EP3C40F780C7N - Cyclone III FPGA, 39.6K LE, 780-FBGA | Intel
부품 번호: EP3C40F780C7N ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $186.92 | $186.92 |
| 10 | $175.5 | $1,755.00 |
| 100 | $162.1 | $16,210.00 |
| 250 | $152.8 | $38,200.00 |
| 500 | $145.4 | $72,700.00 |
EP3C40F780C7N 개요
A Field-Programmable Gate Array (FPGA) is a class of programmable logic device that combines configurable logic blocks (CLBs), programmable interconnect, and dedicated hardware blocks such as RAM, DSP multipliers, PLLs, and high-speed transceivers. FPGAs sit at the apex of digital logic integration, bridging the gap between fixed-function ASICs and software-driven microcontrollers. Cyclone III specifically targets low-power, high-volume applications where designers need substantial logic density without the power and cost penalty of high-end FPGAs.
The Cyclone III family is built on a 65 nm TSMC low-power process, enabling static power as low as a few milliwatts in standby and a typical power reduction of more than 50% compared to the prior-generation Cyclone II. The 780-FBGA package supports the largest Cyclone III device with 535 user I/Os, providing ample connectivity for parallel data buses, memory interfaces, and high-speed peripherals. Embedded memory totals 1,161,216 bits (RAM bits) distributed across M9K blocks, and 126 embedded 18x18 multipliers serve DSP workloads.
The device is supported by the Altera / Intel Quartus II / Quartus Prime design suite, with free Web Edition license entry points. Designers can leverage IP cores for DDR/DDR2 memory controllers, Ethernet MACs, PCIe (soft IP), and common serial protocols. Configuration is typically via JTAG or active/passive serial flash, with built-in decompression and encryption options for secure bitstream handling.
Typical applications include industrial machine vision, factory automation controllers, video processing pipelines, motor control, test and measurement equipment, and as a glue-logic aggregator in telecom line cards. The 535 I/Os make the device attractive for high-pin-count bridging designs, including LCD/OLED display controllers and multi-port memory hubs. The combination of low power, high I/O count, and large logic capacity makes it a long-running favorite for cost-sensitive embedded platforms.
When designing with this FPGA, pay close attention to power architecture: even at modest toggle rates the 780-FBGA can draw several watts, so a multi-rail supply with proper decoupling and a thermally-aware PCB layout are essential. Use Quartus Prime PowerPlay early estimates to size your regulators and copper pours before layout, and verify signal-integrity on the high-speed LVDS pairs using IBIS models. The N-variant of the package finish is lead-free, so JEDEC J-STD-020 MSL3 handling is mandatory at assembly.
드롭인 대체품: EP3C40F780C7N — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP3C40F780C7N (동일 폼 팩터 및 풋프린트) — 차이점: Process Technology, Package, Speed Grade, Operating Temperature, Configuration Modes.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP3C40F780C6N
✅ 드롭인✓ 재고 있음
$172 / 개
데이터시트 보기 →EP3C40F780I7N
✅ 드롭인✓ 재고 있음
$92.5 / 개
데이터시트 보기 →EP3C40F780C8N
✅ 드롭인✓ 재고 있음
$64.85 / 개
데이터시트 보기 →EP3C40F780C7
✅ 드롭인✓ 재고 있음
$139.5 / 개
데이터시트 보기 →EP3C120F780C7N
✅ 드롭인✓ 재고 있음
$162 / 개
데이터시트 보기 →EP4CE40F780C7N
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
EP3C40F780C7N 최대 정격 & 전기적 특성
| Family | Cyclone III |
| Logic Elements | 39,600 LE |
| Total RAM Bits | 1,161,216 bits |
| Embedded Multipliers | 126 (18x18) |
| User I/Os | 535 |
| 패키지 | 780-ball FBGA (FineLine BGA) |
| Speed Grade | 7 (C7, commercial) |
| Process Node | 65 nm TSMC low-power |
| 동작 온도 | 0C to +85C (commercial) |
| Supply Voltage (Core) | 1.2 V |
| Configuration Method | JTAG, Active Serial, Passive Serial |
| PLLs | 4 |
| Global Clock Networks | 20 |
| Lead-Free / RoHS | Yes (N suffix) |
| Moisture Sensitivity Level | MSL3 (per J-STD-020) |
EP3C40F780C7N 780-ball fbga (fineline bga) 핀 구성 가이드
EP3C40F780C7N(780-ball fbga (fineline bga) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP3C40F780C7N.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP3C40F780C7N 적합 용도: 6 애플리케이션s: Industrial Machine Vision, Factory Automation Controllers, Video Processing and Display Bridging, Test and Measurement Equipment, Motor Control and Power Conversion, Telecom Line-Card Glue Logic.
Industrial Machine Vision
The EP3C40F780C7N fits machine-vision pipelines because its 39,600 logic elements and 126 embedded 18x18 hardware multipliers sustain multi-channel Bayer-to-RGB conversion, Sobel edge detection, and object detection in real time without a host processor. The 535 user I/Os in the 780-FBGA let the FPGA drive a Camera Link or MIPI CSI-2 sensor array alongside a high-pin-count LCD preview panel, while the 1,161,216 bits of M9K RAM act as line buffers for image stacking. Designers typically pair it with an external DDR2 SDRAM controller IP and use one of the 4 PLLs to deskew the 74.25 MHz / 148.5 MHz video reference clocks. Estimated mid-design power for a dual-camera 1080p pipeline is 1.5-2.5 W, which the FBGA thermal pad can dissipate with a 4-layer board.
추천
Factory Automation Controllers
The EP3C40F780C7N is widely used in PLC backplanes and protocol-bridging I/O concentrators because the 535 I/Os handle EtherCAT, PROFINET, and parallel field-bus interfaces simultaneously. The 4 on-chip PLLs and 20 global clocks cleanly distribute deterministic timing for real-time Ethernet MACs implemented in soft logic, while the 1.1 Mbit of embedded RAM is sufficient for mailbox queues and motion-control trajectory buffers. The C7 speed grade is adequate for the 100 Mbit Ethernet and 12.5 MHz PROFINET IRT data rates typical in line-replaceable modules. Designers using this FPGA in a 24V industrial environment should follow the IEC 61131-2 ESD and surge guidance on top of the standard FPGA decoupling scheme.
추천
Video Processing and Display Bridging
The Cyclone III EP3C40F780C7N serves as a video-format converter between HDMI, LVDS, and RGB panels because its 126 dedicated multipliers accelerate chroma resampling and deinterlacing, and the 1,161,216 bits of embedded memory hold several full video lines for temporal filtering. The 535 user I/Os support 24-bit RGB plus separate LVDS data and clock pairs for a 1080p60 panel with headroom for control I2C, SPI, and backlight PWM. Designers typically use the device's PLL to multiply a 27 MHz input reference into the 148.5 MHz pixel clock with sub-pixel jitter. Power consumption for a 1080p60 scaler is in the 1-2 W range, manageable on a 4-layer PCB with a continuous thermal pad under the FBGA.
추천
Test and Measurement Equipment
The EP3C40F780C7N anchors mid-range digital-storage oscilloscopes and protocol analyzers because the 39,600 logic elements run acquisition state machines, trigger sequencers, and on-screen display generators in parallel, while the 1.1 Mbit of embedded RAM acts as a circular pre-trigger buffer. The 535 I/Os accept high-channel-count logic-analyzer probes and arbitrary waveform generator outputs simultaneously. Its 4 PLLs produce the 1-2 GHz equivalent time-base clocks from a low-jitter 10 MHz TCXO reference. The 65 nm low-power process keeps chassis temperature low even with the FPGA fully populated, which simplifies the calibration procedure for sensitive analog front-ends downstream.
추천
Motor Control and Power Conversion
The EP3C40F780C7N executes field-oriented control (FOC) loops for multi-axis servo drives because the 126 hardware multipliers deliver the 32 kHz to 64 kHz PWM math, and the 39,600 logic elements hold the encoder-decoder, resolver-to-digital conversion, and CANopen/EtherCAT slave logic concurrently. The 535 I/Os support up to 6 three-phase inverter bridges plus resolver excitation, with the 4 PLLs phase-locking to encoder index pulses for sub-microsecond commutation. Designers typically pair the FPGA with external gate drivers and use one PLL per motor axis to keep the PWM frequencies phase-accurate. The C7 speed grade is more than adequate for the 100-200 kHz control-loop bandwidth typical in mid-power servos.
추천
Telecom Line-Card Glue Logic
Telecom line cards use the EP3C40F780C7N as a backplane aggregator because the 535 I/Os interface to multiple SFP/SFP+ cages, TDM backplanes, and control plane CPUs, while the 39,600 logic elements implement custom framing, encryption accelerators, and watchdog housekeeping. The 1.1 Mbit of embedded RAM buffers packet descriptors, and the 4 PLLs lock to multiple backplane clock domains simultaneously with sub-100 ps jitter. The 780-FBGA's thermal envelope allows the part to operate in fully-populated central-office racks where ambient air can reach 55C. Designers typically hold the FPGA in reset until the core 1.2 V rail and the 2.5 V/3.3 V auxiliary rails are within regulation, and use CRC-protected configuration bitstreams for field-recoverable firmware updates.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP3C40F780C7N — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP3C40F780C6N | EP3C40F780I7N | EP3C40F780C8N | EP3C40F780C7 | EP3C120F780C7N |
|---|---|---|---|---|---|---|
| Package | 780-ball FBGA | 780-ball FBGA | 780-ball FBGA | 780-ball FBGA | 780-ball FBGA | 780-ball FBGA |
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 39,600 LE | 39,600 LE | 39,600 LE | 39,600 LE | 39,600 LE | 119,088 LE |
| Total RAM Bits | 1,161,216 bits | 1,161,216 bits | 1,161,216 bits | 1,161,216 bits | 1,161,216 bits | 3,888,000 bits |
| Embedded Multipliers (18x18) | 126 | 126 | 126 | 126 | 126 | 288 |
| User I/Os | 535 | 535 | 535 | 535 | 535 | 531 |
| Speed Grade | C7 (commercial) | C6 (faster) | I7 (industrial) | C8 (slower) | C7 (commercial, lead-based) | C7 (commercial) |
| Operating Temperature | 0C to +85C | 0C to +85C | -40C to +100C | 0C to +85C | 0C to +85C | 0C to +85C |
| Lead-Free / RoHS | Yes (N suffix) | Yes | Yes | Yes | No (leaded) | Yes |
주요 차별점
- Lower-cost leaded finish option available in same 780-FBGA (vs EP3C40F780C7)
- Industrial temperature variant for harsh environments (vs EP3C40F780I7N)
- Higher-density 780-FBGA sibling for upward migration (vs EP3C120F780C7N)
설계 노트
Estimated: At a typical utilization of 60% LE and a 100 MHz internal clock, the EP3C40F780C7N draws approximately 1.5-2.5 W from the 1.2 V VCCINT rail and an additional 0.5-1 W from the 2.5 V/3.3 V VCCIO rails. Use Intel's PowerPlay early estimator in Quartus Prime for a project-specific projection, then size the VCCINT regulator for at least 3 A continuous. Decouple each VCCINT pin with a 0.1 uF X7R plus a 10 uF bulk, placed within 100 mil of the pin. Power-rail sequencing should follow the VCCIO-before-VCCINT or simultaneous-ramp rule per the Cyclone III handbook to avoid I/O latch-up during hot-plug events.
The 780-FBGA exposes a central thermal pad that must be soldered to a continuous ground plane on the top layer of the PCB for heat spreading. Per the Cyclone III packaging thermal model, a 4-layer board with 1 oz copper and adequate via farm under the thermal pad keeps the junction-to-ambient theta_JA around 15-20 C/W. Without the thermal pad soldered, junction temperature can exceed 100C in a fully utilized design. Use a thermal camera or on-die diode measurement during validation to confirm the design margin.
The 780-FBGA has a 1.0 mm ball pitch, which requires laser-drilled microvias or 4-mil trace-and-space capability for breakout routing. Escape the top two rows of balls with microvia-in-pad to internal layers, fan the third and fourth rows with dog-bone fanouts, and keep high-speed LVDS pairs length-matched to within 50 mil. Place configuration flash and clock sources within 1 inch of the FPGA to minimize JTAG and AS configuration signal integrity issues. Per JEDEC J-STD-020, the MSL3 rating requires dry-bag storage and a 30-day floor-life after opening before bake-out.
Estimated: The most common EP3C40F780C7N design error is leaving the dual-purpose configuration pins (nCONFIG, nSTATUS, CONF_DONE) floating during board bring-up; they must be pulled up to VCCIO with 10 kohm resistors. Another frequent mistake is using the wrong I/O standard for the MSEL pins, which selects the configuration mode. Per Intel Cyclone III configuration handbook, MSEL[3:0] must match the chosen configuration scheme (AS, PS, JTAG, or Fast AS) and be tied to GND or VCCIO with no resistors in series.
규정 준수 정보
RoHS-compliant per the 'N' suffix in the part number and Intel Cyclone III material declaration. AEC-Q100 is not applicable because this is a commercial/industrial-grade FPGA. Halogen-free status not stated in the public datasheet - confirm with Intel for the specific date code if required.