EP3C5F256A7N - Cyclone III FPGA, 5136 LE, 256-FBGA | Intel / Altera
부품 번호: EP3C5F256A7N ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $38.5 | $38.50 |
| 10 | $35.2 | $352.00 |
| 100 | $31.8 | $3,180.00 |
| 500 | $27.95 | $13,975.00 |
| 1,000 | $24.4 | $24,400.00 |
EP3C5F256A7N 개요
A Field Programmable Gate Array (FPGA) is a type of programmable logic device (PLD) that lets engineers implement arbitrary digital logic — from simple glue logic to complete processor cores — through a configuration bitstream loaded into on-chip SRAM. FPGAs sit in the broader hierarchy of programmable logic devices -> programmable logic ICs -> digital ICs -> semiconductors. Unlike ASICs, FPGAs are post-fabrication reprogrammable, enabling rapid prototyping, in-field upgrades, and design error recovery. Cyclone III FPGAs specifically target the low-power, low-density end of the FPGA market.
Key features of the EP3C5F256A7N include 321 logic array blocks (LABs), up to 23 embedded 18 × 18 multipliers suitable for DSP operations, embedded M9K memory blocks totaling 423,936 RAM bits, and dedicated global clock networks. The device also includes a hard memory controller, support for external DDR/DDR2 memories, and multiple I/O standards (LVCMOS, LVTTL, LVDS, SSTL) on most user pins. Configuration can be performed via JTAG, Active Serial (AS), or Passive Serial (PS) modes using commodity flash memory.
Architecturally, Cyclone III devices use a four-input look-up table (LUT) based logic fabric combined with dedicated routing, variable-sized embedded memory, and hard multipliers. The 65 nm low-power process allows static and dynamic power consumption to be considerably lower than prior Cyclone generations, making the family suitable for thermally constrained enclosures. The device supports hot-socketing and I/O pre-emphasis features that simplify board bring-up.
Typical applications include automotive driver-assistance interfaces, industrial machine control, low-cost video processing pipelines, motor drive peripherals, and protocol bridging (I2C/SPI/UART/Ethernet) on factory automation buses. The 256-ball FBGA package exposes enough I/O and memory bandwidth to host a soft Nios II processor plus several custom peripherals in a single device.
When designing with this FPGA, allocate at least one configuration mode (typically AS with a serial flash) and provide proper decoupling per the device family datasheet. Thermal dissipation remains modest thanks to the 65 nm low-power process, but designers should still observe the recommended PCB footprint, ball-to-trace via pattern, and keep critical clock traces matched. Verify JTAG chain ordering if multiple devices share the bus.
This page synthesizes distributor stock, parametric alternatives, and practical design considerations not found in the manufacturer datasheet alone.
드롭인 대체품: EP3C5F256A7N — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP3C5F256A7N (동일 폼 팩터 및 풋프린트) — 차이점: Package, Operating Temperature, Process Technology, RoHS Status, Logic Array Blocks (LABs).
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP3C10F256I7N
✅ 드롭인✓ 재고 있음
$34.94 / 개
데이터시트 보기 →EP3C10F256C8N
✅ 드롭인✓ 재고 있음
$15.4 / 개
데이터시트 보기 →EP3C16F256I7N
✅ 드롭인✓ 재고 있음
$38.5 / 개
데이터시트 보기 →EP3C25F256I7N
✅ 드롭인✓ 재고 있음
$27.2 / 개
데이터시트 보기 →EP3C10F256C6N
✅ 드롭인✓ 재고 있음
$14.1 / 개
데이터시트 보기 →EP3C5F256A7N 최대 정격 & 전기적 특성
| Series | Cyclone III |
| Family | Cyclone III |
| Logic Elements | 5,136 |
| Logic Array Blocks (LABs) | 321 |
| Total RAM Bits | 423,936 |
| Embedded Multipliers (18x18) | 23 |
| User I/O Count | 182 |
| Core Voltage | 1.2 V |
| Process Technology | 65 nm CMOS |
| 패키지 | 256-FBGA (17 x 17 mm) |
| 동작 온도 | -40 °C to +125 °C (automotive grade) |
| Automotive Qualification | AEC-Q100 |
| Configuration Modes | AS, PS, JTAG |
| RoHS 상태 | Compliant (LEAD FREE) |
EP3C5F256A7N 256-fbga (17 x 17 mm) 핀 구성 가이드
EP3C5F256A7N(256-fbga (17 x 17 mm) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP3C5F256A7N.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP3C5F256A7N 적합 용도: 6 애플리케이션s: Automotive Driver-Assistance ECU, Industrial Machine Control, Low-Cost Video Processing, Motor Drive Peripheral Controller, Protocol Bridge and Industrial Networking, Portable Test and Measurement Equipment.
Automotive Driver-Assistance ECU
The EP3C5F256A7N is well matched to compact automotive ADAS ECUs that need AEC-Q100 qualification and modest logic capacity. The 5,136 LEs host sensor-fusion glue logic, CAN/LIN bridge functions, and a soft Nios II controller for diagnostics, while 182 user I/O accept multiple camera and radar interfaces. AEC-Q100 qualification across -40 C to +125 C and the 65 nm low-power process keep junction temperatures manageable in sealed enclosures. Compared with discrete microcontrollers, the FPGA's parallel I/O structure reduces latency for time-critical sensor preprocessing.
추천
Industrial Machine Control
In factory automation, the EP3C5F256A7N serves as a programmable logic controller (PLC) co-processor that handles fast I/O scanning, quadrature encoder counting, and EtherCAT or PROFINET protocol bridging. The 23 embedded 18x18 multipliers accelerate field-oriented control (FOC) math for multi-axis servo drives, and the 423,936 RAM bits buffer trajectory tables and look-up tables. Industrial -40 C to +125 C operation permits placement near motors and high-EMI switching devices without thermal derating. Compared to a fixed-function MCU, the FPGA's parallel architecture reduces interrupt latency in deterministic motion loops.
추천
Low-Cost Video Processing
The EP3C5F256A7N handles entry-level video bridging tasks such as BT.656 to LVDS conversion, frame-rate conversion, and on-screen display overlay in surveillance and infotainment systems. The 23 hardware multipliers implement 3x3 or 5x5 filter kernels in real time at standard-definition rates, and 423,936 RAM bits double as line buffers. With 182 user I/O exposed through the FBGA-256 package, designers can simultaneously accept parallel video inputs and drive parallel TFT panels. Power consumption stays modest thanks to the 65 nm low-power process, enabling fanless enclosures.
추천
Motor Drive Peripheral Controller
The EP3C5F256A7N integrates field-oriented control (FOC) math, PWM generation, and protection logic for variable-frequency drives up to a few kilowatts. The 23 embedded 18x18 multipliers compute Park/Clarke transforms and PI loops in microseconds, while 182 I/O manage multiple shunt current sensors, encoders, and gate-driver interfaces. Industrial -40 C to +125 C operation permits co-location with power-stage heatsinks. The 1.2 V core at 65 nm keeps quiescent draw low, important for battery-backed standby operation. Compared to a DSP+MCU pair, the FPGA unifies control and housekeeping on one die.
추천
Protocol Bridge and Industrial Networking
The EP3C5F256A7N provides a flexible platform for industrial protocol conversion between CAN, LIN, RS-485, RS-232, I2C, SPI, and Ethernet in legacy-to-modern factory retrofit projects. The 182 user I/O easily host several independent serial channels, and the 423,936 RAM bits provide buffering for packet reassembly. The FBGA-256 footprint simplifies board layout when the bridge sits between multiple bus connectors on the same PCB. Industrial temperature grade and AEC-Q100 qualification permit use in both factory-floor and vehicle-mounted equipment.
추천
Portable Test and Measurement Equipment
The EP3C5F256A7N powers portable logic analyzers, protocol exercisers, and handheld oscilloscope front-ends where low power and small PCB area are critical. The 65 nm process keeps battery draw low, while 5,136 LEs are sufficient to implement deep FIFO memories, trigger logic, and DSP filtering on a single device. The automotive -40 C to +125 C temperature grade allows the same hardware to be used in field-deployed monitoring equipment that experiences wide thermal swings. The FBGA-256 package supports dense I/O connections to high-bandwidth ADCs and DACs.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP3C5F256A7N — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP3C10F256I7N | EP3C10F256C8N | EP3C16F256I7N | EP3C25F256I7N | EP3C10F256C6N |
|---|---|---|---|---|---|---|
| Brand | Altera / Intel | Altera / Intel | Altera / Intel | Altera / Intel | Altera / Intel | Altera / Intel |
| Package | 256-FBGA (17 x 17 mm) | 256-FBGA - same | 256-FBGA - same | 256-FBGA - same | 256-FBGA - same | 256-FBGA - same |
| Logic Elements | 5,136 | 10,320 | 10,320 | 15,408 | 24,624 | 10,320 |
| Embedded RAM (bits) | 423,936 | 423,936 | 423,936 | 516,096 | 608,256 | 423,936 |
| Embedded Multipliers (18x18) | 23 | 23 | 23 | 56 | 66 | 23 |
| User I/O Count | 182 | 182 | 182 | 182 | 182 | 182 |
| Operating Temperature | -40 C to +125 C (automotive) | -40 C to +100 C (industrial) | 0 C to +85 C (commercial) | -40 C to +100 C (industrial) | -40 C to +100 C (industrial) | 0 C to +85 C (commercial) |
| Automotive Qualification | AEC-Q100 | No (industrial) | No (commercial) | No (industrial) | No (industrial) | No (commercial) |
| Core Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
주요 차별점
- Smallest AEC-Q100 Cyclone III density step (vs EP3C10F256I7N)
- Automotive temperature range with same FBGA-256 footprint (vs EP3C10F256C8N)
- Cost-optimized logic capacity (vs EP3C25F256I7N)
설계 노트
The EP3C5F256A7N operates from a 1.2 V core supply; provide a low-noise LDO or DC-DC regulator capable of supplying up to 1 A transient current during configuration. Decouple the core with 100 nF ceramic capacitors placed within 5 mm of each VCCINT ball and add bulk 47 uF tantalum or polymer capacitors on the supply rail. Estimated: at 100% LE utilization the part can draw up to ~800 mA peak from VCCINT during global clock toggling - check the Cyclone III power estimator before finalizing the power tree.
The 256-ball FBGA (1.0 mm pitch) requires microvia or laser-drilled via-in-pad PCB technology for reliable assembly. Use 4-layer or 6-layer stack-up with continuous reference planes under the BGA to control characteristic impedance of LVDS and SSTL interfaces. Estimated: keep all signal trace lengths below 25 mm for DDR interfaces to remain within the device's setup/hold window; route matched clock pairs within 0.13 mm length tolerance. Include a JTAG header on every board for board-level testability.
Do not confuse the EP3C5F256A7N (5K LEs, automotive) with the EP3C5F256I7N (5K LEs, industrial); the A vs I grade prefix determines AEC-Q100 qualification. Configuration mode pins MSEL[3..0] must be set per the Cyclone III device datasheet for the chosen boot source (AS = 010, PS = 00, JTAG = 101). Pull nCONFIG high with a 10 kohm resistor and add a 1 nF cap to GND for clean power-on configuration. Confirm the bitstream size fits in the chosen serial flash before finalizing BOM.
Although the 65 nm low-power process keeps junction temperatures moderate, the FBGA-256 package still requires thermal vias under the central ball array for heat extraction. Estimated: under continuous toggling at 85% utilization, junction-to-ambient thermal resistance theta_JA on a 4-layer JEDEC test board is approximately 15 C/W - at +85 C ambient this implies ~15 C temperature rise. For sealed automotive enclosures, derive a custom thermal model and consider copper coin or heatsink attachment.
규정 준수 정보
RoHS-compliant lead-free FBGA-256 package; AEC-Q100 qualified per automotive 'A7' grade designation. REACH SVHC declaration available in manufacturer's material composition datasheet. Halogen-free status not explicitly confirmed in distributor listings.
