EP3SE260F1152I3 - 255K LE Stratix III E FPGA, 1152-FBGA | Intel
부품 번호: EP3SE260F1152I3 ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $18124.4 | $18,124.40 |
| 10 | $17950 | $179,500.00 |
| 100 | $17500 | $1,750,000.00 |
| 500 | $17000 | $8,500,000.00 |
| 1,000 | $16500 | $16,500,000.00 |
EP3SE260F1152I3 개요
An FPGA is a semiconductor device built around an array of configurable logic blocks (CLBs/LABs), programmable interconnect, embedded memory, and hardened I/O serdes. The Stratix III generation (introduced by Altera in 2007, now under Intel) targets the lowest-power high-performance 65-nm tier, with the 'E' enhanced sub-family adding extra DSP and memory resources for DSP-intensive designs. FPGAs sit hierarchically under programmable logic -> logic devices -> integrated circuits -> semiconductors, and are commonly used as hardware accelerators, co-processors, or full system controllers alongside CPUs and ASICs.
Key features of the EP3SE260F1152I3 include 10,200 LABs/CLBs, 255,000 logic elements, 16,672,768 bits (approximately 16.7 Mbit) of embedded RAM, 768 embedded multipliers for DSP operations, and a 500 MHz core fabric performance. The 1152-pin FC-FBGA package exposes 744 user I/O pins, supports high-speed LVDS, DDR2/DDR3 memory interfaces, and integrates up to 12 transceivers depending on the speed grade. The 'I' speed grade and '3' device identifier correspond to the industrial temperature range and a specific speed bin per the Stratix III nomenclature.
The Stratix III architecture combines adaptive logic modules (ALMs), TriMatrix embedded memory blocks (MLAB, M9K, M144K), and DSP blocks with a hierarchical routing fabric. The 65-nm process node provides a balance between leakage and dynamic power, and Altera's Programmable Power Technology allows unused blocks to be powered down, enabling a 40% power reduction versus prior generations.
Typical applications for this part include high-speed digital signal processing, telecommunications line cards, radar baseband processing, ASIC prototyping, broadcast video processing, and high-end test and measurement instrumentation. Engineers select EP3SE260F1152I3 when a design requires dense logic, large memory, and industrial temperature assurance in a single chip.
Designers should note that the EP3SE260F1152I3 is a large, power-hungry part; PCB design must use a multi-layer stackup with extensive power and ground planes to maintain signal integrity across 744 I/Os at 500 MHz fabric speeds. Decoupling and thermal management are non-trivial; consult the Stratix III handbook for board design guidelines before committing the device to a layout.
This page synthesizes distributor pricing, same-package alternative FPGAs, and practical board-design notes not collated in the manufacturer datasheet, helping engineers evaluate replacement and second-source options for this Stratix III E variant.
드롭인 대체품: EP3SE260F1152I3 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP3SE260F1152I3 (동일 폼 팩터 및 풋프린트) — 차이점: Package, Speed Grade, Core Voltage, Operating Temperature, Series.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP3SE260F1152C4N
✅ 드롭인✓ 재고 있음
$1620 / 개
데이터시트 보기 →EP3SE260F1152C3N
✅ 드롭인✓ 재고 있음
$7500 / 개
데이터시트 보기 →EP3SE260F1152C2N
✅ 드롭인✓ 재고 있음
$11000 / 개
데이터시트 보기 →EP3SE260F1152C2G
✅ 드롭인✓ 재고 있음
$2050 / 개
데이터시트 보기 →EP3SE260F1152I3N
✅ 드롭인✓ 재고 있음
$3360 / 개
데이터시트 보기 →EP3SE260F1152I4LN
✅ 드롭인✓ 재고 있음
$3520 / 개
데이터시트 보기 →EP3SE260F1152I3 최대 정격 & 전기적 특성
| Series | Stratix III E (EP3SE260) |
| Logic Elements | 255,000 |
| Number of LABs/CLBs | 10,200 |
| Total RAM Bits | 16,672,768 |
| User I/O Count | 744 |
| Number of Embedded Multipliers (DSP blocks) | 768 |
| Core Voltage | 1.1 V |
| 동작 온도 | -40C to +100C (Industrial) |
| Process Technology | 65 nm |
| Maximum Fabric Frequency | 500 MHz |
| 패키지 | 1152-BBGA, FC-FBGA (Flip-Chip) |
| 실장 유형 | Surface Mount |
| Speed Grade | I3 (Industrial, speed bin 3) |
| Product Status | Obsolete (per Xecor comparator) |
EP3SE260F1152I3 1152-bbga, fc-fbga (flip-chip) 핀 구성 가이드
EP3SE260F1152I3(1152-bbga, fc-fbga (flip-chip) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP3SE260F1152I3.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP3SE260F1152I3 적합 용도: 6 애플리케이션s: Telecommunications Line Card Signal Processing, ASIC Prototyping and Emulation, Radar Baseband Processing, Broadcast Video Processing and Encoding, High-End Test and Measurement Instrumentation, Industrial Automation Controllers.
Telecommunications Line Card Signal Processing
The EP3SE260F1152I3 fits telecommunications line card signal processing because its 255,000 logic elements and 768 embedded DSP multipliers provide the parallel arithmetic throughput needed for multi-channel channel-card functions such as FFT/iFFT, FEC decoding, and packet classification. Its 744 user I/Os and high-speed LVDS capability let designers land multiple SFP/QSFP interfaces, backplane SerDes, and external memory buses directly on the device, removing the need for a companion bridge chip. Performance consideration: at 500 MHz fabric, the FPGA comfortably hits common telecom clock rates while keeping per-channel power manageable. Designers typically pair the device with DDR2 or DDR3 external memory; the Stratix III E controller IP supports these natively, allowing the FPGA to absorb packet buffering without external SRAM.
추천
ASIC Prototyping and Emulation
The EP3SE260F1152I3 is widely used for ASIC prototyping because its 255K logic-element capacity can map large SoC designs partition-by-partition, while the 16,672,768 bits of embedded RAM provide sufficient on-chip scratchpad memory for verification patterns. The 1152-ball FC-FBGA package exposes 744 user I/Os which, when multiplexed, let engineers break out hundreds of ASIC signals to external test logic. Performance consideration: the Stratix III E architecture is well-supported by Synopsys VCS, Cadence NC-Verilog, and Mentor Questa, and the device's full JTAG and configuration chain allow fast multi-FPGA debug. For very large ASICs, multiple EP3SE260F1152I3 boards can be stacked or cabled together via the high-speed LVDS pins.
추천
Radar Baseband Processing
The EP3SE260F1152I3 suits radar baseband processing where pulse compression, MTI filtering, and CFAR detection are implemented as parallel DSP pipelines. The device's 768 embedded multipliers (each 18x18) give it the parallel MAC capacity to process multiple radar returns simultaneously, and its industrial -40C to +100C temperature range allows placement in outdoor or vehicle-mounted radar enclosures without derating. Performance consideration: at 500 MHz fabric speed the device comfortably hits common radar PRF rates while consuming measurable but acceptable power at high toggle rates. Designers typically pair the FPGA with external ADC and DAC converters via LVDS, using the Stratix III E's hard SerDes blocks to minimize latency in the receive path.
추천
Broadcast Video Processing and Encoding
The EP3SE260F1152I3 is suitable for broadcast video processing because its 255,000 logic elements and 16 Mbit of embedded memory can hold multiple video frames at SD/HD resolution, while 768 DSP blocks accelerate motion estimation, deinterlacing, and real-time codec functions. The 744 user I/Os accommodate multiple SDI/HDMI input/output channels without external muxing. Performance consideration: the FC-FBGA package's flip-chip construction provides the signal-integrity margin needed to drive multi-gigabit SDI links. Designers commonly instantiate the device in broadcast switchers, video servers, and contribution encoders, where its industrial temperature grade is valuable in 24/7 rack environments with restricted airflow.
추천
High-End Test and Measurement Instrumentation
The EP3SE260F1152I3 fits high-end test and measurement instruments where waveform generation, protocol-aware triggering, and on-board signal analysis must run in real time. Its large logic capacity and DSP block count allow designers to implement deep acquisition memories, FFT-based spectrum analysis, and protocol decoders (PCIe, USB, Ethernet) inside the FPGA, eliminating host CPU latency. Performance consideration: the device's 1.1 V core and 65 nm process produce moderate dynamic power at 500 MHz, so careful thermal design (heatsink, airflow) is required for benchtop instruments. The industrial temperature grade makes it suitable for portable and field-deployed test gear used outside temperature-controlled labs.
추천
Industrial Automation Controllers
The EP3SE260F1152I3 is appropriate for high-end industrial automation controllers that must combine deterministic motion control, machine vision preprocessing, and multi-axis servo loop closure on a single chip. The 744 user I/Os accept numerous encoder, limit-switch, and opto-isolated inputs without external mux, while the 768 DSP blocks accelerate real-time vision pipeline stages such as convolution, edge detection, and object tracking. Performance consideration: the -40C to +100C industrial temperature range allows the controller to be placed near motors, drives, and other heat sources without active cooling. Designers frequently pair the FPGA with external DDR2 memory for image buffering and rely on the Stratix III E's hard PCI Express block to talk to supervisory CPUs.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP3SE260F1152I3 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP3SE260F1152C4N | EP3SE260F1152C3N | EP3SE260F1152C2N | EP3SE260F1152C2G | EP3SE260F1152I3N |
|---|---|---|---|---|---|---|
| Package | 1152-FBGA (FC-FBGA) | 1152-FBGA (FC-FBGA) - same | 1152-FBGA (FC-FBGA) - same | 1152-FBGA (FC-FBGA) - same | 1152-FBGA (FC-FBGA) - same | 1152-FBGA (FC-FBGA) - same |
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 255,000 | 255,000 | 255,000 | 255,000 | 255,000 | 255,000 |
| Temperature Grade | Industrial (-40C to +100C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Industrial (-40C to +100C) |
| Speed Grade | I3 | C4 (fastest commercial) | C3 | C2 (slowest commercial) | C2 (slowest commercial) | I3 (same as this part) |
| Embedded RAM (bits) | 16,672,768 | 16,672,768 | 16,672,768 | 16,672,768 | 16,672,768 | 16,672,768 |
| User I/O Count | 744 | 744 | 744 | 744 | 744 | 744 |
| Embedded Multipliers (DSP blocks) | 768 | 768 | 768 | 768 | 768 | 768 |
| Core Voltage | 1.1 V | 1.1 V | 1.1 V | 1.1 V | 1.1 V | 1.1 V |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
주요 차별점
- Industrial temperature grade for harsh environments (vs EP3SE260F1152C4N)
- Pin-compatible lead-free option with identical specifications (vs EP3SE260F1152I3N)
- Faster speed bin within the same industrial grade (vs EP3SE260F1152I4LN)
설계 노트
The 1152-ball FC-FBGA package of EP3SE260F1152I3 demands a multi-layer PCB stackup (typically 8 to 12 layers) with continuous ground and power planes to provide a low-impedance return path for 744 high-speed I/Os operating into the hundreds of MHz. Per Intel's Stratix III Handbook, use 1-oz copper for outer layers and reference every signal trace to an unbroken plane; via-in-pad with filled and plated-over vias is recommended for the BGA breakouts to keep the breakout region inductance below 0.5 nH. Failure to observe stackup and breakout guidelines commonly results in signal-integrity failures that are invisible until volume production.
Estimated: at 500 MHz fabric speed with typical toggle rates, the EP3SE260F1152I3 dissipates 8 to 15 W depending on design activity. Using the published theta_JA value (not in the verified dataset; treat as typical ~0.5 C/W with proper heatsink), the junction-to-ambient thermal resistance of the FC-FBGA package must be reduced via a thermal interface material, a bonded heatsink, and at least 200 LFM of airflow to keep Tj below 100C in the industrial temperature range. Without active cooling, designs often trigger thermal shutdown at room temperature when utilization exceeds 70 percent. Always verify the actual theta_JA from the datasheet package thermal model before committing to a mechanical design.
The EP3SE260F1152I3 requires multiple supply rails: 1.1 V for the core, 1.1 V or 1.2 V for PLL analog, 1.5 V/1.8 V/2.5 V/3.3 V for I/O banks, and a 3.3 V auxiliary supply. Per the Stratix III Handbook, each rail needs a dedicated decoupling network with a 100 uF bulk capacitor, a 10 uF ceramic, and 0.1 uF/0.01 uF high-frequency ceramics placed within 100 mil of every BGA supply pin. Power sequencing requirements must be observed (core before I/O) to prevent latch-up; an integrated sequencer such as the Altera/Intel Enpirion power family simplifies compliance.
Because EP3SE260F1152I3 is obsolete, never trust a single distributor's inventory check before committing a design to production - the part's franchise supply is finite and may be exhausted without notice. Always qualify at least two independent sources and maintain a documented migration path to a Stratix IV or Stratix V FPGA, which require PCB redesign but are still supported by Intel. Also, observe JTAG chain configuration carefully when using multiple FPGAs - the EP3SE260F1152I3's TCK frequency must be reduced when long JTAG chains are present, otherwise configuration failures occur at first power-up.
규정 준수 정보
RoHS and lead-free status not present in the verified web data; the EP3SE260F1152I3N variant exists as an explicitly lead-free option, indicating the family supports both leaded and lead-free finishes. The part is an FPGA and AEC-Q100 qualification is not applicable to FPGAs of this generation.
