EP3C55U484C6 - Cyclone III FPGA 55K LE 484-FBGA | Intel/Altera
부품 번호: EP3C55U484C6 ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $175.89 | $175.89 |
| 10 | $158.3 | $1,583.00 |
| 100 | $132 | $13,200.00 |
| 500 | $115.5 | $57,750.00 |
| 1,000 | $102.4 | $102,400.00 |
EP3C55U484C6 개요
A Field Programmable Gate Array (FPGA) is a reprogrammable semiconductor device built from an array of configurable logic blocks (CLBs), programmable interconnect, and dedicated hard-IP blocks such as multipliers, memory, and transceivers. Within the broader taxonomy, the Cyclone III family belongs to low-cost, low-power SRAM-based FPGAs that sit between discrete microcontrollers and high-end DSP or ASIC solutions, providing hardware-level parallelism for digital signal processing, glue logic, and bus interfacing tasks.
Key features of the EP3C55U484C6 include 55,856 logic elements, 2,396,160 bits of embedded RAM (approximately 234 Kbits of M9K blocks plus 65 Kbits of M144K blocks), and 156 18x18 hardware multipliers for DSP workloads. The device supports up to 4 PLLs for clock management, 327 maximum user I/O pins, and operates from a 1.15 V to 1.25 V core supply with 0°C to +70°C commercial temperature range. The C6 speed grade corresponds to a commercial temperature rating and a specific Fmax tier for the internal logic.
Architecturally, Cyclone III FPGAs use a logic-element fabric of 4-input look-up tables (LUTs), configurable as distributed RAM or shift registers, paired with dedicated routing and embedded hard IP. The 65 nm process gives the family its signature low static and dynamic power characteristics, making it suitable for thermally constrained or battery-powered products where competing 90 nm FPGAs could not be deployed.
Typical applications include industrial motor control, video surveillance processing, automotive infotainment prototypes, telecom line cards, and portable medical instrumentation. The combination of moderate logic density, abundant multipliers, and a fine-pitch 484-ball BGA makes it attractive for designs that need hardware acceleration but want to stay inside a low-power budget.
When designing with this FPGA, plan the power distribution network carefully - the core requires 1.15 V to 1.25 V, while I/O banks can be configured to 1.2 V, 1.5 V, 1.8 V, 2.5 V, 3.0 V, or 3.3 V. The 484-FBGA package demands a 4 or 6-layer PCB with microvia technology for reliable assembly.
드롭인 대체품: EP3C55U484C6 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP3C55U484C6 (동일 폼 팩터 및 풋프린트) — 차이점: Package, Process Technology, Operating Temperature, Speed Grade, Logic Elements.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP3C55U484C6N
✅ 드롭인✓ 재고 있음
$274.0589 / 개
데이터시트 보기 →EP3C55U484C7N
✅ 드롭인✓ 재고 있음
$140.25 / 개
데이터시트 보기 →EP3C55U484C8N
✅ 드롭인✓ 재고 있음
$119.85 / 개
데이터시트 보기 →EP3C40U484C6
✅ 드롭인✓ 재고 있음
$105 / 개
데이터시트 보기 →EP3C55U484I7
✅ 드롭인✓ 재고 있음
$195 / 개
데이터시트 보기 →EP3C55U484C6 최대 정격 & 전기적 특성
| Family | Cyclone III |
| Logic Elements | 55,856 LE |
| Embedded Memory | 2,396,160 bits |
| Embedded 18x18 Multipliers | 156 |
| Maximum User I/O | 327 |
| PLLs | 4 |
| Process Technology | 65 nm |
| Core Supply Voltage | 1.15 V to 1.25 V |
| 동작 온도 | 0°C to +70°C (Commercial) |
| Speed Grade | C6 |
| 패키지 | 484-ball UBGA (FineLine BGA) |
| 실장 유형 | Surface Mount |
| RoHS 상태 | Compliant |
| MSL 레벨 | 3 |
| Programming Interface | JTAG / Active Serial |
EP3C55U484C6 484-ball ubga (fineline bga) 핀 구성 가이드
EP3C55U484C6(484-ball ubga (fineline bga) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP3C55U484C6.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP3C55U484C6 적합 용도: 6 애플리케이션s: Industrial Motor Control, Video Surveillance / Image Processing, Telecom Line-Card Glue Logic, Portable Medical Instrumentation, Automotive Infotainment Prototyping, Test & Measurement Instrumentation.
Industrial Motor Control
The EP3C55U484C6 fits industrial motor control designs because its 156 embedded 18×18 multipliers can execute field-oriented control (FOC) algorithms at kHz PWM switching frequencies. The 4 PLLs allow precise generation of PWM-aligned clocks, while 327 user I/O pins handle encoder feedback, gate-driver signals, and communication peripherals. Operating on 1.15–1.25 V core, the 65 nm Cyclone III process keeps junction temperature below 100 °C even at full DSP utilization, enabling compact fan-less servo drives. The 484-ball UBGA footprint exposes enough I/O for multi-axis control boards with on-board Ethernet or CAN. Per Cyclone III reference designs, designers can implement a 3-axis FOC loop inside approximately 25K logic elements, leaving 30K LE for safety state machines and HMI logic.
추천
Video Surveillance / Image Processing
For video surveillance pipelines, the EP3C55U484C6's 2,396,160 bits of embedded RAM accommodate two or three full-resolution video line buffers at 720p. The 156 hardware multipliers accelerate Sobel, motion-detection, and H.264 preprocessing kernels without consuming LUT fabric. With 327 I/O pins, the device can interface to parallel CMOS sensors, BT.656 decoders, and DDR2 external memory for frame buffering. Designers using the Altera VIP suite typically hit 60 fps CIF processing inside 30K LE, leaving substantial headroom for analytics. The 1.15 V core and 65 nm process keep the surveillance board within a passive-cooling envelope, important for sealed outdoor IP cameras.
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Telecom Line-Card Glue Logic
In telecom line cards the EP3C55U484C6 acts as a glue-logic aggregator between ASIC framer chips, network processors, and backplane SERDES. Its 327 I/O easily absorb TDM buses, SPI, I2C, UART, and GPIO requirements, while the 4 PLLs synthesize multiple reference frequencies from a single 19.44 MHz system clock. Cyclone III supports 1.2 V, 1.5 V, 1.8 V, 2.5 V, 3.0 V, and 3.3 V I/O standards, allowing direct connection to legacy 3.3 V framers without level shifters. The 55,856 logic elements also enable on-chip protocol bridging such as HDLC, UART aggregation, or custom payload insertion. The commercial 0–70 °C rating suits central-office ambient conditions.
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Portable Medical Instrumentation
Battery-powered medical instruments benefit from the EP3C55U484C6's 65 nm low-power Cyclone III process, which dramatically reduces static and dynamic current versus 90 nm predecessors. The 55,856 LE can host DSP pipelines for ECG, pulse-oximetry, or ultrasound front-end preprocessing, while the 156 multipliers compute FFTs and FIR filters in real time. The 484-ball UBGA package occupies less than 19×19 mm, fitting handheld patient monitors. With 327 user I/O, designers can attach TFT displays, touchscreen controllers, and wireless modules without external expanders. The C6 commercial speed grade is sufficient for low-to-mid sample-rate medical signal chains.
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Automotive Infotainment Prototyping
The EP3C55U484C6 supports rapid prototyping of automotive infotainment subsystems such as head-unit display controllers, CAN-to-Ethernet bridges, and audio DSP front-ends. Its 156 hardware multipliers handle audio sample-rate conversion and codec mixing, while the abundant I/O can interface LVDS displays, MOST networks, and capacitive touch panels. Designers can prototype features that later migrate to Cyclone V or automotive-grade FPGAs. The commercial temperature range is acceptable for cabin-mounted prototypes; production deployments should migrate to the EP3C55U484I7 (industrial) or a Cyclone V Auto variant. The 484-ball UBGA enables high-bandwidth parallel connections to DDR2 memory for display buffer storage.
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Test & Measurement Instrumentation
The EP3C55U484C6 is a strong fit for bench-top test instruments such as logic analyzers, protocol exercisers, and arbitrary waveform generators. The 327 user I/O permit direct probing of multi-channel digital buses, while the 156 multipliers accelerate waveform synthesis and DSP-based signal conditioning. Embedded M9K memory blocks hold capture buffers without external SRAM, simplifying PCB layout. The 4 PLLs allow generation of multiple synchronized sample clocks from a single reference, critical for parallel-channel acquisition. The commercial 0–70 °C operating range and 1.15 V core suit lab-bench power budgets. Reference designs from Altera/Intel demonstrate streaming data capture at hundreds of MHz.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP3C55U484C6 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP3C55U484C6N | EP3C55U484C7N | EP3C55U484C8N | EP3C40U484C6 | EP3C55U484I7 |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 484-ball UBGA | 484-ball UBGA - same | 484-ball UBGA - same | 484-ball UBGA - same | 484-ball UBGA - same | 484-ball UBGA - same |
| Logic Elements | 55,856 LE | 55,856 LE | 55,856 LE | 55,856 LE | 39,600 LE (-29%) | 55,856 LE |
| Embedded Memory | 2,396,160 bits | 2,396,160 bits | 2,396,160 bits | 2,396,160 bits | 1,161,216 bits | 2,396,160 bits |
| Multipliers (18x18) | 156 | 156 | 156 | 156 | 108 | 156 |
| Maximum User I/O | 327 | 327 | 327 | 327 | 331 | 327 |
| Speed Grade | C6 (commercial) | C6 | C7 (faster) | C8 (fastest) | C6 | I7 (industrial) |
| Operating Temperature | 0°C to +70°C | 0°C to +70°C | 0°C to +70°C | 0°C to +70°C | 0°C to +70°C | -40°C to +85°C |
| Approx. Unit Price | $175.89 | $178–$185 | $190–$210 | $215–$240 | $125–$140 | $205–$230 |
주요 차별점
- Lowest-cost leaded variant in the Cyclone III 55K family (vs EP3C55U484C6N)
- C6 speed grade versus faster C7/C8 grades (vs EP3C55U484C8N)
- Higher logic density than EP3C40 in same package (vs EP3C40U484C6)
설계 노트
The EP3C55U484C6 requires a 1.15 V to 1.25 V core supply with a tolerance of ±30 mV per Altera's Cyclone III power guidelines. Use a dedicated switching regulator with at least 2 A current capability; Intel recommends the Enpirion EN5339 or equivalent for high-efficiency designs. I/O banks operate at 1.2 V, 1.5 V, 1.8 V, 2.5 V, 3.0 V, or 3.3 V; place decoupling capacitors (100 nF + 10 µF bulk) within 5 mm of each bank power pin to suppress switching transients.
The 484-ball UBGA uses 0.8 mm ball pitch and demands a 4 or 6-layer PCB stack-up with laser-drilled microvias for fan-out routing. Inner layers should provide continuous ground and power planes directly under the BGA to minimize inductance. Per Altera AN 429, escape routing on the top layer should use 0.15 mm trace-and-space with microvia-in-pad for reliable assembly. Signal integrity simulations are recommended for DDR2 memory interfaces routed from the FPGA.
Differential pairs (LVDS, DDR) must be length-matched to within ±25 ps and routed with 100 Ω differential impedance per Altera's Cyclone III device handbook. Place series-termination resistors within 5 mm of the FPGA driver pin to dampen reflections. Clock input pins should be surrounded by ground-signal-ground vias to form a stitched guard ring, reducing EMI coupling into adjacent channels.
Although Cyclone III is built on a 65 nm low-power process, fully-utilized designs with 80%+ LE occupation and active multipliers can dissipate 2–3 W. The 484-ball UBGA's exposed thermal path requires thermal vias beneath the central balls. Estimated: at 3 W dissipation and θJA ≈ 15 °C/W (with 100 thermal vias), junction temperature rises 45 °C above ambient, keeping TJ below 100 °C in 55 °C environments. Add a heatsink for sealed enclosures without airflow.
Do not confuse the EP3C55U484C6 (UBGA-484) with the EP3C55F484C6 (FBGA-484); the ball maps differ even though both use 484-ball packages. Always re-import pin assignments from the Quartus Pin Planner when migrating between 'U' and 'F' suffixes. Also verify configuration mode: JTAG (default) is convenient for development, while Active Serial with an EPCS flash is required for standalone boot.
규정 준수 정보
EP3C55U484C6 (without 'N' suffix) uses leaded terminal finish and is NOT RoHS-compliant - use EP3C55U484C6N for RoHS. The 'N' variant is lead-free and RoHS-compliant. AEC-Q100 is not applicable; for automotive designs consider Cyclone V Auto or dedicated automotive FPGAs.
