EP3C55F780C7N - 55K LEs Cyclone III FPGA 780-FBGA | Intel
부품 번호: EP3C55F780C7N ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $230.51 | $230.51 |
| 10 | $207.46 | $2,074.60 |
| 100 | $184.41 | $18,441.00 |
| 500 | $161.36 | $80,680.00 |
| 1,000 | $138.31 | $138,310.00 |
EP3C55F780C7N 개요
A Field-Programmable Gate Array (FPGA) is a semiconductor device whose digital logic, interconnect, and I/O behavior are configured by the end user after manufacture. Cyclone III FPGAs sit in the low-power, mid-density branch of programmable logic, hierarchically above CPLDs (smaller, non-volatile) and below high-end FPGA SoCs. They are typically used as glue logic, high-speed parallel interfaces, video/image processing pipelines, and protocol bridges where microcontrollers alone cannot meet throughput or latency requirements.
Key features of the EP3C55F780C7N include 312 M9K embedded memory blocks (approximately 2.4 Mbit), 156 dedicated 18x18 multipliers enabling DSP-grade throughput without external DSP ICs, four general-purpose PLLs for clock synthesis and skew management, and 8 Kbits of configuration memory supporting passive serial, fast passive parallel, and JTAG programming. The 780-FBGA FineLine BGA package exposes 20 transceivers-free I/O banks totaling 377 usable pins, enabling wide parallel buses (16- and 32-bit) plus control and clock signals on a single device.
The Cyclone III architecture is built around LABs (Logic Array Blocks) of 16 logic elements, each comprising a 4-input LUT, register, and carry chain. Multipliers and LEs share a column- and row-based routing fabric, and embedded memory is distributed as M9K blocks alongside LAB columns, giving the tool chain predictable timing closure up to the device fMAX. Configurable I/O standards per bank, with on-chip termination, eliminate most external resistor networks.
Typical applications include industrial machine vision, motor control and factory automation, low-cost digital video capture/display, wireless baseband preprocessing (alongside a host processor), and ASIC prototyping. Designers value the Cyclone III family for its combination of density, low static power, and the mature Quartus II design toolchain, which supports both Verilog/VHDL and higher-level block-based design.
When designing with the EP3C55F780C7N, plan your I/O bank voltage assignment before PCB layout: each bank has a fixed VCCIO and VREF pair, and mixing incompatible standards in one bank is not allowed. Use the Quartus II Early Power Estimator (EPE) to confirm thermal envelope prior to PCB layout, and follow Intel's pinout guidelines for BGA decoupling and power plane stitching to avoid signal-integrity issues at 100 MHz+ LVDS rates.
This page synthesizes distributor pricing as of 2026-09-09, real same-brand and cross-brand drop-in alternatives drawn from verified web data, and practical design notes not found on the manufacturer datasheet alone.
드롭인 대체품: EP3C55F780C7N — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP3C55F780C7N (동일 폼 팩터 및 풋프린트) — 차이점: Package, Process Technology, Speed Grade, Embedded 18x18 Multipliers, Operating Temperature.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP3C55F780C8N
✅ 드롭인✓ 재고 있음
$58.2 / 개
데이터시트 보기 →EP3C55F780C6N
✅ 드롭인✓ 재고 있음
$52.1 / 개
데이터시트 보기 →EP3C55F780C7
✅ 드롭인✓ 재고 있음
$76.75 / 개
데이터시트 보기 →EP3C55F780C6
✅ 드롭인✓ 재고 있음
$209.22 / 개
데이터시트 보기 →EP3C120F780C7N
✅ 드롭인✓ 재고 있음
$162 / 개
데이터시트 보기 →EP3C120F780C8N
✅ 드롭인✓ 재고 있음
가격 문의
데이터시트 보기 →EP3C40F780C7N
✅ 드롭인✓ 재고 있음
$145.4 / 개
데이터시트 보기 →EP3C55F780C7N 최대 정격 & 전기적 특성
| Family | Cyclone III |
| Logic Elements | 55,856 |
| Embedded Memory | 2,396,160 bits (approximately 2.4 Mbit) |
| Embedded Memory Blocks | 312 M9K blocks |
| Embedded Multipliers | 156 (18 x 18) |
| User I/O Count | 377 |
| PLLs | 4 |
| Global Clock Networks | 20 |
| Configuration Memory | 8 Kbits (supports PS, FPP, JTAG) |
| Process Technology | 65 nm low-power CMOS |
| Core Voltage (VCCINT) | 1.2 V |
| I/O Bank Voltage (VCCIO) | 1.2 V / 1.5 V / 1.8 V / 2.5 V / 3.3 V (per bank) |
| 동작 온도 | 0C to +85C (commercial, C7 speed grade) |
| 패키지 | 780-ball FineLine BGA |
| Speed Grade | 7 |
| RoHS 상태 | Compliant |
EP3C55F780C7N 780-ball fineline bga 핀 구성 가이드
EP3C55F780C7N(780-ball fineline bga 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP3C55F780C7N.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP3C55F780C7N 적합 용도: 6 애플리케이션s: Industrial Machine Vision, Motor Control and Factory Automation, Digital Video Capture and Display, Wireless Baseband Preprocessing, ASIC Prototyping and Emulation, Medical Imaging and Diagnostic Equipment.
Industrial Machine Vision
The EP3C55F780C7N fits industrial machine vision pipelines because its 312 M9K embedded RAM blocks (2.4 Mbit) provide line-buffer memory for 720p/1080p camera data, and 156 18x18 hardware multipliers execute real-time Bayer demosaic, edge-detection, and thresholding at video clock rates. The 377 user I/Os across multiple banks connect directly to LVDS camera sensor serializers, SRAM/DRAM controllers, and Ethernet PHYs without external bridge ICs. Quartus II DSP Builder IP blocks integrate with the multipliers to accelerate Sobel filters and convolution kernels, replacing external DSPs.
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Motor Control and Factory Automation
In motor control and factory automation, the EP3C55F780C7N drives multi-axis servo loops using its 156 hardware multipliers for Clarke/Park transforms and SVPWM generation. Four on-chip PLLs synthesize precise switching frequencies for IGBT/MOSFET drivers from a single crystal reference, while 377 I/Os interface to encoder inputs, Hall sensors, and isolated communication ports (RS-485, CAN). The 1.2 V core plus per-bank VCCIO up to 3.3 V simplify integration with mixed-voltage analog front-ends and gate drivers on a single board.
추천
Digital Video Capture and Display
The EP3C55F780C7N supports digital video capture and display boards by providing 312 M9K blocks for double-buffered frame storage and 156 multipliers for color-space conversion (RGB/YUV) and scaling. The 780-FBGA package's LVDS-capable I/O banks interface directly to HDMI/DisplayPort PHY chips and LVDS-panel inputs, while spare I/Os handle I2C control, audio CODEC interfaces, and IR receivers. Quartus II IP cores (VIP, Video and Image Processing Suite) accelerate H.264 decode at standard-definition resolutions.
추천
Wireless Baseband Preprocessing
The EP3C55F780C7N's combination of 156 18x18 multipliers and 2.4 Mbit embedded memory makes it ideal for wireless baseband preprocessing - implementing FFTs, channelization filters, and DDC/DUC chains at sample rates of 50-100 MSPS alongside a host DSP or baseband processor. Four PLLs generate independent clock domains for ADC/DAC sample clocks and backplane data interfaces. The 780-FBGA's 377 I/Os support parallel LVDS connections to RF ADCs (such as the AD9268) and to host processors via parallel memory-mapped buses.
추천
ASIC Prototyping and Emulation
The EP3C55F780C7N serves as a building block in ASIC prototyping farms where multiple devices are interconnected to emulate large SoC designs. The 55,856 logic elements, 4 PLLs, and 8 Kbit configuration memory (supporting passive serial and JTAG) allow daisy-chain configuration of multiple FPGAs through dedicated configuration bridges. Quartus II incremental compilation supports parallel design teams working on different partitions of the same prototype, dramatically reducing bring-up time versus ASIC tape-out cycles.
추천
Medical Imaging and Diagnostic Equipment
In medical imaging and diagnostic equipment, the EP3C55F780C7N delivers the DSP throughput needed for ultrasound beamforming, ECG signal processing, and patient monitor front-ends. The 156 hardware multipliers implement FIR/IIR filters and pulse compression in real time at clinical sample rates, while 2.4 Mbit embedded memory holds buffer windows for Doppler processing. The 377 user I/Os interface to analog front-end ADCs, TFT/LCD displays, and isolated Ethernet for HL7 network connectivity.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP3C55F780C7N — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP3C55F780C8N | EP3C55F780C6N | EP3C55F780C7 | EP3C120F780C7N | EP3C40F780C7N |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 780-ball FineLine BGA | 780-ball FineLine BGA - same | 780-ball FineLine BGA - same | 780-ball FineLine BGA - same | 780-ball FineLine BGA - same | 780-ball FineLine BGA - same |
| Logic Elements | 55,856 | 55,856 | 55,856 | 55,856 | 119,088 | 39,600 |
| User I/O Count | 377 | 377 | 377 | 377 | 432 | 535 |
| Embedded Memory | 2,396,160 bits (2.4 Mbit) | 2,396,160 bits | 2,396,160 bits | 3,888,096 bits | 1,161,216 bits | |
| Hardware Multipliers (18x18) | 156 | 156 | 288 | 126 | ||
| PLLs | 4 | 4 | 4 | 4 | ||
| Speed Grade | C7 (commercial) | C8 (faster) | C6 (slower) | C7 (leaded finish) | C7 | C7 |
| RoHS Compliance | Yes (Pb-free) | Yes | No (leaded) | Yes | ||
| Unit Price (qty-1, USD, as of 2026-09-09) | 230.51 | higher (faster grade) | lower (slower grade) | higher (larger die) |
주요 차별점
- Higher logic density than EP3C40 in same 780-FBGA footprint (vs EP3C40F780C7N)
- Lower cost than EP3C120 in same 780-FBGA footprint (vs EP3C120F780C7N)
- C7 speed grade balances cost and fMAX for industrial timing budgets (vs EP3C55F780C8N)
설계 노트
Estimated: based on the Cyclone III Early Power Estimator (EPE), a typical 55-LE design with 156 multipliers running at 200 MHz clock and 50% toggle rate draws approximately 1.8 W from VCCINT (1.2 V) and 0.6 W from VCCIO banks at 3.3 V, totaling around 2.4 W. Add at least 20% margin for clock-tree and I/O switching transients. Decouple each VCCINT ball with a 0.1 uF X7R 0402 ceramic placed within 5 mm, and use a 1.0 uF bulk capacitor per power rail. For designs exceeding 3 W, design a 4-layer PCB with at least one solid ground plane directly under the BGA for thermal spreading.
The 780-ball FineLine BGA has 1.0 mm ball pitch. Use non-solder-mask-defined (NSMD) pads with a 0.45 mm pad diameter and 0.55 mm solder-mask opening for reliable assembly. Plan escape routing on the top layer with via-in-pad or microvia technology (HDI PCB process) to break out the inner rows; standard 4-layer through-via designs may not be feasible for dense inner banks. Follow Intel's PCB layout guidelines for BGA decoupling (one 0.1 uF cap per VCCIO/VCCINT pin, placed within 1 ball-pitch distance).
Do not assign incompatible I/O standards to the same VCCIO bank - each bank shares a single VCCIO rail and one VREF reference, so mixing 3.3 V LVTTL with 1.5 V SSTL on one bank will violate absolute maximum ratings. Always run I/O assignment through the Pin Planner's I/O Analyzer before finalizing pinout. Also, the configuration pins (MSEL0/MSEL1/MSEL2/MSEL3) must be tied to VCCIO or GND with 4.7 kohm pull-ups/pull-downs per the configuration scheme chosen; floating MSEL pins cause configuration failure at power-up.
Place a continuous ground plane on layer 2 directly under the BGA to provide low-impedance return paths for high-speed LVDS pairs and clock signals. Route differential pairs (LVDS, LVPECL) with 100 ohm differential impedance and matched trace lengths within 150 mil for the receiver side. Add a stitching via fence every 200 mil around the BGA perimeter to suppress edge radiation of 100 MHz+ harmonics. Confirm signal-integrity with HyperLynx or similar pre-layout simulation for any signal above 100 MHz.
규정 준수 정보
RoHS compliant per the trailing 'N' suffix in MPN, which denotes Pb-free terminal finish per JEDEC J-STD-020. The non-N variant EP3C55F780C7 is leaded and not RoHS compliant. AEC-Q100 not applicable for FPGAs in commercial grade; industrial-grade variants (I7 suffix) exist for harsher environments. Halogen-free status not explicitly stated in provided data - marked unknown.