EP3C25F324C7 - 25K Logic FPGA, 215 I/O, 324-BGA | Intel
부품 번호: EP3C25F324C7 ✓ 활성EP3C25F324C7 개요
A field-programmable gate array, or FPGA, is a semiconductor whose digital logic is configured after fabrication. In the product hierarchy, an FPGA belongs to programmable logic, which is a category of integrated circuit used to implement control, interface, signal-processing, and data-routing functions. Unlike a fixed-function application-specific integrated circuit, a Cyclone III FPGA can be programmed for multiple system behaviors and updated when design requirements change.
The supplied distributor specifications identify 24,624 logic elements and 608,256 memory bits for this device. Its 215 I/O provide substantial board-level connectivity for parallel buses, counters, timers, status and control signals, and general-purpose digital interfaces. The EP3C25F324C7 uses a 324-BGA package, supporting compact surface-mount PCB construction while requiring careful ball-layout, assembly, and thermal-design planning.
Cyclone III devices belong to Intel's programmable-logic portfolio and are commonly evaluated for embedded control, industrial automation, communications, instrumentation, and consumer-electronics designs. The EP3C25F324C7 suffix identifies a particular member of the EP3C25 device family and package combination. Because the supplied search data does not include the complete ordering-information table, exact speed-grade, temperature-grade, core-voltage, and legacy-versus-current status distinctions are marked as needed rather than inferred from the suffix.
Potential applications include industrial control boards, programmable logic instruments, communication interfaces, test equipment, and embedded systems requiring substantially more I/O than a microcontroller may provide. In such designs, the FPGA can execute parallel state machines, merge or format data streams, coordinate multiple peripherals, and implement deterministic hardware timing. Tool-chain and device support must be confirmed against the applicable Intel Quartus or legacy Altera device-support package before committing to production.
PCB implementation should follow the exact package ball map and power-plane requirements from the official device documentation. BGA soldering requires an appropriate land pattern, stencil design, reflow profile, X-ray or X-ray-equivalent assembly inspection, and sufficient via-in-pad or thermal-via strategy where warranted. Designers should also verify that every connected I/O standard, bank voltage, clock input, configuration source, and decoupling requirement is supported by the selected board revision.
This product page consolidates the supplied distributor inventory, package and logic-resource details, verified same-family alternatives, comparison points, and implementation cautions into a design-focused reference. Because the provided evidence does not include a manufacturer datasheet URL or complete electrical tables, unsupported ratings and pin assignments are explicitly identified instead of being estimated.
드롭인 대체품: EP3C25F324C7 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP3C25F324C7 (동일 폼 팩터 및 풋프린트) — 차이점: Package, Process Technology, Embedded Memory, Family, Operating Temperature.
EP3C25F324C7N
✅ 드롭인가격 문의
데이터시트 보기 →EP3C25F324C8N
✅ 드롭인가격 문의
데이터시트 보기 →EP3C25F324C6N
✅ 드롭인가격 문의
데이터시트 보기 →EP3C25F324I7
✅ 드롭인가격 문의
데이터시트 보기 →EP3C25F324C7 최대 정격 & 전기적 특성
| Device Type | Field Programmable Gate Array (FPGA) |
| FPGA Family | Cyclone III |
| Logic Elements | 24,624 |
| Memory Bits | 608,256 bits |
| Number of I/O | 215 |
| Package Type | 324-BGA |
| Package Code | BGA |
| Number of Terminals | 324 |
| Package Shape | Square |
| Terminal Form | Ball |
| 실장 유형 | Surface Mount |
EP3C25F324C7 square 핀 구성 가이드
EP3C25F324C7(square 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP3C25F324C7.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP3C25F324C7 적합 용도: 6 애플리케이션s: Industrial Automation and PLC Control, Data Acquisition and Instrumentation, Communication Protocol Interface, Programmable Test and Measurement Equipment, Consumer and Embedded Control Products, LED Signage and Display Control.
Industrial Automation and PLC Control
The EP3C25F324C7 fits industrial control and PLC-style logic because its verified 215 I/O provide substantial connectivity for sensors, actuators, interlocks, counters, and machine-state machines. The 24,624 logic elements can implement parallel control sequences and peripheral coordination without requiring a separate external CPLD for every interface. It is used as the programmable central logic between field wiring and system controllers, although actual industrial deployment requires confirmation of the device's temperature grade, isolation strategy, electromagnetic-emissions performance, and supply longevity. Power rails, clocking, and BGA assembly must be designed against the official device documentation rather than inferred from distributor summaries.
추천
Data Acquisition and Instrumentation
The EP3C25F324C7 is applicable to modular data-acquisition equipment that must coordinate many parallel inputs, control registers, triggers, and status signals. Its 215 I/O and 608,256 memory bits support parallel sampling interfaces, acquisition sequencing, digital filtering, and instrument-control logic, while 24,624 logic elements can consolidate several fixed-function state machines. The device is positioned beside an ADC or DAC on a measurement board, but supported I/O standards, input timing, output timing, and achievable data rate must be checked against the exact device documentation. For high-speed analog conversion, external clocking and controlled-impedance routing remain necessary.
추천
Communication Protocol Interface
The EP3C25F324C7 can serve as a configurable communication-interface FPGA when a design requires parallel data movement, byte alignment, framing, buffering, and protocol conversion. Its 215 I/O allow multiple channels and control signals to be consolidated, while the 24,624 logic elements can implement transmit and receive state machines concurrently. The part is used between a host processor or microcontroller and physical-layer transceivers, with logic performing framing, filtering, and buffering. Design engineers must verify the supported I/O standards, clock domains, transceiver interfacing requirements, and timing margins in the exact EP3C25 documentation before selecting this part for a production interface.
추천
Programmable Test and Measurement Equipment
The EP3C25F324C7 fits programmable test systems that need extensive digital sequencing, parallel fixture control, pattern generation, and acquisition coordination. With 215 I/O and 24,624 logic elements, it can control multiple tester channels and implement deterministic timing around an FPGA, microcontroller, or instrument front end. The device's 608,256 memory bits may support buffers and test-pattern resources, subject to the confirmed architecture and compiler allocation. Practical adoption requires validated clock jitter, I/O voltage, ground-plane, and BGA assembly strategies, particularly in high-channel-count fixture boards where routing density and connector-to-FPGA skew can be more demanding than the logic itself.
추천
Consumer and Embedded Control Products
The EP3C25F324C7 can consolidate multiple embedded-control functions into a compact programmable-logic implementation. Its 215 I/O suit boards that need displays, buttons, memory interfaces, communications, and peripheral control, while the 24,624 logic elements allow behavior to be updated independently of fixed silicon. The FPGA is placed between a system processor and discrete peripherals, implementing glue logic, timing, command formatting, and status multiplexing. Product designers must budget for the 324-BGA assembly process, verify supported voltage standards, and confirm configuration-storage and boot behavior. Its suitability for a particular consumer product also depends on qualification, lifecycle, and sourcing requirements beyond the supplied distributor inventory records.
추천
LED Signage and Display Control
The EP3C25F324C7 is appropriate for display-control and LED-signage systems that require numerous parallel outputs, timing sequences, refresh control, and diagnostic functions. Its 215 I/O can distribute pixel or segment control signals, while the programmable logic supports refresh timing, blanking, fault detection, and communication with a display controller. The 24,624 logic elements allow several display banks and auxiliary functions to be integrated into one FPGA. Implementation must account for the actual I/O voltage, output-drive capability, timing specification, and connector routing for each panel. Because the supplied records do not provide these electrical details, designers should consult the official device data before assigning loads or planning high-current outputs.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP3C25F324C7 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP3C25F324C7N | EP3C25F324C8N | EP3C25F324C6N | EP3C25F324I7 |
|---|---|---|---|---|---|
| Package | 324-BGA | 324-BGA | 324-BGA | 324-BGA | 324-BGA |
| Brand | Intel | Intel | Intel | Intel | Intel |
| Device Type | Field Programmable Gate Array (FPGA) | Field Programmable Gate Array (FPGA) | Field Programmable Gate Array (FPGA) | Field Programmable Gate Array (FPGA) | Field Programmable Gate Array (FPGA) |
| FPGA Family | Cyclone III | Cyclone III | Cyclone III | Cyclone III | Cyclone III |
주요 차별점
- Same-package grading choices preserve the existing 324-BGA PCB footprint (vs EP3C25F324C8N)
- Direct ordering-family alternative with the same advertised core resource class (vs EP3C25F324C7N)
- EP3C25 family options permit lifecycle and sourcing optimization without changing the BGA format (vs EP3C25F324C6N)
- Broad connector availability supports prototype and volume sourcing (vs EP3C25F324I7)
설계 노트
Do not assign the 324-BGA ballout from general Cyclone III habits alone. Use the exact EP3C25F324C7 package drawing to place power, ground, configuration, clock, and user I/O balls, and preserve the required layer transitions and ball-pad geometry. Because the supplied records confirm a 324-BGA package but provide no verified land pattern, obtain the official package drawing before releasing Gerber files or ordering a PCB assembly stencil.
Plan the complete power tree only after confirming the device's supported core, I/O, and auxiliary voltage rails from the official documentation. Separate clean logic supply routing from sensitive analog or external transceiver areas where practical, and validate the decoupling network against the manufacturer's recommendations. Do not infer rail values from the EP3C25 family name; the supplied data does not include the electrical limits needed to calculate a safe power budget.
Reserve clock inputs and configuration pins with short, topology-appropriate routes, while keeping high-speed or impedance-sensitive signals away from noisy power-regulator and switching-converter areas. Review the 215 available I/O against the actual board requirements early, since fixed power, ground, configuration, and dedicated clock balls reduce assignable user pins. Use the official pin table to check bank restrictions and voltage compatibility before committing to a connector or peripheral.
A distributor listing alone does not prove that a suffix variant is a drop-in replacement. Confirm BGA ball compatibility, voltage and I/O standards, temperature grade, speed grade, configuration method, and supported design software for every proposed alternative. Also verify that the Quartus or legacy Altera tool version supports the selected device, because a successful pin swap can still fail if the required bitstream or device database is unavailable.
Thermal design must include the EP3C25F324C7's configurable logic activity, nearby regulators, board copper, enclosure temperature, and adjacent components. The supplied data does not provide junction temperature, power dissipation, or thermal-resistance figures, so no numerical estimate can be made. Follow the official power-dissipation and thermal-design guidance, measure the assembled board under worst-case operating conditions, and preserve airflow or copper area appropriate to the final enclosure.
규정 준수 정보
The supplied search excerpts do not contain verified compliance declarations for the EP3C25F324C7. AEC-Q100 is not applicable because this is an FPGA rather than an automotive-qualified component.
