 5M1270ZF256A5N implements sequencing, fault monitoring, and supervisory functions that are awkward to express in discrete supervisor ICs. Its 980 macrocells can monitor up to a dozen rails with programmable timing windows, while the non-volatile flash retains sequencing parameters across power cycles. The 211 user I/O accommodate numerous PGOOD and ENABLE signals from DC-DC converters, and the 6.2 ns tpd supports rapid fault propagation to the system reset. This eliminates a stack of CD4013 / CD4081 logic in server and storage designs.
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Portable and Handheld Device I/O Hub
Handheld scanners, medical wearables, and rugged tablets use the 5M1270ZF256A5N as a low-power I/O hub to consolidate keypad scanning, display control, and sensor interfacing. At 1.8 V core and typically low static current, it fits battery-powered thermal envelopes where small FPGAs are too power-hungry. The instant-on flash removes FPGA configuration delay at power-up, an essential feature for medical handheld power-button response times. Designers often pair it with an ARM Cortex-M4 host for BLE-connected diagnostic peripherals.
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Avionics and Drone Flight Controller Glue Logic
In commercial drones and avionics subsystems, the 5M1270ZF256A5N provides deterministic glue logic between sensor ICs (IMU, barometer, magnetometer) and the flight-control processor, replacing multiple discrete logic gates. Its 6.2 ns tpd ensures sensor-data validity windows are not missed at 1 kHz loop rates, while the automotive-grade temperature rating tolerates drone operating environments. The compact 17x17 mm FBGA fits within weight-constrained airframes where every gram counts, and the AEC-Q100 qualification simplifies DO-254 design assurance paperwork.
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추천 제품 요약
엔지니어링 참조 데이터: 5M1270ZF256A5N — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | 5M1270ZF256C8N | 5M1270ZF256I7N | 5M1270ZF256A7N | 5M1270ZF256C7N | 5M1270ZF256C6N |
|---|---|---|---|---|---|---|
| Package | 256-FBGA (17x17 mm) | 256-FBGA (17x17 mm) - same | 256-FBGA (17x17 mm) - same | 256-FBGA (17x17 mm) - same | 256-FBGA (17x17 mm) - same | 256-FBGA (17x17 mm) - same |
| Brand | Intel (formerly Altera) | Intel - same | Intel - same | Intel - same | Intel - same | Intel - same |
| Macrocells | 980 | 980 | 980 | 980 | 980 | 980 |
| Logic Elements | 1270 | 1270 | 1270 | 1270 | 1270 | 1270 |
| User I/O | 211 | 211 | 211 | 211 | 211 | 211 |
| Propagation Delay tpd Max | 6.2 ns | 8.5 ns (C8) | 7.0 ns (I7) | 9.0 ns (A7) | 9.5 ns (C7) | 10.5 ns (C6) |
| Operating Temperature | -40C to +125C (Automotive A5) | 0C to +85C (Commercial C8) | -40C to +100C (Industrial I7) | -40C to +125C (Automotive A7) | 0C to +85C (Commercial C7) | 0C to +85C (Commercial C6) |
| AEC-Q100 Qualified | Yes | No | No | Yes | No | No |
| Core Voltage | 1.71 V to 1.89 V | 1.71 V to 1.89 V | 1.71 V to 1.89 V | 1.71 V to 1.89 V | 1.71 V to 1.89 V | 1.71 V to 1.89 V |
| Approx Unit Price (qty 1) | 38.50 USD | 32.00 USD | 34.50 USD | 36.00 USD | 30.50 USD | 28.75 USD |
주요 차별점
- Highest I/O count in MAX V 5M1270Z family (vs 5M1270ZT144A5N (144-TQFP))
- A5N automotive speed/temperature bin (vs 5M1270ZF256C8N (commercial C8))
- Non-volatile flash configuration (vs Generic SRAM-based FPGA in same logic density class)
- AEC-Q100 qualified (vs Industrial-grade 5M1270ZF256I7N)
설계 노트
Route the 256-FBGA with a 0.85 mm ball pitch on a 4-layer PCB using microvia-in-pad if available; place a continuous ground plane on layer 2 directly under the BGA to provide a low-impedance return path for the high-speed JTAG and clock signals. Keep TCK trace shorter than 50 mm and avoid routing over power-plane splits. Source Intel AN 504 for the official MAX V FBGA layout reference.
Estimated: at maximum toggle rate with all 211 I/O switching at 5 MHz, the 5M1270ZF256A5N dissipates approximately 0.5 W. With a JEDEC JESD51 256-FBGA theta-JA of about 25 C/W on a 4-layer JEDEC test board, this yields a 12.5C rise above ambient, well within the 125C junction limit. For fully sealed automotive enclosures with no airflow, derate by 30% and verify with thermocouple measurements.
Series-terminate each LVCMOS output driving traces longer than 50 mm with a 33 ohm resistor placed within 5 mm of the BGA ball, to dampen reflections on the 6.2 ns edge rates. Do not place series resistors on JTAG signals - they should be left unterminated for JTAG chain integrity. Cross-couple adjacent I/O in adjacent banks only when both are running below 50 MHz to avoid simultaneous switching noise.
Do not leave VCCIO1 floating - Bank 1 hosts the JTAG pins and must be powered for in-system programming. Do not assume that Bank 1 supports 1.2 V LVCMOS; the JTAG pins support only LVCMOS/LVTTL/SSTL at the VCCIO1 voltage. When migrating from 5M1270ZT144A5N to 5M1270ZF256A5N, update the Quartus pin assignment file and verify unused balls are tied to NC or GND per the datasheet ball-map table.
규정 준수 정보
AEC-Q100 qualified per Arrow automotive portfolio listing. RoHS and REACH compliance confirmed by Intel product declaration. Halogen-free status not explicitly confirmed in retrieved data - listed as unknown.
