EP3C80U484C8N - Cyclone III FPGA, 81K LE, 484-FBGA | Intel / Altera
부품 번호: EP3C80U484C8N ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $318.35 | $318.35 |
| 10 | $286.51 | $2,865.10 |
| 100 | $254.68 | $25,468.00 |
| 500 | $222.84 | $111,420.00 |
| 1,000 | $190.99 | $190,990.00 |
EP3C80U484C8N 개요
A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit composed of configurable logic blocks (CLBs), programmable interconnect, and embedded memory/DSP blocks that can be re-programmed after manufacturing to implement virtually any digital logic function. FPGAs occupy a unique position in the digital design hierarchy: above Application-Specific Integrated Circuits (ASICs) in flexibility but below microcontrollers and DSPs in per-unit cost, they serve as the prototypical programmable logic device (PLD) for parallel processing, hardware acceleration, and glue-logic bridging in modern electronic systems.
Key features of the EP3C80U484C8N include up to 295 user I/Os, 4 embedded PLLs for clock management, dedicated DSP blocks for high-speed multiplication, and support for external memory interfaces including DDR, DDR2, and QDRII SRAM. The Cyclone III architecture consumes up to 50% less power than the previous Cyclone II generation while delivering comparable logic density, making it attractive for power-constrained embedded designs.
At 1.2V core voltage and a maximum core frequency in the 200-400 MHz range (logic-dependent), the device balances performance and static power. The 484-FBGA package provides high-density I/O access with thermal-enhanced characteristics suitable for industrial temperature operation.
Typical applications include industrial motor control, video processing pipelines, telecom infrastructure bridges, ASIC prototyping, and embedded vision systems. The Cyclone III family is also widely deployed in test & measurement equipment and low-cost development platforms.
When designing with this device, ensure proper decoupling with 100nF + 10uF capacitors near each VCC pin, follow Intel's pin connection guidelines for unused I/Os, and configure configuration scheme (AS, PS, or JTAG) carefully for production boards.
This page synthesizes distributor pricing, drop-in alternatives from the same Cyclone III family, and practical design notes not aggregated on a single manufacturer page.
드롭인 대체품: EP3C80U484C8N — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP3C80U484C8N (동일 폼 팩터 및 풋프린트) — 차이점: Package, Process Technology, Speed Grade, Operating Temperature, PLLs.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP3C80U484C8
✅ 드롭인✓ 재고 있음
$66.85 / 개
데이터시트 보기 →EP3C80U484C7N
✅ 드롭인✓ 재고 있음
가격 문의
데이터시트 보기 →EP3C80U484C6N
✅ 드롭인✓ 재고 있음
$25.1 / 개
데이터시트 보기 →EP3C120F780C8N
✅ 드롭인✓ 재고 있음
가격 문의
데이터시트 보기 →EP3C120F484C8N
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
EP3C80U484C8N 최대 정격 & 전기적 특성
| Series | Cyclone III |
| Family | Cyclone III (low-power FPGA) |
| Logic Elements (LEs) | 81,264 |
| Total Memory Bits | 2,810,880 bits |
| Maximum User I/Os | 295 |
| Process Technology | 65 nm |
| Core Voltage | 1.2 V |
| Number of PLLs | 4 |
| 패키지 | 484-FBGA (UBGA) |
| 실장 유형 | Surface Mount |
| 동작 온도 | 0C to +85C (commercial) |
| Lead Free Status | Lead Free |
| RoHS 상태 | RoHS Compliant |
| Configuration Methods | AS, PS, JTAG |
| Embedded Memory Type | M9K blocks (RAM/ROM) |
EP3C80U484C8N 484-fbga (ubga) 핀 구성 가이드
EP3C80U484C8N(484-fbga (ubga) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP3C80U484C8N.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP3C80U484C8N 적합 용도: 6 애플리케이션s: Industrial Motor Control, Video Processing Pipeline, Telecom Infrastructure Bridge, ASIC Prototyping Platform, Test & Measurement Equipment, Embedded Vision Systems.
Industrial Motor Control
The EP3C80U484C8N fits industrial motor control because its 81,264 LEs and 295 user I/Os can host multi-axis field-oriented control (FOC) algorithms, encoder interfaces, and PWM generation in a single device. The four embedded PLLs provide precise clock generation for resolver excitation and ADC sampling, while the 2.8 Mbits of M9K memory buffer high-speed current/voltage feedback data with deterministic latency. Industrial designers benefit from the Cyclone III family's commercial 0C to +85C operation and RoHS-compliant lead-free assembly, which meets factory-automation environmental requirements. Power dissipation typically stays below 1.5W at moderate logic utilization, enabling fanless enclosure designs for cabinet-mounted drives.
추천
Video Processing Pipeline
The EP3C80U484C8N handles video bridging and processing because its parallel logic architecture and 295 I/Os can simultaneously drive LVDS-based camera interfaces, perform pixel-level processing, and output to HDMI/DVI encoders. The 2.8 Mbits of embedded memory supports line buffers for deinterlacing and color space conversion without external SRAM, reducing BOM cost. Embedded DSP blocks accelerate 2D filters and chroma keying in broadcast or surveillance applications. The 484-UBGA package's high pin density accommodates wide video buses (24/30/36-bit parallel) plus control interfaces, all on a single low-cost Cyclone III device rather than an expensive ASIC.
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Telecom Infrastructure Bridge
The EP3C80U484C8N serves telecom bridge applications because its high I/O count and Cyclone III architecture support protocols such as E1/T1, JESD204B framing, or custom serial backplanes without external PHY devices. The four PLLs provide frequency synthesis for multiple clock domains commonly found in carrier equipment, while the 2.8 Mbits of M9K memory store lookup tables and timing alignment buffers. Low power consumption relative to higher-density FPGAs makes the EP3C80 attractive for always-on equipment in central offices. Commercial temperature grade (0C to +85C) covers indoor telecom closet deployment.
추천
ASIC Prototyping Platform
The EP3C80U484C8N is widely deployed for ASIC prototyping because its 81,264 LEs, 295 I/Os, and rich memory resources can emulate complex System-on-Chip (SoC) designs for early software bring-up and verification. The Cyclone III family supports a mature Quartus II toolchain with comprehensive simulation libraries and example designs, shortening development cycles. Multiple EP3C80 devices can be ganged on a single board to emulate larger ASICs, with the 484-UBGA package supporting high-density board-level interconnect. Designers value the predictable timing closure at 200-300 MHz core speeds and the broad third-party IP ecosystem.
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Test & Measurement Equipment
The EP3C80U484C8N suits test and measurement because its parallel logic and 295 I/Os can drive multiple ADC/DAC channels simultaneously while executing DSP algorithms in real time. The four PLLs synthesize clocks for various ADC sample rates (10 MSPS to 250 MSPS), and the 2.8 Mbits of M9K memory buffer waveform captures for post-processing. The 65nm process delivers low deterministic jitter, critical for instrumentation-grade signal integrity. Compact bench-top instruments benefit from the Cyclone III family's low static power, reducing thermal design complexity in sealed enclosures.
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Embedded Vision Systems
The EP3C80U484C8N supports embedded vision because its parallel architecture excels at image preprocessing - pixel scaling, color correction, edge detection - before offloading final processing to an ARM-based host processor. The 295 user I/Os accept parallel MIPI-CSI bridge outputs or LVDS camera data while simultaneously driving TFT displays and external memory. The 2.8 Mbits of M9K blocks implement line buffers and convolution kernels at full frame rate. Cost-sensitive vision products, from smart appliances to industrial barcode scanners, leverage the EP3C80's balance of logic density and unit price.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP3C80U484C8N — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP3C80U484C8 | EP3C80U484C7N | EP3C80U484C6N | EP3C120F484C8N |
|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel |
| Package | 484-FBGA (UBGA) | 484-FBGA (UBGA) | 484-FBGA (UBGA) | 484-FBGA (UBGA) | 484-FBGA (FBGA, not UBGA) |
| Logic Elements | 81,264 LEs | 81,264 LEs | 81,264 LEs | 81,264 LEs | 119,088 LEs |
| Memory Bits | 2,810,880 bits | 2,810,880 bits | 2,810,880 bits | 2,810,880 bits | 3,981,312 bits |
| Maximum User I/Os | 295 | 295 | 295 | 295 | 283 |
| Speed Grade | -8 (fastest) | -8 (fastest) | -7 | -6 (slowest) | -8 |
| Core Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
| Process Technology | 65 nm | 65 nm | 65 nm | 65 nm | 65 nm |
| Number of PLLs | 4 | 4 | 4 | 4 | 4 |
주요 차별점
- Highest speed grade in the EP3C80 UBGA-484 family (vs EP3C80U484C7N)
- Highest logic density in the UBGA-484 Cyclone III package (vs EP3C55U484C8N)
- Lower cost per LE than the EP3C120 in the same ball count (vs EP3C120F484C8N)
설계 노트
Estimated: Cyclone III EP3C80U484C8N core power consumption at 100 MHz with 50% LE utilization and typical toggle rates is approximately 0.7-1.2W from the 1.2V VCCINT rail, plus 50-150mW per I/O bank from VCCIO. Use at least four 0.1uF decoupling capacitors per VCC pin placed within 5mm of each BGA ball, supplemented by 4-8 bulk 10uF capacitors around the package perimeter. Power sequencing requires VCCINT (1.2V) to ramp before VCCAUX (2.5V) per Intel power-up requirements to avoid latch-up.
The 484-UBGA package has a 1.0mm ball pitch requiring 6-layer PCB stack-up minimum with controlled-impedance routing for high-speed signals. Recommended microstrip stack-up: top signal/ground/power/power/ground/bottom signal. Use 0.4mm via-in-pad with filled and plated-over copper caps for BGA breakout. All BGA balls require X-ray inspection post-assembly; automated optical inspection (AOI) cannot verify hidden BGA joints.
Common pitfalls include: (1) failing to tie nCONFIG, nSTATUS, and CONF_DONE to VCCAUX via 10k pull-ups (causes random configuration failure); (2) leaving unused clock PLL pins floating instead of tying to ground; (3) mixing 1.5V and 1.8V VCCIO banks without verifying I/O standard compatibility; (4) using EP3C55 or EP3C40 as 'upgrade' paths - these are LOWER density, not higher. Always verify part number direction when scaling Cyclone III designs.
규정 준수 정보
Lead Free and RoHS Compliant per Altera/Intel datasheet. Not AEC-Q100 qualified (FPGAs typically not automotive-qualified unless explicitly stated).