EP3C40F780I7 - 39.6K LEs Cyclone III FPGA 780-BGA | Intel
부품 번호: EP3C40F780I7 ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $78.5 | $78.50 |
| 10 | $72.1 | $721.00 |
| 100 | $64.3 | $6,430.00 |
| 500 | $57.9 | $28,950.00 |
| 1,000 | $52.4 | $52,400.00 |
EP3C40F780I7 개요
A Field-Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnect, and I/O cells that the engineer programs after manufacture, making the FPGA a re-programmable equivalent of an application-specific integrated circuit (ASIC). FPGAs sit hierarchically between general-purpose microcontrollers and hard-wired ASICs: microcontrollers run software sequentially, while FPGAs execute parallel custom logic in hardware. The Cyclone III family specifically targets cost-sensitive, high-volume applications such as industrial control, video processing, and communications line cards where the engineer needs true parallelism at a fraction of the cost and power of high-end FPGAs.
Key features of the EP3C40F780I7 include 4 PLLs for clock synthesis and skew management, support for external memory interfaces such as DDR/DDR2/QDRII SRAM, dedicated LVDS pairs for high-speed differential signaling, and a 1.2 V core voltage (VCCINT) with separate VCCIO banks for mixed-voltage I/O. The F780 package provides 780 balls on a 29x29 mm FineLine BGA substrate suitable for high-density SMT assembly.
The Cyclone III architecture is built on a low-power 65 nm process with a 1.2 V core that minimizes dynamic power; the 'I7' suffix indicates the industrial temperature range. Typical applications include motor control, video bridging, industrial Ethernet, software-defined radio (SDR), and low-cost ASIC prototyping.
When designing with this device, pay close attention to bank-based VCCIO planning, decoupling strategy for VCCINT/VCCPLL, and the JTAG configuration pinout; the Quartus II / Quartus Prime toolchain is required for synthesis and place-and-route. The 780-BGA package is large but the industrial temperature grade and abundant DSP blocks make this part well-suited to factory automation and outdoor telecom equipment.
드롭인 대체품: EP3C40F780I7 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP3C40F780I7 (동일 폼 팩터 및 풋프린트) — 차이점: Package, Process Technology, Operating Temperature, Embedded Multipliers (18x18), Speed Grade.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP3C40F780I7N
✅ 드롭인✓ 재고 있음
$92.5 / 개
데이터시트 보기 →EP3C40F780C8N
✅ 드롭인✓ 재고 있음
$64.85 / 개
데이터시트 보기 →EP3C40F780C7N
✅ 드롭인✓ 재고 있음
$145.4 / 개
데이터시트 보기 →EP3C55F780I7
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$195 / 개
데이터시트 보기 →EP3C120F780I7
✅ 드롭인✓ 재고 있음
$610 / 개
데이터시트 보기 →EP3C40F780I7 최대 정격 & 전기적 특성
| Family | Cyclone® III |
| Logic Elements (LEs) | 39,600 |
| Embedded Memory Bits | 1,161,216 bits |
| M9K Memory Blocks | 234 |
| MLAB Memory Bits | 112,500 bits |
| Embedded Multipliers (18x18) | 126 |
| 9-bit Multiplier Elements | 535 |
| PLLs | 4 |
| Maximum User I/Os | 535 |
| Maximum Operating Frequency | 472.5 MHz |
| Process Technology | 65 nm low-power CMOS |
| Core Voltage (VCCINT) | 1.2 V |
| 패키지 | 780-ball FineLine BGA (F780) |
| 동작 온도 | -40C to +100C (industrial, I7) |
| RoHS 상태 | Compliant |
| Configuration Method | JTAG / Active Serial / Passive Serial |
| Toolchain | Quartus II / Quartus Prime |
EP3C40F780I7 780-ball fineline bga (f780) 핀 구성 가이드
EP3C40F780I7(780-ball fineline bga (f780) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP3C40F780I7.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP3C40F780I7 적합 용도: 6 애플리케이션s: Industrial Motor Control, Video Bridging and Processing, Software Defined Radio (SDR) Baseband, Industrial Ethernet Switch / Protocol Bridge, ASIC Prototyping and Emulation, Factory Automation and Process Control.
Industrial Motor Control
The EP3C40F780I7's 39,600 LEs, 535 user I/Os, 4 PLLs, and 126 dedicated 18x18 hardware multipliers make it well-suited for industrial motor control. The FPGA implements field-oriented control (FOC) loops, encoder interfaces (QEP), and PWM generation in parallel hardware, achieving sub-microsecond loop times that microcontrollers cannot match. The 1.2 V core keeps dynamic power manageable while the industrial -40C to +100C temperature range tolerates factory floor environments. The 780-ball BGA provides ample I/O for multi-axis servo drives and supports LVDS pairs for high-speed encoder feedback. Pair with an external ADC such as AD7606 for current sensing and an Ethernet PHY for networked control.
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Video Bridging and Processing
The EP3C40F780I7 is widely used in video format converters, scalers, and HDMI/DVI/VGA bridge applications. Its 1,161,216 bits of embedded RAM serve as line buffers for video pipelines, while the 126 hardware multipliers accelerate scaling and color-space conversion algorithms. The 4 PLLs generate the precise pixel clocks required for 1080p60 and 4K timing, and the 535 user I/Os accommodate wide parallel video buses plus high-speed LVDS pairs for HDMI TMDS signaling. The industrial temperature grade supports outdoor digital signage and broadcast equipment. Compared to ASIC alternatives, the FPGA allows field upgrades when new video standards emerge, extending product lifetime.
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Software Defined Radio (SDR) Baseband
The EP3C40F780I7's 472.5 MHz maximum internal clock and 126 hardware multipliers enable software-defined radio baseband processing at sample rates up to ~100 MSPS. The FPGA implements digital down-conversion (DDC), FIR filters, FFT engines, and modulation/demodulation in real time, freeing the host processor for higher-layer protocol work. The 1.1 Mbit of on-chip RAM holds FFT bins and filter coefficients, while external DDR/DDR2 memory interfaces (supported by the dedicated PHY) handle streaming data. The industrial temperature grade suits outdoor SDR deployments in tactical and broadcast applications. Compared to DSP processors, the FPGA offers 5-10x better energy efficiency per MAC operation.
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Industrial Ethernet Switch / Protocol Bridge
The EP3C40F780I7 is commonly used in industrial Ethernet switches and protocol bridges (Profinet, EtherCAT, EtherNet/IP, Modbus TCP). Its 535 user I/Os and 4 PLLs support multiple Ethernet PHYs simultaneously, while 39,600 LEs implement MAC, switching fabric, and protocol stacks in parallel hardware. The dedicated 18x18 multipliers accelerate CRC calculations and QoS scheduling at wire speed. The industrial temperature range (-40C to +100C) and 1.2 V low-power core suit DIN-rail mounted industrial switches. Compared to dedicated switch ASICs, the FPGA allows custom protocol extensions and field upgrades to address evolving industrial standards.
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ASIC Prototyping and Emulation
The EP3C40F780I7 provides 39,600 LEs and abundant memory suitable for ASIC prototyping and pre-silicon verification of mid-complexity ASICs. Multiple EP3C40 devices can be paralleled on a single prototyping board to emulate multi-million-gate ASICs. The 780-ball BGA package supports 535 user I/Os, sufficient for tracing ASIC peripherals. The Quartus II / Quartus Prime toolchain offers synthesis from standard Verilog/VHDL, enabling direct reuse of ASIC RTL. Industrial temperature grade allows prototyping in lab environments where airflow is limited. Compared to high-end ASIC prototyping platforms, the EP3C40 offers much lower cost per prototype iteration.
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Factory Automation and Process Control
The EP3C40F780I7 is deployed in PLC controllers, distributed I/O hubs, and process-control equipment where its industrial -40C to +100C temperature range and high I/O count provide robust field-deployed reliability. The FPGA handles deterministic I/O scanning, sensor fusion, and HMI communication in parallel, achieving deterministic sub-100-microsecond response times required for safety-critical applications. The 1.2 V core and abundant DSP blocks enable efficient implementation of PID loops and vibration analysis algorithms directly in hardware. The 780-ball BGA supports dense multi-protocol I/O including RS-485, CAN, and industrial Ethernet. Compared to microcontroller-based PLCs, the FPGA delivers 10x faster scan times.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP3C40F780I7 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP3C40F780I7N | EP3C40F780C8N | EP3C40F780C7N | EP3C55F780I7 | EP3C120F780I7 |
|---|---|---|---|---|---|---|
| Package | 780-ball FineLine BGA (F780) | 780-ball FineLine BGA (F780) - same | 780-ball FineLine BGA (F780) - same | 780-ball FineLine BGA (F780) - same | 780-ball FineLine BGA (F780) - same | 780-ball FineLine BGA (F780) - same |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 39,600 | 39,600 | 39,600 | 39,600 | 55,856 | 119,088 |
| Embedded RAM | 1,161,216 bits | 1,161,216 bits | 1,161,216 bits | 1,161,216 bits | 2,396,211 bits | 3,981,648 bits |
| 18x18 Multipliers | 126 | 126 | 126 | 126 | 156 | 288 |
| User I/Os (max) | 535 | 535 | 535 | 535 | 377 | 531 |
| Operating Temperature | -40C to +100C (industrial) | -40C to +100C (industrial) | 0C to +85C (commercial) | 0C to +85C (commercial) | -40C to +100C (industrial) | -40C to +100C (industrial) |
| Speed Grade | I7 (industrial, slower than C8) | I7N | C8 (faster than I7) | C7 (mid speed) | I7 | I7 |
| Estimated Unit Price (qty 1) | $78.50 | $75.20 | $56.80 | $51.40 | $112.30 | $245.60 |
주요 차별점
- Highest I/O count for the EP3C40 die (vs EP3C40F484I7 (484-ball BGA variant))
- Industrial temperature range (vs EP3C40F780C8N (commercial temperature))
- Same-footprint upward density migration (vs EP3C25F780 variants)
설계 노트
The EP3C40F780I7 requires multiple supply rails: VCCINT (1.2 V core), VCCIO (1.2/1.5/1.8/2.5/3.3 V per bank), VCCPLL (1.2 V for PLL analog), and VCCA (2.5 V for PLL analog, where used). Use at least 4 bulk decoupling capacitors (100 uF tantalum or polymer) plus 0.1 uF ceramic bypass within 5 mm of each bank. VCCPLL should be filtered with a ferrite bead and 10 uF + 0.1 uF local decoupling per Cyclone III Handbook power-supply guidelines.
The 780-ball FineLine BGA uses a 1.0 mm ball pitch and is sensitive to PCB warpage during reflow. Recommended PCB stack-up: 8-12 layers with continuous GND planes directly under the BGA to provide return paths for high-speed signals. Microvia or stacked-via technology is required for inner-row balls. Via-in-pad is not recommended for Cyclone III without manufacturer approval.
Configuration mode pins (MSEL) must be correctly set before power-up or the device will not configure. JTAG pins TCK, TMS, TDI, TDO require 10 kohm pull-ups to VCCIO of the configuration bank. Programming with a non-Intel-compatible JTAG programmer can brick the device - always use the official USB-Blaster or compatible Intel/Altera programming cable. Ensure unused I/O pins are not left floating - tie to a known state via Quartus Prime settings to avoid leakage and unwanted current draw.
규정 준수 정보
RoHS compliant per Cyclone III product family datasheet. Industrial temperature grade (I7) suitable for harsh-environment deployments. Not AEC-Q100 qualified - FPGAs are typically not automotive-qualified at the silicon level.