EP3C55U484I7 - Cyclone III FPGA 55K LE 484-FBGA | Altera
부품 번호: EP3C55U484I7 ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $309.76 | $309.76 |
| 10 | $285 | $2,850.00 |
| 100 | $250 | $25,000.00 |
| 500 | $220 | $110,000.00 |
| 1,000 | $195 | $195,000.00 |
EP3C55U484I7 개요
A Field-Programmable Gate Array (FPGA) is a reprogrammable digital integrated circuit containing an array of configurable logic blocks (CLBs), programmable interconnect, and dedicated hard IP such as block RAM, multipliers, and PLLs. FPGAs sit between fixed-function ASICs and general-purpose microcontrollers, offering hardware-level parallelism for data-path and signal-processing workloads. The Cyclone III family specifically optimises logic density per dollar and per watt, positioning it below high-end Stratix devices in the Altera portfolio but above Cyclone II in features and below Cyclone IV GX in transceiver capability.
Key features of the EP3C55U484I7 include 3,491 LABs/CLBs, 2,396,160 bits of embedded RAM (approximately 234 kbit of M9K block RAM equivalent), up to 156 embedded 18x18 multipliers for DSP, four PLLs, and a maximum core clock frequency rated around 437 MHz. The 484-FBGA package measures 19 x 19 mm with a 0.8 mm ball pitch and supports surface-mount reflow assembly. The "I7" speed-grade suffix designates the industrial temperature range, making the device suitable for -40C to +100C ambient operation.
Architecturally, the Cyclone III device family is implemented on TSMC's 65 nm process node with a 1.2 V core, achieving notably lower static and dynamic power than the preceding Cyclone II generation. Designers can allocate embedded multipliers as DSP blocks for FIR/FFT pipelines, distribute block RAM across the fabric for buffering, and configure LVDS/LVTTL/PCIe-style I/O through the Quartus II toolchain. The combination of large logic capacity, ample block RAM, and dedicated DSP blocks makes the EP3C55 well-suited for parallel video processing, motor-control front ends, and protocol-bridging applications.
Typical applications include industrial machine vision and video pipelines, motor and motion control in factory automation, software-defined radio baseband, telecom protocol conversion, and display controllers. The wide logic capacity also supports multi-protocol bridging in industrial Ethernet gateways and embedded instrumentation.
When designing with the EP3C55U484I7, plan the power distribution network carefully: even at modest toggle rates the device can require 3-4 W of core supply, so multiple 0.1 uF + bulk decoupling capacitors are recommended adjacent to each supply ball, and a 4-6 layer PCB with continuous power/ground planes is essential. Verify pinout against the device-specific 484-FBGA ball map because multiple speed-grade and package variants share this footprint.
드롭인 대체품: EP3C55U484I7 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP3C55U484I7 (동일 폼 팩터 및 풋프린트) — 차이점: Package, Operating Temperature, Logic Elements, Process Technology, Family.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP3C55U484I7N
✅ 드롭인✓ 재고 있음
$188.5 / 개
데이터시트 보기 →EP3C55U484C8N
✅ 드롭인✓ 재고 있음
$119.85 / 개
데이터시트 보기 →EP3C55U484C7N
✅ 드롭인✓ 재고 있음
$140.25 / 개
데이터시트 보기 →EP3C55U484C6N
✅ 드롭인✓ 재고 있음
$274.0589 / 개
데이터시트 보기 →EP3C40U484I7N
✅ 드롭인✓ 재고 있음
$118.8 / 개
데이터시트 보기 →EP3C55U484I7 최대 정격 & 전기적 특성
| Family | Cyclone III |
| Manufacturer | Altera (Intel) |
| Process Technology | 65 nm CMOS |
| Core Voltage | 1.15 V to 1.25 V |
| Logic Elements | 55,856 |
| Number of LABs/CLBs | 3,491 |
| Total RAM Bits | 2,396,160 |
| Number of I/O Pins | 327 |
| 동작 온도 | -40C to +100C (industrial, "I7" grade) |
| 패키지 | 484-FBGA (UBGA-484), 19 x 19 mm, 0.8 mm pitch |
| 실장 유형 | Surface Mount |
| Maximum Operating Frequency | 437.5 MHz |
| Number of PLLs | 4 |
| Embedded Multipliers (18x18) | 156 |
| Series | Cyclone III |
EP3C55U484I7 484-fbga (ubga-484), 19 x 19 mm, 0.8 mm pitch 핀 구성 가이드
EP3C55U484I7(484-fbga (ubga-484), 19 x 19 mm, 0.8 mm pitch 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP3C55U484I7.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP3C55U484I7 적합 용도: 6 애플리케이션s: Industrial Machine Vision and Video Processing, Motor and Motion Control in Factory Automation, Software-Defined Radio Baseband and DSP Front-End, Telecom Protocol Conversion and Bridging, Display Controllers and Video Walls, Industrial Ethernet Gateways and Embedded Instrumentation.
Industrial Machine Vision and Video Processing
The Altera EP3C55U484I7 is well suited for real-time machine-vision and video pipelines because its 55,856 logic elements and 156 embedded 18x18 DSP multipliers can implement FIR filters, color-space converters, and pixel-level algorithms in parallel. Its 2,396,160 bits of block RAM (M9K) provide sufficient line-buffer memory to drive HDMI/VGA or LVDS display panels without external SRAM, while the 327 user I/Os can connect directly to parallel camera interfaces and on-board display controllers. With an industrial -40C to +100C temperature grade (I7 speed grade), the device operates reliably on factory floors where ambient temperatures fluctuate and vibration is common.
추천
Motor and Motion Control in Factory Automation
The EP3C55U484I7 fits industrial servo, stepper, and BLDC motor control because its 4 PLLs and high logic density allow parallel generation of multi-axis PWM waveforms, encoder quadrature decoding, and current-loop compensators. The 65 nm low-power CMOS process minimises static dissipation so that multiple control axes can be driven from a single board. With 327 user I/Os and industrial temperature operation, the FPGA can interface directly to opto-isolated encoder inputs, gate drivers, and EtherCAT/Ethernet/IP MACs, replacing several discrete microcontrollers with a single programmable platform.
추천
Software-Defined Radio Baseband and DSP Front-End
The EP3C55U484I7 delivers adequate DSP throughput for SDR baseband processing in the HF/VHF band. Its 156 18x18 hardware multipliers accelerate FIR/IIR filtering, FFTs, and digital down-conversion, while 2.4 Mbit of block RAM stores tap coefficients and signal history. The four on-chip PLLs derive the multiple clock domains needed for ADC sampling and DAC reconstruction. Industrial temperature operation and 327 I/Os enable direct connection to RF ADCs/DACs and FPGA Mezzanine Card (FMC) connectors in compact SDR platforms.
추천
Telecom Protocol Conversion and Bridging
The EP3C55U484I7 is widely used in telecom equipment for protocol bridging between legacy TDM buses (E1/T1, H.110) and modern packet networks (Ethernet, PCIe, CPRI). Its 55,856 logic elements implement multi-channel HDLC, UART, and I2S cores concurrently while the embedded DSP blocks handle voice compression algorithms such as G.729. Industrial temperature operation and surface-mount 484-FBGA packaging suit carrier-grade equipment where board space is constrained and reliability is critical.
추천
Display Controllers and Video Walls
The EP3C55U484I7 integrates multi-channel LVDS display drivers, frame-rate converters, and on-screen display generators. Its 327 user I/Os support multiple 24-bit TTL/LVDS display interfaces simultaneously, and its 2.4 Mbit of block RAM holds frame buffers for small video walls. The industrial I7 temperature grade and 484-FBGA package allow compact fan-less display controller boards used in digital signage, medical imaging monitors, and automotive instrument clusters.
추천
Industrial Ethernet Gateways and Embedded Instrumentation
The EP3C55U484I7 supports PROFINET, EtherCAT, EtherNet/IP, and Modbus TCP soft-IP cores simultaneously thanks to its 55,856 logic elements and 327 I/Os. It can also implement multi-channel data acquisition front-ends, performing simultaneous sampling, decimation, and FIR filtering using the 156 hardware multipliers. The industrial temperature grade (I7) and low-power 65 nm process suit DIN-rail mounted controllers and embedded test instruments where heat dissipation and reliability are critical.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP3C55U484I7 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP3C55U484I7N | EP3C55U484C8N | EP3C55U484C7N | EP3C55U484C6N | EP3C40U484I7N |
|---|---|---|---|---|---|---|
| Package | 484-FBGA (U484), 19x19 mm, 0.8 mm pitch | 484-FBGA (U484) - same | 484-FBGA (U484) - same | 484-FBGA (U484) - same | 484-FBGA (U484) - same | 484-FBGA (U484) - same |
| Brand | Altera | Altera | Altera | Altera | Altera | Altera |
| Logic Elements | 55,856 | 55,856 | 55,856 | 55,856 | 55,856 | 39,600 |
| Speed Grade | I7 (industrial, fastest) | I7N (industrial, lead-free) | C8 (commercial) | C7 (commercial, slower) | C6 (commercial, slowest) | I7N (industrial, lead-free) |
| Operating Temperature | -40C to +100C (industrial) | -40C to +100C (industrial) | 0C to +85C (commercial) | 0C to +85C (commercial) | 0C to +85C (commercial) | -40C to +100C (industrial) |
| Total RAM Bits | 2,396,160 | 2,396,160 | 2,396,160 | 2,396,160 | 2,396,160 | 1,161,216 |
| User I/Os | 327 | 327 | 327 | 327 | 327 | 331 |
| Embedded Multipliers (18x18) | 156 | 156 | 156 | 156 | 156 | 108 |
주요 차별점
- Highest Cyclone III logic density in 484-FBGA U484 package (vs EP3C40U484I7N)
- Industrial temperature grade (I7) for harsh-environment deployment (vs EP3C55U484C8N)
- Cyclone III process and tool-chain maturity (vs Newer Cyclone IV/V families)
설계 노트
The Cyclone III EP3C55 core draws approximately 3-4 W from the 1.2 V rail at moderate toggle rates, with peaks up to 5 W during heavy DSP activity. Place a minimum of eight 0.1 uF MLCC decoupling capacitors adjacent to the core supply balls and at least four 10 uF bulk capacitors under the package footprint. Use a star-ground or split-plane topology so the 1.2 V core return does not share a high-current path with the I/O bank returns, otherwise ground bounce can corrupt LVDS signalling.
The 484-FBGA U484 package has a 0.8 mm ball pitch, which mandates a 4-layer PCB with microvia or via-in-pad construction for reliable breakout. Route inner signal layers directly under the BGA in a dog-bone or via-in-pad fanout and escape to outer layers with controlled-impedance traces. Maintain a continuous ground reference plane directly beneath the device to control return paths and minimise crosstalk on parallel LVDS buses.
Do not confuse the U484 FBGA package with the F484 variant: although both have 484 balls, the ball assignments differ and the parts are NOT pin-to-pin drop-in compatible. Always regenerate the Quartus II pin-out file (CSV/QSF) for the specific package code before finalising your PCB layout. Mixing pin maps between U484 and F484 will cause silent configuration failures or shorted I/O banks.
The Cyclone III EP3C55 in a 19x19 mm U484 package has a typical theta_JA around 20 C/W with sufficient PCB copper. At 4 W dissipation the junction temperature rises approximately 80C above ambient, so industrial enclosures with 70C internal ambient still keep Tj well below the 100C maximum. Add a thermal via array under the central ground balls to conduct heat into the inner ground plane; an exposed heat-spreader is optional for fan-less designs.
규정 준수 정보
RoHS/REACH/lead-free status was not confirmed in the verified distributor snippets. Altera's Cyclone III family is generally manufactured with Pb-free terminal finishes, but engineers should request the full material declaration from the distributor or Altera (Intel) before committing to RoHS-critical end products. AEC-Q100 is not applicable because this is an FPGA rather than an automotive-grade IC.
