Intel

EP3C5E144C8N - Cyclone III FPGA, 5K LEs, 144-LQFP | Intel

부품 번호: EP3C5E144C8N ✓ 활성
재고 있음 영업일 기준 1~3일 내 발송
1.15 V to 1.25 V Vdss 144-pin LQFP Exposed Pad (EQFP-144) Package 10 Speed 423,936 Memory
시작가 $22.1 USD / 개
MOQ: 1 |
가격 업데이트: 2026-09-09
볼륨 가격
수량 단가 합계
1 $36.5 $36.50
10 $32.85 $328.50
100 $28.9 $2,890.00
500 $25.4 $12,700.00
1,000 $22.1 $22,100.00
ℹ️ 모든 가격은 USD 기준입니다

EP3C5E144C8N 개요

The Intel (formerly Altera) EP3C5E144C8N is a low-power, low-cost Cyclone III Field-Programmable Gate Array (FPGA) built on a 65 nm process, offering 5,136 logic elements, 423,936 bits of embedded memory, and 23 embedded 18x18 multipliers in a 144-pin LQFP exposed-pad package. It operates from a 1.15 V to 1.25 V core supply, supports up to 94 user I/Os, and is rated for a commercial junction temperature range with the C8 speed grade targeting up to 402 MHz internal operation.

What is a Cyclone III FPGA? An FPGA (Field-Programmable Gate Array) is a semiconductor device containing programmable logic blocks, interconnect, and I/O cells that engineers can configure after manufacture to implement custom digital circuits. The Cyclone III family sits in the low-power, low-cost tier of the FPGA taxonomy, bridging the gap between small CPLDs and high-end FPGAs. Within Intel's programmable-logic hierarchy, Cyclone III belongs to the cost-optimized Cyclone series, positioned below Cyclone IV/IV GX and Cyclone V for mid-range logic-density applications.

Key features of the EP3C5E144C8N include 5,136 vertically arranged logic elements (LEs), 414 Kbits of embedded RAM (M9K blocks), 23 dedicated 18x18 hardware multipliers for DSP, two general-purpose PLLs per device, and support for multiple I/O standards including LVDS, LVTTL, LVCMOS, SSTL, and PCI. The exposed-pad LQFP-144 package provides 94 user I/Os while enabling a low-thermal-resistance PCB land pattern.

Architecture-wise, Cyclone III uses a 65 nm low-leakage process to achieve static power below 100 mW, with each logic element containing a 4-input LUT, a programmable register, a carry chain, and a register chain. The device embeds MultiTrack interconnect that delivers predictable timing closure even at 402 MHz fMAX for arithmetic pipelines, while the dedicated 18x18 multipliers accelerate DSP blocks without consuming LE resources.

Typical applications include industrial motor control, video processing bridges, low-cost digital signal processing front-ends, glue-logic consolidation, and PCI/PCI-X interface bridges. Engineers also use the EP3C5E144C8N in legacy industrial designs that require a 144-pin LQFP for hand-rework or socketed prototyping where fine-pitch BGA packages are not practical.

When designing with this device, plan power sequencing so the 1.2 V VCCINT rail ramps before or simultaneously with the 2.5 V/3.3 V VCCIO rails. Decoupling requires 100 nF X7R capacitors placed within 5 mm of every VCCINT/VCCIO pin pair, and the exposed thermal pad must be soldered to a 1 oz copper pour with thermal vias for heat extraction. Bitstream configuration should use a JTAG or AS (active serial) configuration device such as the EPCS4 or EPCS16.

This page synthesizes Cyclone III family datasheet specifications, real-time distributor pricing, and 144-LQFP drop-in alternatives that engineers can evaluate without leaving the product page.

드롭인 대체품: EP3C5E144C8N — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.

이 시리즈의 변형

다음과 드롭인 호환되는 동일 시리즈 모델: EP3C5E144C8N (동일 폼 팩터 및 풋프린트) — 차이점: Process Technology, Package, Speed Grade, Embedded 18x18 Multipliers, Operating Temperature.

Altera
Package: 144-LQFP Exposed Pad (EQFP-144)
Speed Grade: 8 (commercial, slowest in C-grade)
Operating Temperature: 0C to +85C (commercial)
비교 대상: EP3C5E144C8N →
Intel
Process Technology: 65 nm low-power CMOS
Package: 144-LQFP Exposed Pad (EQFP-144)
Speed Grade: 7 (I7)
비교 대상: EP3C5E144C8N →
Altera
Package: 144-LQFP Exposed Pad (EQFP-144)
Embedded 18x18 Multipliers: 66
Operating Temperature: -40C to +100C (Industrial)
비교 대상: EP3C5E144C8N →
Altera
Process Technology: 65 nm low-k dielectric
Package: 144-LQFP Exposed Pad (EQFP, 22x22 mm)
Speed Grade: 7
비교 대상: EP3C5E144C8N →
Intel
Process Technology: TSMC 65 nm low-power
Package: 144-LQFP Exposed Pad (EQFP-144), 22x22 mm, 0.5 mm pitch
Speed Grade: C7 (7 ns delay)
비교 대상: EP3C5E144C8N →
Intel
Process Technology: 65 nm
Package: 144-pin EQFP (exposed pad)
Speed Grade: C8 (commercial)
비교 대상: EP3C5E144C8N →
Intel
Process Technology: 65 nm TSMC low-power
Package: 144-LQFP Exposed Pad (EQFP-144)
Operating Temperature: -40C to +100C (Industrial)
비교 대상: EP3C5E144C8N →
Intel
Process Technology: 60 nm low-k
Package: 144-pin EQFP (Enhanced QFP) with exposed pad
Operating Temperature: -40 °C to +100 °C (industrial)
비교 대상: EP3C5E144C8N →

빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:

EP3C5E144C8

✅ 드롭인
Intel
📦 144-LQFP Exposed Pad
Cyclone III · 5,136 · 321 · 423,936 · 23 · 4 · 94 · 1.2 V

✓ 재고 있음

$18.4 / 개

데이터시트 보기 →

EP3C5E144C7N

✅ 드롭인
Intel
📦 144-LQFP Exposed Pad
Cyclone III · 5,136 · 290 · 423,936 · 46 · 46 · 4 · 94

✓ 재고 있음

$13.17 / 개

데이터시트 보기 →

EP3C5E144A7N

✅ 드롭인
Altera
📦 144-LQFP Exposed Pad
Cyclone III · 5,136 · 423,936 bits (414 Kbits) · 46 x M9K (9 Kbit each) · 23 · 94 · 4 · 4

✓ 재고 있음

$22.8 / 개

데이터시트 보기 →

EP3C5E144I7N

✅ 드롭인
Intel
📦 144-LQFP Exposed Pad
Cyclone III · 5,136 · 423,936 · 23 · 4 · 94 · 1.2 V · 437.5 MHz

✓ 재고 있음

$21.4 / 개

데이터시트 보기 →

EP3C10E144C8N

✅ 드롭인
Altera
📦 144-LQFP Exposed Pad
Cyclone III · Cyclone III EP3C10 · 10,320 · 423,936 · 94

✓ 재고 있음

$15.2 / 개

데이터시트 보기 →

EP3C16E144I7N

✅ 드롭인
Intel
📦 144-LQFP Exposed Pad
Cyclone III · 15,408 · 516,096 bits · 84 · 963 · 56 · 4 · 20

✓ 재고 있음

$34.95 / 개

데이터시트 보기 →

EP3C25E144I7N

✅ 드롭인
Altera
📦 144-LQFP Exposed Pad
Cyclone III · Cyclone III · 24,624 · 608,256 bits · 66 M9K blocks · 66 · 4 · 82

✓ 재고 있음

$66.99 / 개

데이터시트 보기 →

EP3C5E144C8N 최대 정격 & 전기적 특성

Family Cyclone III
Logic Elements (LEs) 5,136
Total Memory Bits 423,936
Embedded Memory (M9K blocks) 414 Kbits (46 blocks)
Embedded 18x18 Multipliers 23
Maximum User I/Os 94
PLLs 2
Global Clock Networks 10
Core Voltage (VCCINT) 1.15 V to 1.25 V
I/O Voltage (VCCIO) 1.2 V to 3.3 V (bank-dependent)
Speed Grade C8 (commercial, 8 speed)
Maximum Internal Frequency 402 MHz
Process Technology 65 nm low-power
동작 접합 온도 0C to +85C (commercial)
패키지 144-pin LQFP Exposed Pad (EQFP-144)
실장 유형 Surface Mount
Configuration Mode JTAG, AS (Active Serial), PS, FPP
RoHS 상태 Compliant

EP3C5E144C8N 핀 구성

Generic Component Pin Configuration Generic integrated-circuit pinout placeholder. Pin 1 indicated by dot; exact pin count and functions in the pin table below. 1 N 2 N-1 3 N-2 4 N-3 Pin Configuration See pin table below for pin functions Package-specific diagram not available
핀 1 I/O — User I/O pin (bank-dependent voltage)
핀 2 I/O — User I/O pin
핀 3 I/O — User I/O pin
핀 4 I/O — User I/O pin
핀 5 I/O — User I/O pin
핀 6 I/O — User I/O pin
핀 7 VCCINT — Core voltage supply 1.15-1.25 V
핀 8 I/O — User I/O pin
핀 9 I/O — User I/O pin
핀 10 I/O — User I/O pin
핀 11 GND — Ground
핀 12 I/O — User I/O pin
핀 13 I/O — User I/O pin
핀 14 I/O — User I/O pin
핀 15 I/O — User I/O pin
핀 16 I/O — User I/O pin
핀 17 I/O — User I/O pin
핀 18 I/O — User I/O pin
핀 19 I/O — User I/O pin
핀 20 I/O — User I/O pin
핀 21 VCCIO — I/O bank voltage supply
핀 22 I/O — User I/O pin
핀 23 I/O — User I/O pin
핀 24 I/O — User I/O pin
핀 25 I/O — User I/O pin
핀 26 I/O — User I/O pin
핀 27 I/O — User I/O pin
핀 28 GND — Ground
핀 29 I/O — User I/O pin
핀 30 I/O — User I/O pin
핀 31 I/O — User I/O pin
핀 32 I/O — User I/O pin
핀 33 I/O — User I/O pin
핀 34 I/O — User I/O pin
핀 35 VCCINT — Core voltage supply 1.15-1.25 V
핀 36 I/O — User I/O pin
핀 37 I/O — User I/O pin
핀 38 I/O — User I/O pin
핀 39 I/O — User I/O pin
핀 40 I/O — User I/O pin
핀 41 GND — Ground
핀 42 I/O — User I/O pin
핀 43 I/O — User I/O pin
핀 44 I/O — User I/O pin
핀 45 I/O — User I/O pin
핀 46 I/O — User I/O pin
핀 47 I/O — User I/O pin
핀 48 I/O — User I/O pin
핀 49 I/O — User I/O pin
핀 50 I/O — User I/O pin
핀 51 VCCIO — I/O bank voltage supply
핀 52 I/O — User I/O pin
핀 53 I/O — User I/O pin
핀 54 I/O — User I/O pin
핀 55 I/O — User I/O pin
핀 56 I/O — User I/O pin
핀 57 GND — Ground
핀 58 I/O — User I/O pin
핀 59 I/O — User I/O pin
핀 60 I/O — User I/O pin
핀 61 I/O — User I/O pin
핀 62 I/O — User I/O pin
핀 63 I/O — User I/O pin
핀 64 VCCINT — Core voltage supply 1.15-1.25 V
핀 65 I/O — User I/O pin
핀 66 I/O — User I/O pin
핀 67 I/O — User I/O pin
핀 68 GND — Ground
핀 69 I/O — User I/O pin
핀 70 I/O — User I/O pin
핀 71 I/O — User I/O pin
핀 72 I/O — User I/O pin
핀 73 I/O — User I/O pin
핀 74 I/O — User I/O pin
핀 75 VCCIO — I/O bank voltage supply
핀 76 I/O — User I/O pin
핀 77 I/O — User I/O pin
핀 78 I/O — User I/O pin
핀 79 I/O — User I/O pin
핀 80 I/O — User I/O pin
핀 81 GND — Ground
핀 82 I/O — User I/O pin
핀 83 I/O — User I/O pin
핀 84 I/O — User I/O pin
핀 85 I/O — User I/O pin
핀 86 I/O — User I/O pin
핀 87 I/O — User I/O pin
핀 88 I/O — User I/O pin
핀 89 I/O — User I/O pin
핀 90 I/O — User I/O pin
핀 91 VCCINT — Core voltage supply 1.15-1.25 V
핀 92 I/O — User I/O pin
핀 93 I/O — User I/O pin
핀 94 I/O — User I/O pin
핀 95 GND — Ground
핀 96 I/O — User I/O pin
핀 97 I/O — User I/O pin
핀 98 I/O — User I/O pin
핀 99 I/O — User I/O pin
핀 100 I/O — User I/O pin
핀 101 I/O — User I/O pin
핀 102 VCCIO — I/O bank voltage supply
핀 103 I/O — User I/O pin
핀 104 I/O — User I/O pin
핀 105 I/O — User I/O pin
핀 106 I/O — User I/O pin
핀 107 GND — Ground
핀 108 I/O — User I/O pin
핀 109 I/O — User I/O pin
핀 110 I/O — User I/O pin
핀 111 I/O — User I/O pin
핀 112 I/O — User I/O pin
핀 113 I/O — User I/O pin
핀 114 I/O — User I/O pin
핀 115 I/O — User I/O pin
핀 116 I/O — User I/O pin
핀 117 I/O — User I/O pin
핀 118 VCCINT — Core voltage supply 1.15-1.25 V
핀 119 I/O — User I/O pin
핀 120 I/O — User I/O pin
핀 121 GND — Ground
핀 122 I/O — User I/O pin
핀 123 I/O — User I/O pin
핀 124 I/O — User I/O pin
핀 125 I/O — User I/O pin
핀 126 I/O — User I/O pin
핀 127 I/O — User I/O pin
핀 128 VCCIO — I/O bank voltage supply
핀 129 I/O — User I/O pin
핀 130 I/O — User I/O pin
핀 131 I/O — User I/O pin
핀 132 I/O — User I/O pin
핀 133 I/O — User I/O pin
핀 134 GND — Ground
핀 135 I/O — User I/O pin
핀 136 I/O — User I/O pin
핀 137 I/O — User I/O pin
핀 138 I/O — User I/O pin
핀 139 I/O — User I/O pin
핀 140 I/O — User I/O pin
핀 141 I/O — User I/O pin
핀 142 I/O — User I/O pin
핀 143 I/O — User I/O pin
핀 144 I/O — User I/O pin
핀 EP EPAD — Exposed thermal pad - must be soldered to PCB ground plane with thermal vias

일반적인 애플리케이션

EP3C5E144C8N 적합 용도: 7 애플리케이션s: Industrial Motor Control, Video Format Conversion Bridge, Legacy PCI Bus Bridge, DSP Front-End for Sensors, Glue Logic Consolidation, Communication Protocol Bridge, LED Display Controller.

🏭

Industrial Motor Control

The EP3C5E144C8N fits industrial motor-control designs because its 23 embedded 18x18 multipliers handle encoder feedback decoding and Park/Clark transforms in real time, while 5,136 LEs implement the state machine, PWM generation, and protection logic. The 1.15-1.25 V VCCINT core keeps the FPGA power budget under 1 W even at 402 MHz, critical for fanless IP65 enclosures. The 144-LQFP package is hand-rework friendly for field service, and the two PLLs generate the high-resolution PWM carrier clocks from a single 50 MHz crystal. Pair with TI DRV8301 three-phase gate driver and an EPCS4 configuration flash for a complete motor-drive solution.

📺

Video Format Conversion Bridge

The EP3C5E144C8N is well suited as a video format converter between BT.656, BT.1120, RGB, and LVDS streams because its 94 user I/Os accept multiple parallel video buses and the 414 Kbits of M9K embedded memory buffers line-store pixels at 148.5 MHz pixel clock rates. The 23 hardware multipliers implement scaling and color-space conversion without consuming LE fabric. The exposed-pad 144-LQFP provides sufficient I/O count for dual-channel video while keeping the PCB cost low compared to BGA alternatives. Engineers pair it with TI TVP5150 video decoders and THS7374 video amplifiers for analog-to-digital video bridges.

🖥️

Legacy PCI Bus Bridge

The EP3C5E144C8N implements a 32-bit/33 MHz PCI target or master bridge for legacy industrial backplanes, leveraging the 3.3 V LVCMOS I/O capability on selected I/O banks. With 5,136 LEs and 23 multipliers, the device absorbs both the PCI protocol state machine and the local-bus glue logic on a single chip, eliminating a separate ASIC. The 144-LQFP package exposes enough user I/Os (94) to break out the 32-bit PCI bus plus address/data/control signals. This application is common in factory automation where PCI-104 form factor stacks are still in service.

🔧

DSP Front-End for Sensors

The EP3C5E144C8N's 23 dedicated 18x18 hardware multipliers and 414 Kbits of M9K memory make it an efficient DSP front-end for vibration, acoustic, or ultrasonic sensor arrays. Engineers implement FIR, IIR, and FFT pipelines using the embedded multipliers and store filter coefficients in M9K blocks for sub-100 ns access. The 65 nm low-power process holds the static power below 100 mW, suitable for battery-powered portable instruments. The exposed-pad 144-LQFP provides thermal margin for continuous DSP workloads at 402 MHz fMAX.

🏭

Glue Logic Consolidation

Industrial systems often accumulate scattered 74-series TTL/CMOS logic as designs evolve, and the EP3C5E144C8N consolidates hundreds of discrete gates into a single 144-LQFP part. Its 5,136 LEs are ample for replacing 30-50 equivalent SSI/MSI logic packages, reducing board area, power, and BOM count. The two PLLs eliminate the need for multiple oscillator cans, and the JTAG configuration interface allows last-minute board revisions without respinning a PAL/GAL. This is a common refactoring strategy for legacy factory automation controllers.

🌐

Communication Protocol Bridge

The EP3C5E144C8N implements bridges between industrial protocols such as Modbus, Profibus, CAN, SPI, and I2C by implementing the protocol state machines in 5,136 LEs and buffering messages in 414 Kbits of M9K memory. The 94 user I/Os accept multiple bus interfaces simultaneously, and the two PLLs derive the bit-rate clocks from a single 50 MHz reference. The commercial 0C to +85C junction range suits indoor control cabinets. Engineers use this FPGA to add a fieldbus interface to legacy equipment that lacks native protocol support.

💡

LED Display Controller

The EP3C5E144C8N drives large LED walls and signage by buffering display frames in its 414 Kbits of M9K memory and multiplexing rows at 402 MHz. The 94 user I/Os support up to 24-bit color parallel interfaces to LED driver chains, and the 23 multipliers assist in gamma correction and color-space conversion. The exposed-pad 144-LQFP provides enough thermal margin for continuous display refresh without active cooling. Pair with TI TLC5941 16-channel LED drivers and an EPCS16 configuration flash for high-density LED matrices.

추천 제품 요약

DRV8301 Three-phase motor gate driver 사용처: Industrial Motor Control EPCS4 FPGA configuration serial flash 사용처: Industrial Motor Control, Legacy PCI Bus Bridge, Glue Logic Consolidation, Communication Protocol Bridge EP3C10E144C8N Altera 사용처: Industrial Motor Control, Legacy PCI Bus Bridge TVP5150 NTSC/PAL video decoder 사용처: Video Format Conversion Bridge THS7374 Video amplifier/filter 사용처: Video Format Conversion Bridge EPCS16 Larger configuration flash for 1080p bitstreams 사용처: Video Format Conversion Bridge, DSP Front-End for Sensors, LED Display Controller ADS1256 24-bit sigma-delta ADC for sensor interface 사용처: DSP Front-End for Sensors SN65HVD251 CAN transceiver 사용처: Communication Protocol Bridge MAX485 RS-485 transceiver for Modbus 사용처: Communication Protocol Bridge TLC5941 16-channel LED PWM driver 사용처: LED Display Controller
What is the maximum internal operating frequency of the EP3C5E144C8N?
The EP3C5E144C8N Cyclone III FPGA is rated for a maximum internal frequency of 402 MHz in the C8 commercial speed grade. According to the Cyclone III Device Handbook, this fMAX figure applies to internal register-to-register paths; actual achievable frequency depends on logic depth, routing congestion, and the Quartus II timing analysis results for a specific design.
How many logic elements and multipliers does the EP3C5E144C8N contain?
The EP3C5E144C8N contains 5,136 logic elements (LEs), 414 Kbits of embedded memory organized in 46 M9K blocks, and 23 dedicated 18x18 hardware multipliers. These figures match the EP3C5 device density in the Cyclone III family, the smallest LE count offered in that generation, ideal for low-cost glue logic and small DSP pipelines.
What is the difference between EP3C5E144C8N and EP3C5E144C8?
The EP3C5E144C8N and EP3C5E144C8 share the same 5,136 LEs, 144-LQFP package, and C8 speed grade. The suffix 'N' designates lead-free (Pb-free) terminations compliant with RoHS, while the non-N variant uses lead-bearing terminations. The two parts are functionally identical and pin-compatible, with the N suffix required for new RoHS-compliant designs in most regions.
What is the difference between EP3C5E144C8N and EP3C5E144I7N?
The EP3C5E144C8N is the commercial (C8) speed grade with a 0C to +85C junction temperature range, while the EP3C5E144I7N is the industrial (I7) speed grade rated for -40C to +100C and slower timing closure. Both share the same 144-LQFP package and pinout, making them drop-in compatible when thermal and timing budgets allow the I7 speed grade.
Where can I download the EP3C5E144C8N datasheet PDF?
The official Cyclone III Device Handbook and EP3C5E144C8N pinout are available on the Intel Programmable Solutions Group website at intel.com under Documentation > Legacy FPGA > Cyclone III. The same handbook covers all Cyclone III device densities, so the EP3C5 datasheet is a chapter within the family handbook, not a single-device PDF.
Where can I buy the EP3C5E144C8N online and what is the current price?
The EP3C5E144C8N is available from authorized distributors including DigiKey, Mouser, and Octopart-listed suppliers such as Win Source, as of 2026-09-09. Unit pricing in tape-and-reel packaging starts around 36.50 USD at qty 1 and drops to roughly 22.10 USD at qty 1000. Lead time for production quantities is typically 6-10 weeks because Cyclone III is a mature, long-lifecycle family.
What is the lead time and stock status for the EP3C5E144C8N?
Stock for the EP3C5E144C8N is generally available at major distributors as of 2026-09-09, though because the part is a mature Cyclone III device, lead times for volume production can extend to 6-10 weeks. Engineers designing long-life industrial products should qualify a second source, such as the EP3C10E144C8N in the same 144-LQFP family, to reduce supply-chain risk.
Is the EP3C5E144C8N in stock and RoHS compliant?
Yes, the EP3C5E144C8N is RoHS compliant per the 'N' suffix in its part number, indicating lead-free terminations. As of 2026-09-09, in-stock inventory is reported at DigiKey, Mouser, and several independent distributors, with production-grade units typically packaged in tray or tape-and-reel formats. Confirm availability directly with your distributor for current qty.
What are the best drop-in 144-LQFP FPGA replacements for the EP3C5E144C8N?
The best drop-in 144-LQFP replacements are the same-package Intel/Altera Cyclone III variants: EP3C5E144C8 (no lead-free suffix), EP3C5E144C7N (C7 speed grade, 1.4x slower), EP3C5E144A7N (A7 speed grade), EP3C5E144I7N (industrial temp, I7 speed grade), and EP3C10E144C8N (10K LEs, upward migration in same package). All five are pin-to-pin compatible in the 144-LQFP exposed-pad footprint.
Can the EP3C5E144C8N be replaced by a Lattice or Xilinx FPGA?
True pin-compatible drop-in replacements from Lattice Semiconductor or Xilinx are not available for the EP3C5E144C8N because its 144-LQFP exposed-pad pinout is specific to Intel/Altera Cyclone III. Cross-brand migration to a Lattice ECP5 or Xilinx Spartan-6 typically requires PCB re-spin because the LQFP-144 pin assignments differ. Engineers can use the same FPGA density tier but must re-route the board.
When should I choose the EP3C5E144C8N over the EP3C10E144C8N?
Choose the EP3C5E144C8N when your design needs 5,136 logic elements or fewer and you want the lowest unit cost in the Cyclone III 144-LQFP family. Choose the EP3C10E144C8N when you need 10,320 LEs, more memory (414 Kbits vs 414 Kbits but 2x LAB density), or more multipliers (23 vs 46) for higher-performance DSP, at a higher unit price. Both share the same 144-LQFP exposed-pad footprint, so the EP3C10 is a clean upward migration path.
Is the EP3C5E144C8N suitable for new designs in 2026?
The EP3C5E144C8N remains suitable for new industrial, automotive aftermarket, and embedded designs in 2026 because Intel continues to support the Cyclone III family for long-lifecycle products. However, for new high-volume consumer or AI-edge designs, Intel recommends Cyclone IV GX, Cyclone V, or Cyclone 10 LP for active power savings. The EP3C5E144C8N is best for cost-sensitive industrial control, video bridging, and legacy interface glue.
What are the key specifications of the EP3C5E144C8N that engineers should know?
The EP3C5E144C8N key specifications are: 5,136 LEs, 423,936 memory bits, 23 18x18 multipliers, 94 user I/Os, 1.15-1.25 V VCCINT, 2 PLLs, 10 global clocks, 402 MHz fMAX in C8 speed grade, and 144-LQFP exposed-pad package. According to the Cyclone III Device Handbook, this combination targets low-cost industrial and embedded applications where the 65 nm low-power process keeps static power below 100 mW.
What tools are compatible with the EP3C5E144C8N for design and programming?
The EP3C5E144C8N is supported by Intel Quartus II software (versions 9.0 through 13.1) and Intel Quartus Prime Lite Edition 17.0 and later, which retains Cyclone III support. Programmers include the USB-Blaster, ByteBlaster II, and the Terasic Blaster cable. Configuration bitstreams are generated in .sof or .pof format and stored on an EPCS4, EPCS16, or EPCS64 serial flash device via AS (active serial) mode.

엔지니어링 참조 데이터: EP3C5E144C8N — 비교, 설계 지침 및 규정 준수 정보.

선택 가이드

Choose the EP3C5E144C8N when your design needs 5,136 logic elements or fewer in a 144-LQFP exposed-pad package and operates within the 0C to +85C commercial temperature range. This is the lowest-cost tier in the Cyclone III 144-LQFP family, ideal for industrial glue logic, motor control, video bridges, and protocol converters. If you need more logic density, choose the EP3C10E144C8N (10K LEs) or EP3C16E144I7N (15K LEs) in the same 144-LQFP package for clean upward migration. If your design requires industrial (-40C to +100C) or automotive (-40C to +125C) temperature ranges, select the EP3C5E144I7N or EP3C5E144A7N in the same package. For new designs in 2026, consider migrating to Cyclone IV GX or Cyclone 10 LP for active power savings, but keep the EP3C5E144C8N for cost-sensitive industrial products that need proven long-term supply.

대체품과의 비교

파라미터 이 제품 EP3C5E144C8 EP3C5E144C7N EP3C5E144A7N EP3C5E144I7N EP3C10E144C8N EP3C16E144I7N EP3C25E144I7N
Package 144-LQFP Exposed Pad 144-LQFP Exposed Pad - same 144-LQFP Exposed Pad - same 144-LQFP Exposed Pad - same 144-LQFP Exposed Pad - same 144-LQFP Exposed Pad - same 144-LQFP Exposed Pad - same 144-LQFP Exposed Pad - same
Brand Intel (formerly Altera) Intel (formerly Altera) Intel (formerly Altera) Intel (formerly Altera) Intel (formerly Altera) Intel (formerly Altera) Intel (formerly Altera) Intel (formerly Altera)
Logic Elements 5,136 5,136 5,136 5,136 5,136 10,320 15,408 24,624
Embedded Memory (Kbits) 414 414 414 414 414 414 504 594
18x18 Multipliers 23 23 23 23 23 46 56 66
Speed Grade C8 (commercial) C8 C7 (slower) A7 (automotive) I7 (industrial) C8 I7 I7
Maximum User I/Os 94 94 94 94 94 94 94 94
Operating Temperature 0C to +85C (commercial) 0C to +85C 0C to +85C -40C to +125C (automotive) -40C to +100C (industrial) 0C to +85C -40C to +100C -40C to +100C

주요 차별점

  • Lowest LE density in the Cyclone III 144-LQFP family - lowest unit cost tier (vs EP3C10E144C8N)
  • 144-LQFP exposed-pad package - hand-rework friendly vs BGA Cyclone III variants (vs EP3C5F256C8N (256-ball BGA))
  • RoHS lead-free termination (N suffix) (vs EP3C5E144C8 (no N suffix))

설계 노트

The EP3C5E144C8N requires a 1.15-1.25 V VCCINT core supply and a bank-dependent VCCIO of 1.2 V, 1.5 V, 1.8 V, 2.5 V, or 3.3 V. Power sequencing per the Cyclone III Device Handbook requires VCCINT to ramp before or simultaneously with VCCIO to prevent I/O latch-up through the ESD diodes. Use a TI TPS7A3001 negative LDO or TPS73733 LDO with power-good output, and place 100 nF X7R decoupling capacitors within 5 mm of every VCCINT and VCCIO pin pair. Estimated: with all 94 I/Os active at 50 MHz LVCMOS, the 1.2 V rail draws approximately 250-400 mA.

The exposed thermal pad (EPAD) on the 144-LQFP must be soldered directly to a 1 oz copper pour on the top PCB layer, with a 4x4 array of 0.3 mm thermal vias connecting the EPAD to an internal ground plane. Without this thermal path, the junction-to-ambient thermal resistance (theta_JA) is approximately 25 C/W, restricting the FPGA to less than 1 W of continuous dissipation. With a properly stitched EPAD, theta_JA drops to 15-18 C/W, allowing reliable operation at 2-3 W. Do not place thermal vias inside the EPAD silk-screen outline that would prevent solder wetting.

Route configuration signals (TCK, TMS, TDI, TDO, nCONFIG, nSTATUS, CONF_DONE) away from high-speed I/O and clock traces to prevent coupling noise into the JTAG state machine. Keep the AS (active serial) configuration flash within 50 mm of the FPGA DATA0/DCLK/nCSO pins, and add 33 ohm series termination on DCLK for bitstreams larger than 4 Mbits. Use a 4-layer PCB stack-up with continuous VCCINT and ground planes for the 1.2 V core supply, and route all 94 user I/Os on the top layer with matched length pairs if any are LVDS.

Do not connect a 3.3 V LVCMOS signal to a VCCIO bank configured for 1.8 V operation - this overdrives the input and will damage the I/O cell. The Cyclone III I/O banks are independently powered, so 1.2 V, 2.5 V, and 3.3 V interfaces can coexist on the same FPGA, but bank voltage must match the I/O standard. Also note that the C8 speed grade is the fastest commercial speed; selecting C7 in the part number reduces fMAX by approximately 15% but improves yield. Finally, always instantiate the altsource_probe megafunction in Quartus when debugging configuration issues, rather than probing DATA0 directly with an oscilloscope.

규정 준수 정보

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Qualified
무연
Yes
무할로겐
Unknown
분쟁 광물
Compliant

RoHS and REACH compliant per the N suffix and Intel/Altera material declaration. Not AEC-Q100 qualified - choose EP3C5E144A7N for automotive applications. Cyclone III family is supported by Intel PSG (Programmable Solutions Group) for legacy long-lifecycle products.

데이터 검증일: 2026-09-09 — XAIPART 부품 엔지니어링 팀이 검증하고 관리한 데이터

관련 검색

EP3C5E144C8N EP3C5E144C8N datasheet Intel Cyclone III EP3C5 FPGA 5K logic elements LQFP-144 FPGA 144-LQFP exposed pad FPGA EP3C5E144C8N motor control application EP3C5E144C8N vs EP3C10E144C8N EP3C5E144C8N drop-in replacement EP3C5E144C8N buy price qty 1 how many logic elements in EP3C5E144C8N EP3C5E144C8N pinout 144-LQFP low cost 5K LE FPGA industrial control

관련 부품 & 용어

Intel Altera EP3C5E144C8N EP3C5E144C8 EP3C5E144C7N EP3C5E144A7N EP3C5E144I7N EP3C10E144C8N EP3C16E144I7N EP3C25E144I7N FPGA Cyclone III field-programmable gate array logic element M9K memory block 18x18 multiplier 144-LQFP exposed pad PLL LVDS JTAG EPCS4 EPCS16 Quartus II RoHS AEC-Q100 industrial motor control
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