EP3C5U256C6 - Cyclone III FPGA, 5K LE, 256-UBGA | Intel / Altera
부품 번호: EP3C5U256C6 ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $18.5 | $18.50 |
| 10 | $16.2 | $162.00 |
| 100 | $14.05 | $1,405.00 |
| 500 | $12.4 | $6,200.00 |
| 1,000 | $10.85 | $10,850.00 |
EP3C5U256C6 개요
A Cyclone III FPGA is a programmable logic device that combines look-up tables (LUTs), embedded memory blocks, embedded multipliers, and a programmable interconnect fabric on a single low-power silicon die. Within the broader semiconductor taxonomy, FPGAs belong to programmable logic devices (PLDs), which sit alongside ASICs and microcontrollers as flexible digital-implementation alternatives. Cyclone III devices are widely used for I/O expansion, custom interface bridging, glue logic, and parallel DSP functions in cost-sensitive industrial, automotive, and consumer designs.
Key features of the EP3C5U256C6 include 5,136 logic elements, 423,936 embedded RAM bits organized in M9K blocks, 23 embedded 18x18 multipliers, four general-purpose PLLs, and 182 maximum user I/O pins. The device supports multiple I/O standards including LVDS, LVCMOS, LVTTL, SSTL, and HSTL, making it suitable for interfacing to external DDR/DDR2 memory devices via soft IP controllers. The U256 package exposes a high pin count in a small footprint suitable for space-constrained boards.
Built on a low-power process, Cyclone III devices offer static power consumption an order of magnitude lower than earlier Cyclone generations, allowing fanless operation in embedded designs. The architecture combines distributed and block RAM with dedicated multiplier blocks, enabling efficient implementation of DSP pipelines, video processing, and high-speed serial interface protocols when paired with external PHYs.
Typical applications include industrial motor control, video surveillance and image processing, automotive infotainment and driver-assistance subsystems, telecom line cards, and portable medical instrumentation. Engineers also use Cyclone III devices for I/O expansion around application processors and as cost-effective prototyping vehicles before ASIC conversion.
When designing with this device, verify that the Quartus II / Quartus Prime toolchain supports the U256 package variant in your software version, and confirm that the I/O bank voltage configuration matches the connected memory or peripheral standards. The U256 package has a fine 1.0 mm ball pitch, requiring ENIG surface finish and precise PCB fabrication tolerances.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone, giving engineers a one-stop reference for sourcing and substitution decisions.
드롭인 대체품: EP3C5U256C6 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP3C5U256C6 (동일 폼 팩터 및 풋프린트) — 차이점: Speed Grade, Package, Process Technology, Logic Elements, RoHS Status.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP3C5U256C6N
✅ 드롭인✓ 재고 있음
$25.4 / 개
데이터시트 보기 →EP3C5U256A7N
✅ 드롭인✓ 재고 있음
$16.2 / 개
데이터시트 보기 →EP3C10U256C6N
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
EP3C16U256C8N
✅ 드롭인✓ 재고 있음
$48.4 / 개
데이터시트 보기 →EP3C5U256C6 최대 정격 & 전기적 특성
| Series | Cyclone III |
| Logic Elements | 5,136 |
| Embedded Memory (RAM) | 423,936 bits |
| Maximum User I/O | 182 |
| 패키지 | 256-UBGA (U256, FineLine BGA) |
| Ball Pitch | 1.0 mm |
| Speed Grade | 6 (commercial) |
| 핀 수 | 256 |
| Embedded Multipliers (18x18) | 23 |
| General Purpose PLLs | 4 |
| Global Clock Networks | 10 |
| Supply Voltage (Core) | 1.2 V (typical) |
| 실장 유형 | Surface Mount (BGA) |
| RoHS 상태 | Lead-free / RoHS compliant |
EP3C5U256C6 256-ubga (u256, fineline bga) 핀 구성 가이드
EP3C5U256C6(256-ubga (u256, fineline bga) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP3C5U256C6.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP3C5U256C6 적합 용도: 6 애플리케이션s: Industrial Motor Control and Drive, Video Surveillance and Image Processing, Automotive Infotainment and Driver Assistance, Telecom Line Card Glue Logic, Portable Medical Instrumentation, I/O Expansion and Custom Interface Bridging.
Industrial Motor Control and Drive
The EP3C5U256C6 is well-suited for industrial motor control and variable-frequency drive (VFD) front-ends, where its 23 embedded 18x18 multipliers accelerate Park/Clarke transformations and SVPWM generation in real time. The 5,136 LEs accommodate multiple PID loops, encoder interface logic, and fault-handling state machines without external glue logic. With 182 user I/O, the device can simultaneously interface to resolver-to-digital converters, gate-driver PWM channels, and Modbus / CAN-FD fieldbus links. Low static power consumption typical of Cyclone III allows fanless sealed enclosures, while the 1.2 V core supply simplifies thermal budgets in continuous-duty machinery operating at -40C to +100C.
추천
Video Surveillance and Image Processing
In IP-camera and machine-vision front-ends, the EP3C5U256C6 implements Bayer demosaicing, motion detection, and JPEG/MJPEG compression pipelines using its on-chip M9K memory blocks and 23 hardware multipliers. The 423 Kbits of embedded RAM are sufficient to buffer at least one CIF frame plus several lines of HD video, while the 182 user I/O accept parallel sensor inputs and drive external DDR/DDR2 memory via soft IP. LVDS I/O support enables direct connection to high-speed image sensors. Engineers pair the EP3C5U256C6 with an external PHY to output Ethernet streams, making it a cost-effective solution for entry-level smart-camera designs.
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Automotive Infotainment and Driver Assistance
The EP3C5U256C6 supports automotive infotainment head units and entry-level ADAS subsystems, where its combination of 5,136 LEs and 182 I/O drives LVDS display panels, MOST or CAN-FD vehicle networks, and audio DSP preprocessing. The Cyclone III family is qualified to AEC-Q100 by many tier-1 suppliers and offers the long lifecycle that automotive OEMs require. Its 1.2 V core and low static power simplify thermal design in enclosed dashboard compartments. Designers implement H.264 encode/decode blocks in soft logic and use the embedded multipliers for audio equalization and acoustic echo cancellation, all within a single -40C to +125C operation envelope.
추천
Telecom Line Card Glue Logic
In telecom line cards and access equipment, the EP3C5U256C6 implements custom framing, TDM time-slot switching, and protocol conversion between legacy T1/E1, ISDN, and modern Ethernet backplanes. The 182 user I/O are sufficient to interface with multiple framers, LIU devices, and SPI/I2C management buses without external bus-expanders. Four general-purpose PLLs synthesize the precise clocks required for E1 (2.048 MHz) and T1 (1.544 MHz) line rates, plus higher-frequency Ethernet clocks. The device's BGA-256 package supports high-density board layouts for compact 1U / 2U shelf equipment.
추천
Portable Medical Instrumentation
Patient-monitoring and portable diagnostic instruments use the EP3C5U256C6 for ECG/EEG digital filtering, blood-oxygen saturation (SpO2) signal conditioning, and TFT display driving. The 5,136 LEs implement 50/60 Hz notch filters, FIR low-pass filters, and QRS-detection algorithms in soft logic, while the 23 embedded multipliers accelerate the multiply-accumulate operations central to DSP front-ends. Low static power consumption extends battery life in handheld pulse oximeters and ambulatory ECG recorders. The device supports both 3.3 V and 1.8 V I/O standards, allowing direct interface to low-power analog front-end ICs and color TFT displays without level shifters.
추천
I/O Expansion and Custom Interface Bridging
Around application processors and SoCs that lack specific peripheral interfaces, the EP3C5U256C6 functions as a flexible bridge, adding UART, SPI, I2S, I2C, PWM, GPIO, or custom parallel buses on demand. The 182 user I/O accommodate up to 23 octal-bus interfaces or 46 quad-SPI peripherals, while 4 PLLs synthesize any required clock domain. Designers implement custom protocols - such as proprietary display interfaces or legacy industrial buses - that no standard ASSP supports, in a fraction of the time and cost of an ASIC. The BGA-256 package keeps the bridge footprint small enough to fit alongside the host processor on most carrier boards.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP3C5U256C6 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP3C5U256C6N | EP3C5U256A7N | EP3C10U256C6N | EP3C16U256C8N | EP3C25F256I7N |
|---|---|---|---|---|---|---|
| Brand | Altera (Intel FPGA) | Altera (Intel FPGA) | Altera (Intel FPGA) | Altera (Intel FPGA) | Altera (Intel FPGA) | Altera (Intel FPGA) |
| Package | 256-UBGA | 256-UBGA (same) | 256-UBGA (same) | 256-UBGA (same) | 256-UBGA (same) | 256-FBGA (different ball layout) |
| Logic Elements | 5,136 | 5,136 (same) | 5,136 (same) | 10,320 | 15,408 | 24,624 |
| Embedded Memory (bits) | 423,936 | 423,936 (same) | 423,936 (same) | 423,936 | 516,096 | 608,256 |
| Maximum User I/O | 182 | 182 (same) | 182 (same) | 182 | 168 | 156 |
| Speed Grade | 6 (commercial) | 6 (same) | 7 (slower timing) | 6 (same) | 8 (slower timing) | 7 (industrial) |
| Embedded 18x18 Multipliers | 23 | 23 (same) | 23 (same) | 46 | 56 | 66 |
| Pin-to-Pin Compatible with EP3C5U256C6 | n/a (reference) | Yes (drop-in) | Yes (drop-in, slower speed) | Yes (drop-in upgrade) | Yes (drop-in upgrade) | No (different package ball layout) |
주요 차별점
- 5,136 LEs in a 256-ball UBGA package with only 1.0 mm pitch (vs EP3C5E144C8N)
- Speed grade 6 offers the fastest timing margin in the Cyclone III family (vs EP3C5U256A7N)
- 23 embedded 18x18 hardware multipliers accelerate DSP functions (vs EP3C16U256C8N (speed grade 8))
설계 노트
The 256-UBGA package uses a 1.0 mm ball pitch which demands precise PCB fabrication. Specify ENIG surface finish (not HASL) to ensure flat, coplanar pads; HASL variance can bridge adjacent balls on this fine-pitch device. Use laser-drilled microvias with 0.1 mm capture pads and 4 mil trace/space rules under the BGA for reliable fan-out. Provide at least 4 inner power/ground planes directly under the device for the 1.2 V core and decoupling-current return paths.
Cyclone III devices require a 1.2 V core rail, plus 2.5 V or 3.3 V VCCIO for I/O banks and a 3.3 V VCCAUX analog supply. Place 0.1 uF + 10 uF ceramic decoupling within 5 mm of each power pin; use a 4-layer stackup with dedicated VCCINT and GND planes. In-rush current during configuration can exceed 500 mA; ensure the regulator has at least 1 A of headroom on the 1.2 V rail and soft-start control to avoid false triggering of upstream UVLO circuits.
Estimated: at 100 percent logic utilization and 100 MHz toggle rate, the EP3C5U256C6 dissipates approximately 0.3 to 0.5 W of dynamic power plus 50 mW of static power. The U256 package's theta_JA is roughly 25 C/W on a JEDEC 4-layer test board, yielding a junction rise of about 12 C above ambient - well within the commercial 0C to +85C rating without a heatsink. For industrial temperature operation, derate by 10 percent margin and ensure adequate airflow.
Do not confuse speed grade 6 with industrial temperature - the trailing 'C' indicates commercial (0C to +85C) while 'I' indicates industrial (-40C to +100C). When migrating from a Cyclone II design, verify that your Quartus II version supports Cyclone III (version 6.1 or later); older projects may require IP recompilation. The U256 and F256 BGA packages share the same 256-ball footprint but have different ball assignments - check the package symbol in the device handbook before PCB layout.
규정 준수 정보
Cyclone III family is lead-free and RoHS compliant per Intel product declaration. The U256 package is supplied on trays (119 pcs/tray). AEC-Q100 not standard on Cyclone III commercial grade - select -I (industrial) or Cyclone IV E for automotive.
