EP3C25F256I7N - Cyclone III FPGA 24,624 LEs | 256-FBGA | Intel
부품 번호: EP3C25F256I7N ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $42.5 | $42.50 |
| 10 | $38.25 | $382.50 |
| 100 | $34 | $3,400.00 |
| 500 | $30.6 | $15,300.00 |
| 1,000 | $27.2 | $27,200.00 |
EP3C25F256I7N 개요
An FPGA (Field-Programmable Gate Array) is a class of programmable logic device (PLD) that combines the integration density of an ASIC with the design flexibility of in-system reconfiguration. FPGAs sit hierarchically under programmable logic, alongside CPLDs, and are widely used as the central logic platform in digital systems where high I/O count, parallel DSP performance, or rapid prototyping are required. The Cyclone III family was specifically engineered to deliver ASIC-class functionality at ASIC-like cost, targeting volume production in cost-sensitive applications.
Key features of the EP3C25F256I7N include support for up to four general-purpose PLLs for clock management, 66 dedicated 18x18 multipliers for DSP acceleration, support for DDR/DDR2/QDRII/QDRII+ external memory interfaces, and hot-socketing capability that allows board-level in-system programming. The 256-FBGA package supports high-density board layouts while remaining surface-mountable with standard reflow profiles. The device is offered in the industrial temperature grade (-40C to +125C) and is lead-free / RoHS compliant per the F suffix and 7N ordering code convention.
Architecturally, the EP3C25F256I7N uses a look-up-table (LUT)-based logic fabric combined with block RAM (M4K/M9K) tiles, multiplier blocks, and global/regional clock networks. The 65 nm process and 1.2 V core voltage deliver static and dynamic power consumption suitable for thermally-constrained embedded systems, while maintaining ample logic density for medium-complexity designs such as motor control, video bridging, industrial protocol conversion, and software-defined radio front-ends.
Typical applications include industrial motor drives and PLCs, video surveillance and image processing, automotive infotainment and driver-assistance subsystems, telecommunication line cards, low-cost software-defined radio, and portable medical instrumentation. The 256-FBGA footprint makes the EP3C25F256I7N particularly well suited to mid-density logic replacement designs where migrating from an older Cyclone II or Spartan-3 generation device is required.
When designing with this part, verify the Quartus II design software support level for the EP3C25F256I7N speed grade 7 (faster commercial, industrial temperature). Pay close attention to the 1.2 V core / 2.5 V/3.3 V auxiliary supply sequencing requirement and the multi-voltage I/O bank configuration when mixing LVTTL, LVCMOS, and SSTL signalling. Decoupling follows the Quartus II Cyclone III handbook reference design: 0.1 uF and 0.01 uF ceramic capacitors within 100 mils of every VCC pin.
This page synthesizes distributor stock, drop-in same-package alternatives from the Cyclone III family, and Quartus II design considerations not found in the standalone datasheet.
드롭인 대체품: EP3C25F256I7N — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP3C25F256I7N (동일 폼 팩터 및 풋프린트) — 차이점: Package, Process Technology, Operating Temperature, RoHS Status, Configuration Modes.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP3C25F256I7
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
EP3C25F256A7N
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
EP3C25F256C7N
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
EP3C25F256C8N
✅ 드롭인✓ 재고 있음
$38.95 / 개
데이터시트 보기 →EP3C25F256I8N
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
EP3C25F256I7N 최대 정격 & 전기적 특성
| Device Type | FPGA |
| Family | Cyclone III |
| Logic Elements | 24,624 |
| Embedded Memory | 608,256 bits |
| Embedded Multipliers | 66 (18x18) |
| Maximum User I/O | 156 |
| Core Supply Voltage | 1.2 V |
| 패키지 | 256-FBGA (FineLine BGA) |
| 동작 온도 | -40C to +125C |
| Speed Grade | 7 |
| Process Technology | 65 nm low-power |
| PLLs | 4 general-purpose PLLs |
| External Memory Support | DDR/DDR2/QDRII/QDRII+ |
| 실장 유형 | Surface Mount |
| RoHS 상태 | Compliant (lead-free) |
| Hot Socketing | Supported |
| Configuration | SRAM-based, in-system programmable |
EP3C25F256I7N 256-fbga (fineline bga) 핀 구성 가이드
EP3C25F256I7N(256-fbga (fineline bga) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP3C25F256I7N.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP3C25F256I7N 적합 용도: 6 애플리케이션s: Industrial Motor Control, Video Surveillance and Image Processing, Software-Defined Radio Front-End, Telecommunication Line Cards, Portable Medical Instrumentation, Automotive Infotainment and Driver Assistance.
Industrial Motor Control
The EP3C25F256I7N fits industrial motor control because its 66 embedded 18x18 multipliers and 24,624 logic elements can implement field-oriented control (FOC) and space-vector PWM for multi-axis drives in a single device. The 1.2 V core and 65 nm process keep dynamic power low in cabinet-mounted controllers, while the -40C to +125C industrial rating supports harsh factory floors. In a typical topology, the FPGA receives encoder feedback and current-sense ADC data, computes the Park/Clarke transforms, and drives gate signals to the inverter IGBTs. Unlike a fixed-function MCU, the FPGA allows deterministic sub-microsecond control loops and parallel handling of multiple axes, but it requires external ADC and gate-driver front-ends and careful clock-domain management.
추천
Video Surveillance and Image Processing
The EP3C25F256I7N suits video surveillance and image processing because its 608,256 bits of embedded RAM and 66 multipliers support real-time pixel pipelines, scaling, and edge detection at HD resolutions. The 156 user I/O pins allow direct interfacing to CMOS image sensors and DDR2 frame buffers, while the four PLLs generate the multiple clock domains needed for pixel, line, and memory clocks. In a typical design, the FPGA captures sensor data, performs Bayer demosaic and gamma correction in hardware, and streams compressed frames to a host processor. The trade-off versus an ASIC or SoC is higher static power and unit cost, but the FPGA offers field-upgradable image pipelines and faster time-to-market for evolving surveillance algorithms.
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Software-Defined Radio Front-End
The EP3C25F256I7N is used in low-cost software-defined radio front-ends because its 66 embedded 18x18 multipliers deliver the DSP throughput needed for digital down-conversion, FIR filtering, and decimation, while the 24,624 logic elements implement control and interface logic. The 1.2 V core keeps power manageable in portable SDR platforms, and the 156 user I/O pins can connect to high-speed ADCs and DACs. In a typical topology, the FPGA mixes the digitized IF to baseband, applies channelization filters, and forwards I/Q samples to a host over USB or Ethernet. The trade-off versus a dedicated DSP is design complexity, but the FPGA provides parallel channel processing and reconfigurable modulation schemes not possible with fixed-function silicon.
추천
Telecommunication Line Cards
The EP3C25F256I7N fits telecommunication line cards because its 156 user I/O and support for DDR/DDR2/QDRII memory interfaces enable packet buffering, framing, and protocol conversion at line rate. The 24,624 logic elements can implement multiple HDLC or Ethernet MAC channels in parallel, while the four PLLs recover and generate the line-card clock domains. In a typical design, the FPGA terminates the backplane interface, performs queue management, and forwards traffic to the switch fabric. The trade-off versus a dedicated network processor is higher development effort, but the FPGA offers protocol flexibility and field upgrades that fixed ASSPs cannot match, making it attractive for multi-service access platforms.
추천
Portable Medical Instrumentation
The EP3C25F256I7N is well suited to portable medical instrumentation because its 1.2 V core and 65 nm low-power process extend battery life, while the 24,624 logic elements and 66 multipliers handle real-time signal processing for ECG, ultrasound, or patient-monitoring front-ends. The 156 user I/O pins interface to ADCs, displays, and wireless modules, and the industrial temperature range supports clinical environments. In a typical design, the FPGA filters and decimates biosensor data, detects arrhythmia events, and drives a local display. The trade-off versus a medical-grade ASIC is higher power and cost, but the FPGA enables rapid algorithm iteration and regulatory re-certification through firmware updates rather than silicon respins.
추천
Automotive Infotainment and Driver Assistance
The EP3C25F256I7N supports automotive infotainment and driver-assistance subsystems because its 24,624 logic elements and 66 multipliers can implement video scaling, graphics overlay, and sensor fusion for camera-based ADAS. The 156 user I/O pins connect to LVDS cameras and display panels, and the 256-FBGA package withstands automotive thermal cycling. In a typical design, the FPGA aggregates multiple camera streams, performs distortion correction, and overlays lane-departure warnings onto the display output. The trade-off versus an automotive SoC is higher board area and power, but the FPGA provides deterministic latency and parallel processing that general-purpose SoCs struggle to guarantee, which is critical for safety-related vision pipelines.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP3C25F256I7N — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP3C25F256I7 | EP3C25F256A7N | EP3C25F256C7N | EP3C25F256C8N | EP3C25F256I8N |
|---|---|---|---|---|---|---|
| Package | 256-FBGA | 256-FBGA - same | 256-FBGA - same | 256-FBGA - same | 256-FBGA - same | 256-FBGA - same |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 24,624 | 24,624 | 24,624 | 24,624 | 24,624 | 24,624 |
| Embedded Memory | 608,256 bits | 608,256 bits | 608,256 bits | 608,256 bits | 608,256 bits | 608,256 bits |
| Maximum User I/O | 156 | 156 | 156 | 156 | 156 | 156 |
| Core Supply Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
| Operating Temperature | -40C to +125C | -40C to +125C | -40C to +125C (automotive) | 0C to +85C | 0C to +85C | -40C to +125C |
| Speed Grade | 7 | 7 | 7 | 7 | 8 | 8 |
| Lead-Free / RoHS | Yes (N suffix) | No | Yes | Yes | Yes | Yes |
| Automotive Qualification | No | No | Yes (AEC-Q100) | No | No | No |
주요 차별점
- Lead-free RoHS-compliant construction (vs EP3C25F256I7)
- Industrial temperature range (vs EP3C25F256C7N)
- Speed grade 7 timing performance (vs EP3C25F256I8N)
- Non-automotive cost advantage (vs EP3C25F256A7N)
설계 노트
The EP3C25F256I7N requires a 1.2 V core supply plus 2.5 V and/or 3.3 V I/O bank supplies. Follow the Cyclone III power-up sequencing requirement: core (1.2 V) should ramp before or simultaneously with I/O supplies to avoid excessive current draw. Use a dedicated low-noise regulator for the 1.2 V rail and place 0.1 uF and 0.01 uF ceramic decoupling capacitors within 100 mils of every VCC pin, per the Quartus II Cyclone III handbook reference design.
The 256-FBGA package requires a carefully designed land pattern with via-in-pad or dog-bone fanout. Use at least a 6-layer PCB with dedicated power and ground planes to control impedance on the DDR/DDR2 memory interface traces. Keep high-speed differential pairs length-matched within 5 mils and route them over an uninterrupted ground plane. Thermal relief is not required for this low-power device, but adequate copper pour under the package helps distribute heat.
A common pitfall is using an unsupported Quartus II version for the EP3C25F256I7N. Cyclone III devices are supported in Quartus II versions up to 13.1; newer Quartus Prime releases dropped Cyclone III support. Verify your toolchain before starting a design. Also confirm the configuration scheme (active serial, passive serial, or JTAG) and that the configuration flash device is compatible with the 1.2 V core and 2.5 V/3.3 V configuration I/O.
규정 준수 정보
The 'N' suffix in EP3C25F256I7N indicates lead-free, RoHS-compliant construction. AEC-Q100 qualification is not applicable to this industrial-grade part; choose EP3C25F256A7N for automotive qualification.
