EP3C25F324C7 vs EP3C25F324I7 비교
다음의 상세 나란히 비교: EP3C25F324C7 제조: Intel 및 EP3C25F324I7 제조: Intel. 주요 사양, 전기적 파라미터, 패키징, 수명 주기 상태, 가격 및 재고를 비교하여 설계 요구 사항에 가장 적합한 부품을 결정하십시오.
사양 비교
| 파라미터 | EP3C25F324C7 | EP3C25F324I7 |
|---|---|---|
| 브랜드 | Intel | Intel |
| 카테고리 | FPGA & CPLD | FPGA & CPLD |
| 수명 주기 상태 | 활성 | NRND |
| Device Type | Field Programmable Gate Array (FPGA) | — |
| FPGA Family | Cyclone III | — |
| Logic Elements | 24,624 | — |
| Memory Bits | 608,256 bits | — |
| Number of I/O | 215 | — |
| Package Type | 324-BGA | — |
| Package Code | BGA | — |
| Number of Terminals | 324 | — |
| Package Shape | Square | — |
| Terminal Form | Ball | — |
| 실장 유형 | Surface Mount | Surface Mount |
| Operating Voltage Range | [DATA_NEEDED: operating voltage range] | — |
| Maximum Operating Frequency | [DATA_NEEDED: maximum operating frequency] | — |
| 동작 온도 범위 | [DATA_NEEDED: operating temperature range] | — |
| Internal Memory Configuration | [DATA_NEEDED: internal memory configuration] | — |
| I/O Standard | [DATA_NEEDED: supported I/O standards] | — |
| RoHS Compliance | [DATA_NEEDED: RoHS compliance] | — |
| REACH Compliance | [DATA_NEEDED: REACH compliance] | — |
| Lead-Free Status | [DATA_NEEDED: lead-free status] | — |
| Series | — | Cyclone III |
| Logic Elements (LEs) | — | 24,624 |
| Logic Array Blocks (LABs) | — | 1,539 |
| Embedded Memory | — | 608,256 bits (594 Kbits M9K blocks) |
| Embedded 18x18 Multipliers | — | 66 |
| PLLs | — | 4 |
| Global Clock Networks | — | 20 |
| Maximum User I/O | — | 215 |
| Process Technology | — | TSMC 65 nm low-power CMOS |
| Core Voltage (VCCINT) | — | 1.2 V |
| I/O Voltage (VCCIO) | — | 1.2 V to 3.3 V (per bank) |
| 동작 접합 온도 | — | -40 °C to +100 °C (industrial) |
| 패키지 | — | 324-ball FBGA (FineLine BGA), 19 x 19 mm, 1.0 mm pitch |
| Configuration Modes | — | Passive Serial (PS), Active Serial (AS), JTAG |
| RoHS 상태 | — | Compliant |