EP3C5U256A7N - Cyclone III FPGA 5K LE 256-BGA | Intel / Altera
부품 번호: EP3C5U256A7N ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $28.5 | $28.50 |
| 10 | $25.4 | $254.00 |
| 100 | $21.8 | $2,180.00 |
| 500 | $18.95 | $9,475.00 |
| 1,000 | $16.2 | $16,200.00 |
EP3C5U256A7N 개요
An FPGA (Field-Programmable Gate Array) is a type of programmable logic device (PLD) that contains an array of configurable logic blocks (CLBs / ALMs), programmable interconnect, and I/O cells, all of which can be reconfigured by the designer after manufacture. FPGAs sit between ASICs (custom silicon) and general-purpose processors in the hierarchy: IC -> programmable logic -> FPGA. Cyclone III devices are fabricated on a 60 nm low-power CMOS process, giving them a low static power footprint ideal for battery-powered and thermally constrained systems.
Key features include 5,136 logic elements, 423,936 bits of embedded RAM (M9K blocks), 23 embedded 18x18 multipliers for DSP, four general-purpose PLLs, and a maximum user I/O count of 182. The device operates from a 1.15 V to 1.25 V core supply with hot-socketing support, allowing live insertion into a powered backplane. Speed grade -7 places this part in the mid-speed bin of the Cyclone III family, suitable for designs targeting up to approximately 200 MHz fabric performance.
Typical applications include industrial motor control, video processing bridges, low-cost software-defined radio front-ends, LED video walls, and consumer electronics glue logic. Designers migrating from CPLDs gain thousands of additional logic elements and embedded multiplier blocks, enabling the integration of DSP and soft-core processors such as Nios II on a single device.
When designing with this part, ensure decoupling capacitors are placed close to every VCCINT and VCCIO pin, and follow Intel's PCB layout guidelines for BGA fan-out to maintain signal integrity on DDR/QSPI memory interfaces. Configuration can be sourced from an external flash, JTAG, or Altera EPCS serial configuration device.
This page consolidates distributor stock, same-family drop-in alternatives, and practical design notes not collected in a single place elsewhere, giving engineers a faster path from specification to BOM decision.
드롭인 대체품: EP3C5U256A7N — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP3C5U256A7N (동일 폼 팩터 및 풋프린트) — 차이점: Package, Process Technology, Operating Temperature, Configuration Modes, Speed Grade.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP3C5F256A7N
✅ 드롭인✓ 재고 있음
$24.4 / 개
데이터시트 보기 →EP3C5F256C7N
✅ 드롭인✓ 재고 있음
$14.2 / 개
데이터시트 보기 →EP3C5F256C8N
✅ 드롭인✓ 재고 있음
$10.95 / 개
데이터시트 보기 →EP3C5F256I7N
✅ 드롭인✓ 재고 있음
$24 / 개
데이터시트 보기 →EP3C5F256C6N
✅ 드롭인✓ 재고 있음
$18.85 / 개
데이터시트 보기 →EP3C5F256I7
✅ 드롭인✓ 재고 있음
$22.36 / 개
데이터시트 보기 →EP3C5U256A7N 최대 정격 & 전기적 특성
| Series | Cyclone III |
| Logic Elements | 5,136 LE |
| Embedded Memory | 414 kbit (423,936 bits) |
| Number of I/Os | 182 |
| Operating Supply Voltage (Core) | 1.15 V to 1.25 V |
| 장착 스타일 | SMD/SMT |
| 패키지 / 케이스 | BGA-256 (U256 Ultra FineLine) |
| Packaging | Tray |
| Minimum Operating Temperature | -40 C |
| Maximum Operating Temperature | +125 C (Automotive grade) |
| Temperature Grade | Automotive |
| Number of PLLs | 4 |
| Process Node | 60 nm low-power CMOS |
| Speed Grade | -7 |
| RoHS 상태 | Compliant |
EP3C5U256A7N bga-256 (u256 ultra fineline) 핀 구성 가이드
EP3C5U256A7N(bga-256 (u256 ultra fineline) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP3C5U256A7N.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP3C5U256A7N 적합 용도: 6 애플리케이션s: Industrial Motor Control, Video Format Conversion / Display Bridge, Low-Cost Software-Defined Radio Front End, LED Video Wall Controller, Consumer Electronics Glue Logic, Automotive Infotainment and Telematics.
Industrial Motor Control
The EP3C5U256A7N is a strong fit for industrial motor control thanks to its 5,136 logic elements, 23 embedded 18x18 multipliers, and four general-purpose PLLs that can synthesize the precise PWM frequencies needed for field-oriented control (FOC). Position feedback from a QEI encoder and three-phase current sensing can be sampled by the FPGA, processed in hardware, and used to generate center-aligned PWM outputs for a three-phase inverter. Compared with a microcontroller, the FPGA delivers deterministic sub-microsecond loop times which directly improve torque ripple and acoustic noise in AC drives.
추천
Video Format Conversion / Display Bridge
The EP3C5U256A7N is well suited for video format conversion between parallel ITU-R BT.656, LVDS, and HDMI-derived interfaces because the 414 kbit of embedded M9K RAM can absorb a full line of video at common resolutions. Designers can implement color-space conversion, scaling, and deinterlacing in fabric while consuming less than 70% of the device's logic resources. The 182 user I/Os provide ample headroom for 24-bit parallel RGB plus control signals and I2C for display configuration.
추천
Low-Cost Software-Defined Radio Front End
The EP3C5U256A7N can implement narrow-band SDR front-ends for amateur radio, AIS marine receivers, and industrial telemetry because its 18x18 multipliers and M9K blocks are sized for small FFTs (256-1024 points) at IF sample rates. The four PLLs generate the precise sample clocks needed for direct conversion of HF and VHF signals. Total BOM cost stays low because the FPGA replaces a chain of op-amp filters and a dedicated DSP chip.
추천
LED Video Wall Controller
Driving large LED video walls requires many high-speed parallel data lines, which the EP3C5U256A7N provides via 182 user I/Os. Each output can be paired with an external LED driver to control 16 channels of constant-current PWM, and the embedded M9K memory stores gamma correction tables and refresh buffers. Fabric-based logic also handles HUB75 protocol generation, refresh timing, and color-depth dithering without taxing a small microcontroller.
추천
Consumer Electronics Glue Logic
In consumer products, the EP3C5U256A7N replaces multiple CPLDs and discrete logic by integrating I2C/SPI/UART bridges, key-scan controllers, IR remote decoders, and power-sequencing logic on one device. The 1.2 V core plus hot-socketing support enables live insertion into docked products, and the small BGA package fits behind a connector. Power consumption is low enough to fit in a battery-powered product envelope.
추천
Automotive Infotainment and Telematics
With its automotive temperature grade (-40 C to +125 C), the EP3C5U256A7N is qualified for cabin-mounted infotainment, CAN/LIN gateway, and telematics modules. The Cyclone III family has been deployed across automotive Tier-1 supply chains for years, so design collateral and software libraries (including Nios II) are mature. Logic capacity is sufficient for audio routing, Bluetooth baseband glue, and small vision preprocessing tasks at the edge.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP3C5U256A7N — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP3C5F256A7N | EP3C5F256C7N | EP3C5F256C8N | EP3C5F256I7N |
|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel |
| Package | BGA-256 (U256) | BGA-256 (F256) | BGA-256 (F256) | BGA-256 (F256) | BGA-256 (F256) |
| Logic Elements | 5,136 LE | 5,136 LE | 5,136 LE | 5,136 LE | 5,136 LE |
| Embedded Memory | 414 kbit | 414 kbit | 414 kbit | 414 kbit | 414 kbit |
| Number of I/Os | 182 | 182 | 182 | 182 | 182 |
| Speed Grade | -7 (A7) | -7 (A7) | -7 (C7) | -8 (C8) | -7 (I7) |
| Temperature Grade | Automotive | Automotive | Commercial | Commercial | Industrial |
| Core Voltage | 1.15 V to 1.25 V | 1.15 V to 1.25 V | 1.15 V to 1.25 V | 1.15 V to 1.25 V | 1.15 V to 1.25 V |
주요 차별점
- Lowest-density Cyclone III device with full 256-ball BGA (vs EP3C55U484I7N)
- Automotive temperature grade in a small BGA (vs EP3C5F256C7N)
- Ultra FineLine BGA package variant (vs EP3C5E144A7N)
설계 노트
Decouple every VCCINT pin with a 0.1 uF X7R ceramic capacitor placed within 5 mm of the BGA ball, and add four 10 uF bulk capacitors distributed around the package perimeter. VCCIO banks can be supplied at 1.2 V to 3.3 V independently to match the connected memory or peripheral logic. Intel's Cyclone III handbook recommends powering VCCINT last in the sequence to avoid latch-up during hot-socketing events.
The U256 BGA uses a 1 mm pitch ball array. Use a 4-6 layer PCB with at least one continuous ground plane directly under the FPGA to control return paths for high-speed LVDS and DDR traces. Microvia-in-pad is recommended for inner balls to escape the dense ball field without exceeding 4 layers. Match trace length within 50 mils for DDR address/command signals and within 25 mils for clock pairs.
Do not confuse the U256 Ultra FineLine BGA ball map with the F256 FineLine BGA ball map - they are mechanically similar but electrically different. A PCB laid out for U256 will not work with an F256 device without re-routing. Also, the -A7 speed grade is the fastest; substituting a -C8 or -I7 device on the same board will work but reduce the maximum fMAX by approximately 15% to 25%.
Cyclone III LVDS inputs require an external 100 ohm differential termination between the P and N pins placed as close to the FPGA ball as possible. For DDR2 interfaces, use the FPGA's on-chip dynamic phase-shift circuitry (DPS) and the four PLLs to deskew the read DQS strobe. Series termination resistors of 22-33 ohm on DDR address/command lines improve signal integrity above 200 MHz.
규정 준수 정보
RoHS compliant and AEC-Q100 grade qualified per Intel Cyclone III ordering information. Halogen-free status not explicitly listed in verified data - set to unknown.
