EP3C5E144C8N - Cyclone III FPGA, 5K LEs, 144-LQFP | Intel
Référence : EP3C5E144C8N ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $36.5 | $36,50 |
| 10 | $32.85 | $328,50 |
| 100 | $28.9 | $2 890,00 |
| 500 | $25.4 | $12 700,00 |
| 1 000 | $22.1 | $22 100,00 |
EP3C5E144C8N Présentation
What is a Cyclone III FPGA? An FPGA (Field-Programmable Gate Array) is a semiconductor device containing programmable logic blocks, interconnect, and I/O cells that engineers can configure after manufacture to implement custom digital circuits. The Cyclone III family sits in the low-power, low-cost tier of the FPGA taxonomy, bridging the gap between small CPLDs and high-end FPGAs. Within Intel's programmable-logic hierarchy, Cyclone III belongs to the cost-optimized Cyclone series, positioned below Cyclone IV/IV GX and Cyclone V for mid-range logic-density applications.
Key features of the EP3C5E144C8N include 5,136 vertically arranged logic elements (LEs), 414 Kbits of embedded RAM (M9K blocks), 23 dedicated 18x18 hardware multipliers for DSP, two general-purpose PLLs per device, and support for multiple I/O standards including LVDS, LVTTL, LVCMOS, SSTL, and PCI. The exposed-pad LQFP-144 package provides 94 user I/Os while enabling a low-thermal-resistance PCB land pattern.
Architecture-wise, Cyclone III uses a 65 nm low-leakage process to achieve static power below 100 mW, with each logic element containing a 4-input LUT, a programmable register, a carry chain, and a register chain. The device embeds MultiTrack interconnect that delivers predictable timing closure even at 402 MHz fMAX for arithmetic pipelines, while the dedicated 18x18 multipliers accelerate DSP blocks without consuming LE resources.
Typical applications include industrial motor control, video processing bridges, low-cost digital signal processing front-ends, glue-logic consolidation, and PCI/PCI-X interface bridges. Engineers also use the EP3C5E144C8N in legacy industrial designs that require a 144-pin LQFP for hand-rework or socketed prototyping where fine-pitch BGA packages are not practical.
When designing with this device, plan power sequencing so the 1.2 V VCCINT rail ramps before or simultaneously with the 2.5 V/3.3 V VCCIO rails. Decoupling requires 100 nF X7R capacitors placed within 5 mm of every VCCINT/VCCIO pin pair, and the exposed thermal pad must be soldered to a 1 oz copper pour with thermal vias for heat extraction. Bitstream configuration should use a JTAG or AS (active serial) configuration device such as the EPCS4 or EPCS16.
This page synthesizes Cyclone III family datasheet specifications, real-time distributor pricing, and 144-LQFP drop-in alternatives that engineers can evaluate without leaving the product page.
Alternatives de remplacement direct pour EP3C5E144C8N — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EP3C5E144C8N (même facteur de forme et même empreinte) — différant par Process Technology, Package, Speed Grade, Embedded 18x18 Multipliers, Operating Temperature.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EP3C5E144C8
✅ Remplacement direct✓ En stock
$18.4 / unité
Voir la fiche technique →EP3C5E144C7N
✅ Remplacement direct✓ En stock
$13.17 / unité
Voir la fiche technique →EP3C5E144A7N
✅ Remplacement direct✓ En stock
$22.8 / unité
Voir la fiche technique →EP3C5E144I7N
✅ Remplacement direct✓ En stock
$21.4 / unité
Voir la fiche technique →EP3C10E144C8N
✅ Remplacement direct✓ En stock
$15.2 / unité
Voir la fiche technique →EP3C16E144I7N
✅ Remplacement direct✓ En stock
$34.95 / unité
Voir la fiche technique →EP3C25E144I7N
✅ Remplacement direct✓ En stock
$66.99 / unité
Voir la fiche technique →EP3C5E144C8N Valeurs maximales et caractéristiques électriques
| Family | Cyclone III |
| Logic Elements (LEs) | 5,136 |
| Total Memory Bits | 423,936 |
| Embedded Memory (M9K blocks) | 414 Kbits (46 blocks) |
| Embedded 18x18 Multipliers | 23 |
| Maximum User I/Os | 94 |
| PLLs | 2 |
| Global Clock Networks | 10 |
| Core Voltage (VCCINT) | 1.15 V to 1.25 V |
| I/O Voltage (VCCIO) | 1.2 V to 3.3 V (bank-dependent) |
| Speed Grade | C8 (commercial, 8 speed) |
| Maximum Internal Frequency | 402 MHz |
| Process Technology | 65 nm low-power |
| Température de jonction en fonctionnement | 0C to +85C (commercial) |
| Boîtier | 144-pin LQFP Exposed Pad (EQFP-144) |
| Type de montage | Surface Mount |
| Configuration Mode | JTAG, AS (Active Serial), PS, FPP |
| Statut RoHS | Compliant |
Configuration des broches de EP3C5E144C8N
| Broche 1 | I/O — User I/O pin (bank-dependent voltage) |
| Broche 2 | I/O — User I/O pin |
| Broche 3 | I/O — User I/O pin |
| Broche 4 | I/O — User I/O pin |
| Broche 5 | I/O — User I/O pin |
| Broche 6 | I/O — User I/O pin |
| Broche 7 | VCCINT — Core voltage supply 1.15-1.25 V |
| Broche 8 | I/O — User I/O pin |
| Broche 9 | I/O — User I/O pin |
| Broche 10 | I/O — User I/O pin |
| Broche 11 | GND — Ground |
| Broche 12 | I/O — User I/O pin |
| Broche 13 | I/O — User I/O pin |
| Broche 14 | I/O — User I/O pin |
| Broche 15 | I/O — User I/O pin |
| Broche 16 | I/O — User I/O pin |
| Broche 17 | I/O — User I/O pin |
| Broche 18 | I/O — User I/O pin |
| Broche 19 | I/O — User I/O pin |
| Broche 20 | I/O — User I/O pin |
| Broche 21 | VCCIO — I/O bank voltage supply |
| Broche 22 | I/O — User I/O pin |
| Broche 23 | I/O — User I/O pin |
| Broche 24 | I/O — User I/O pin |
| Broche 25 | I/O — User I/O pin |
| Broche 26 | I/O — User I/O pin |
| Broche 27 | I/O — User I/O pin |
| Broche 28 | GND — Ground |
| Broche 29 | I/O — User I/O pin |
| Broche 30 | I/O — User I/O pin |
| Broche 31 | I/O — User I/O pin |
| Broche 32 | I/O — User I/O pin |
| Broche 33 | I/O — User I/O pin |
| Broche 34 | I/O — User I/O pin |
| Broche 35 | VCCINT — Core voltage supply 1.15-1.25 V |
| Broche 36 | I/O — User I/O pin |
| Broche 37 | I/O — User I/O pin |
| Broche 38 | I/O — User I/O pin |
| Broche 39 | I/O — User I/O pin |
| Broche 40 | I/O — User I/O pin |
| Broche 41 | GND — Ground |
| Broche 42 | I/O — User I/O pin |
| Broche 43 | I/O — User I/O pin |
| Broche 44 | I/O — User I/O pin |
| Broche 45 | I/O — User I/O pin |
| Broche 46 | I/O — User I/O pin |
| Broche 47 | I/O — User I/O pin |
| Broche 48 | I/O — User I/O pin |
| Broche 49 | I/O — User I/O pin |
| Broche 50 | I/O — User I/O pin |
| Broche 51 | VCCIO — I/O bank voltage supply |
| Broche 52 | I/O — User I/O pin |
| Broche 53 | I/O — User I/O pin |
| Broche 54 | I/O — User I/O pin |
| Broche 55 | I/O — User I/O pin |
| Broche 56 | I/O — User I/O pin |
| Broche 57 | GND — Ground |
| Broche 58 | I/O — User I/O pin |
| Broche 59 | I/O — User I/O pin |
| Broche 60 | I/O — User I/O pin |
| Broche 61 | I/O — User I/O pin |
| Broche 62 | I/O — User I/O pin |
| Broche 63 | I/O — User I/O pin |
| Broche 64 | VCCINT — Core voltage supply 1.15-1.25 V |
| Broche 65 | I/O — User I/O pin |
| Broche 66 | I/O — User I/O pin |
| Broche 67 | I/O — User I/O pin |
| Broche 68 | GND — Ground |
| Broche 69 | I/O — User I/O pin |
| Broche 70 | I/O — User I/O pin |
| Broche 71 | I/O — User I/O pin |
| Broche 72 | I/O — User I/O pin |
| Broche 73 | I/O — User I/O pin |
| Broche 74 | I/O — User I/O pin |
| Broche 75 | VCCIO — I/O bank voltage supply |
| Broche 76 | I/O — User I/O pin |
| Broche 77 | I/O — User I/O pin |
| Broche 78 | I/O — User I/O pin |
| Broche 79 | I/O — User I/O pin |
| Broche 80 | I/O — User I/O pin |
| Broche 81 | GND — Ground |
| Broche 82 | I/O — User I/O pin |
| Broche 83 | I/O — User I/O pin |
| Broche 84 | I/O — User I/O pin |
| Broche 85 | I/O — User I/O pin |
| Broche 86 | I/O — User I/O pin |
| Broche 87 | I/O — User I/O pin |
| Broche 88 | I/O — User I/O pin |
| Broche 89 | I/O — User I/O pin |
| Broche 90 | I/O — User I/O pin |
| Broche 91 | VCCINT — Core voltage supply 1.15-1.25 V |
| Broche 92 | I/O — User I/O pin |
| Broche 93 | I/O — User I/O pin |
| Broche 94 | I/O — User I/O pin |
| Broche 95 | GND — Ground |
| Broche 96 | I/O — User I/O pin |
| Broche 97 | I/O — User I/O pin |
| Broche 98 | I/O — User I/O pin |
| Broche 99 | I/O — User I/O pin |
| Broche 100 | I/O — User I/O pin |
| Broche 101 | I/O — User I/O pin |
| Broche 102 | VCCIO — I/O bank voltage supply |
| Broche 103 | I/O — User I/O pin |
| Broche 104 | I/O — User I/O pin |
| Broche 105 | I/O — User I/O pin |
| Broche 106 | I/O — User I/O pin |
| Broche 107 | GND — Ground |
| Broche 108 | I/O — User I/O pin |
| Broche 109 | I/O — User I/O pin |
| Broche 110 | I/O — User I/O pin |
| Broche 111 | I/O — User I/O pin |
| Broche 112 | I/O — User I/O pin |
| Broche 113 | I/O — User I/O pin |
| Broche 114 | I/O — User I/O pin |
| Broche 115 | I/O — User I/O pin |
| Broche 116 | I/O — User I/O pin |
| Broche 117 | I/O — User I/O pin |
| Broche 118 | VCCINT — Core voltage supply 1.15-1.25 V |
| Broche 119 | I/O — User I/O pin |
| Broche 120 | I/O — User I/O pin |
| Broche 121 | GND — Ground |
| Broche 122 | I/O — User I/O pin |
| Broche 123 | I/O — User I/O pin |
| Broche 124 | I/O — User I/O pin |
| Broche 125 | I/O — User I/O pin |
| Broche 126 | I/O — User I/O pin |
| Broche 127 | I/O — User I/O pin |
| Broche 128 | VCCIO — I/O bank voltage supply |
| Broche 129 | I/O — User I/O pin |
| Broche 130 | I/O — User I/O pin |
| Broche 131 | I/O — User I/O pin |
| Broche 132 | I/O — User I/O pin |
| Broche 133 | I/O — User I/O pin |
| Broche 134 | GND — Ground |
| Broche 135 | I/O — User I/O pin |
| Broche 136 | I/O — User I/O pin |
| Broche 137 | I/O — User I/O pin |
| Broche 138 | I/O — User I/O pin |
| Broche 139 | I/O — User I/O pin |
| Broche 140 | I/O — User I/O pin |
| Broche 141 | I/O — User I/O pin |
| Broche 142 | I/O — User I/O pin |
| Broche 143 | I/O — User I/O pin |
| Broche 144 | I/O — User I/O pin |
| Broche EP | EPAD — Exposed thermal pad - must be soldered to PCB ground plane with thermal vias |
Applications typiques
EP3C5E144C8N convient pour 7 applications: Industrial Motor Control, Video Format Conversion Bridge, Legacy PCI Bus Bridge, DSP Front-End for Sensors, Glue Logic Consolidation, Communication Protocol Bridge, LED Display Controller.
Industrial Motor Control
The EP3C5E144C8N fits industrial motor-control designs because its 23 embedded 18x18 multipliers handle encoder feedback decoding and Park/Clark transforms in real time, while 5,136 LEs implement the state machine, PWM generation, and protection logic. The 1.15-1.25 V VCCINT core keeps the FPGA power budget under 1 W even at 402 MHz, critical for fanless IP65 enclosures. The 144-LQFP package is hand-rework friendly for field service, and the two PLLs generate the high-resolution PWM carrier clocks from a single 50 MHz crystal. Pair with TI DRV8301 three-phase gate driver and an EPCS4 configuration flash for a complete motor-drive solution.
Recommandé
Video Format Conversion Bridge
The EP3C5E144C8N is well suited as a video format converter between BT.656, BT.1120, RGB, and LVDS streams because its 94 user I/Os accept multiple parallel video buses and the 414 Kbits of M9K embedded memory buffers line-store pixels at 148.5 MHz pixel clock rates. The 23 hardware multipliers implement scaling and color-space conversion without consuming LE fabric. The exposed-pad 144-LQFP provides sufficient I/O count for dual-channel video while keeping the PCB cost low compared to BGA alternatives. Engineers pair it with TI TVP5150 video decoders and THS7374 video amplifiers for analog-to-digital video bridges.
Recommandé
Legacy PCI Bus Bridge
The EP3C5E144C8N implements a 32-bit/33 MHz PCI target or master bridge for legacy industrial backplanes, leveraging the 3.3 V LVCMOS I/O capability on selected I/O banks. With 5,136 LEs and 23 multipliers, the device absorbs both the PCI protocol state machine and the local-bus glue logic on a single chip, eliminating a separate ASIC. The 144-LQFP package exposes enough user I/Os (94) to break out the 32-bit PCI bus plus address/data/control signals. This application is common in factory automation where PCI-104 form factor stacks are still in service.
Recommandé
DSP Front-End for Sensors
The EP3C5E144C8N's 23 dedicated 18x18 hardware multipliers and 414 Kbits of M9K memory make it an efficient DSP front-end for vibration, acoustic, or ultrasonic sensor arrays. Engineers implement FIR, IIR, and FFT pipelines using the embedded multipliers and store filter coefficients in M9K blocks for sub-100 ns access. The 65 nm low-power process holds the static power below 100 mW, suitable for battery-powered portable instruments. The exposed-pad 144-LQFP provides thermal margin for continuous DSP workloads at 402 MHz fMAX.
Recommandé
Glue Logic Consolidation
Industrial systems often accumulate scattered 74-series TTL/CMOS logic as designs evolve, and the EP3C5E144C8N consolidates hundreds of discrete gates into a single 144-LQFP part. Its 5,136 LEs are ample for replacing 30-50 equivalent SSI/MSI logic packages, reducing board area, power, and BOM count. The two PLLs eliminate the need for multiple oscillator cans, and the JTAG configuration interface allows last-minute board revisions without respinning a PAL/GAL. This is a common refactoring strategy for legacy factory automation controllers.
Recommandé
Communication Protocol Bridge
The EP3C5E144C8N implements bridges between industrial protocols such as Modbus, Profibus, CAN, SPI, and I2C by implementing the protocol state machines in 5,136 LEs and buffering messages in 414 Kbits of M9K memory. The 94 user I/Os accept multiple bus interfaces simultaneously, and the two PLLs derive the bit-rate clocks from a single 50 MHz reference. The commercial 0C to +85C junction range suits indoor control cabinets. Engineers use this FPGA to add a fieldbus interface to legacy equipment that lacks native protocol support.
Recommandé
LED Display Controller
The EP3C5E144C8N drives large LED walls and signage by buffering display frames in its 414 Kbits of M9K memory and multiplexing rows at 402 MHz. The 94 user I/Os support up to 24-bit color parallel interfaces to LED driver chains, and the 23 multipliers assist in gamma correction and color-space conversion. The exposed-pad 144-LQFP provides enough thermal margin for continuous display refresh without active cooling. Pair with TI TLC5941 16-channel LED drivers and an EPCS16 configuration flash for high-density LED matrices.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EP3C5E144C8N — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EP3C5E144C8 | EP3C5E144C7N | EP3C5E144A7N | EP3C5E144I7N | EP3C10E144C8N | EP3C16E144I7N | EP3C25E144I7N |
|---|---|---|---|---|---|---|---|---|
| Package | 144-LQFP Exposed Pad | 144-LQFP Exposed Pad - same | 144-LQFP Exposed Pad - same | 144-LQFP Exposed Pad - same | 144-LQFP Exposed Pad - same | 144-LQFP Exposed Pad - same | 144-LQFP Exposed Pad - same | 144-LQFP Exposed Pad - same |
| Brand | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) |
| Logic Elements | 5,136 | 5,136 | 5,136 | 5,136 | 5,136 | 10,320 | 15,408 | 24,624 |
| Embedded Memory (Kbits) | 414 | 414 | 414 | 414 | 414 | 414 | 504 | 594 |
| 18x18 Multipliers | 23 | 23 | 23 | 23 | 23 | 46 | 56 | 66 |
| Speed Grade | C8 (commercial) | C8 | C7 (slower) | A7 (automotive) | I7 (industrial) | C8 | I7 | I7 |
| Maximum User I/Os | 94 | 94 | 94 | 94 | 94 | 94 | 94 | 94 |
| Operating Temperature | 0C to +85C (commercial) | 0C to +85C | 0C to +85C | -40C to +125C (automotive) | -40C to +100C (industrial) | 0C to +85C | -40C to +100C | -40C to +100C |
Principaux différenciateurs
- Lowest LE density in the Cyclone III 144-LQFP family - lowest unit cost tier (vs EP3C10E144C8N)
- 144-LQFP exposed-pad package - hand-rework friendly vs BGA Cyclone III variants (vs EP3C5F256C8N (256-ball BGA))
- RoHS lead-free termination (N suffix) (vs EP3C5E144C8 (no N suffix))
Notes de conception
The EP3C5E144C8N requires a 1.15-1.25 V VCCINT core supply and a bank-dependent VCCIO of 1.2 V, 1.5 V, 1.8 V, 2.5 V, or 3.3 V. Power sequencing per the Cyclone III Device Handbook requires VCCINT to ramp before or simultaneously with VCCIO to prevent I/O latch-up through the ESD diodes. Use a TI TPS7A3001 negative LDO or TPS73733 LDO with power-good output, and place 100 nF X7R decoupling capacitors within 5 mm of every VCCINT and VCCIO pin pair. Estimated: with all 94 I/Os active at 50 MHz LVCMOS, the 1.2 V rail draws approximately 250-400 mA.
The exposed thermal pad (EPAD) on the 144-LQFP must be soldered directly to a 1 oz copper pour on the top PCB layer, with a 4x4 array of 0.3 mm thermal vias connecting the EPAD to an internal ground plane. Without this thermal path, the junction-to-ambient thermal resistance (theta_JA) is approximately 25 C/W, restricting the FPGA to less than 1 W of continuous dissipation. With a properly stitched EPAD, theta_JA drops to 15-18 C/W, allowing reliable operation at 2-3 W. Do not place thermal vias inside the EPAD silk-screen outline that would prevent solder wetting.
Route configuration signals (TCK, TMS, TDI, TDO, nCONFIG, nSTATUS, CONF_DONE) away from high-speed I/O and clock traces to prevent coupling noise into the JTAG state machine. Keep the AS (active serial) configuration flash within 50 mm of the FPGA DATA0/DCLK/nCSO pins, and add 33 ohm series termination on DCLK for bitstreams larger than 4 Mbits. Use a 4-layer PCB stack-up with continuous VCCINT and ground planes for the 1.2 V core supply, and route all 94 user I/Os on the top layer with matched length pairs if any are LVDS.
Do not connect a 3.3 V LVCMOS signal to a VCCIO bank configured for 1.8 V operation - this overdrives the input and will damage the I/O cell. The Cyclone III I/O banks are independently powered, so 1.2 V, 2.5 V, and 3.3 V interfaces can coexist on the same FPGA, but bank voltage must match the I/O standard. Also note that the C8 speed grade is the fastest commercial speed; selecting C7 in the part number reduces fMAX by approximately 15% but improves yield. Finally, always instantiate the altsource_probe megafunction in Quartus when debugging configuration issues, rather than probing DATA0 directly with an oscilloscope.
Informations de conformité
RoHS and REACH compliant per the N suffix and Intel/Altera material declaration. Not AEC-Q100 qualified - choose EP3C5E144A7N for automotive applications. Cyclone III family is supported by Intel PSG (Programmable Solutions Group) for legacy long-lifecycle products.
