EP3SE260F1152I4L - 255K Logic Elements FPGA | Intel / Altera
부품 번호: EP3SE260F1152I4L ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $32662.06958 | $32,662.07 |
| 10 | $0 | $0.00 |
| 100 | $0 | $0.00 |
| 500 | $0 | $0.00 |
| 1,000 | $0 | $0.00 |
EP3SE260F1152I4L 개요
A field-programmable gate array, or FPGA, is a programmable semiconductor containing configurable logic blocks, interconnect, memory blocks, and I/O resources. It occupies a position between fixed-function ASICs and discrete processor or logic systems: hardware functions can be changed after manufacturing without producing a new IC. Within the hierarchy, this FPGA is a programmable logic device, an integrated circuit, and ultimately a semiconductor used to implement digital acceleration, interface bridging, protocol handling, and embedded control.
The headline capacity of 255,000 logic elements supports substantial parallel datapaths, while 16,672,768 embedded memory bits provide on-chip storage for buffers, lookup tables, packet data, and control structures. Its 744 I/Os support large systems requiring many external interfaces. The 1152-terminal FCBGA arrangement is intended for high-pin-count board designs, and a second verified listing describes the physical package as 1152-FBGA measuring 35 mm by 35 mm.
Architecturally, the part is identified as a Stratix III E FPGA with 10,200 LABs and 65 nm technology. These features place it within a conventional SRAM-based FPGA generation where logic functions and routing are configured through programmable resources. The combination of capacity, embedded memory, and I/O count allows a system designer to consolidate control logic, data processing, and interface functions into one configurable platform.
Typical uses include high-performance communications equipment, industrial automation, test and measurement, image or video processing, and protocol-oriented data acquisition. A 744-I/O budget can be valuable where an FPGA must aggregate many parallel channels or connect multiple downstream devices. The 0.9 V supply and 65 nm process are relevant to power-distribution design, configuration management, thermal analysis, and selection of compatible legacy development tools.
Board design should follow the complete manufacturer pinout and the manufacturer's power-supply sequencing and decoupling guidance. Because this is a 1152-pin FCBGA component, controlled-impedance routing, complete ground-reference continuity, reliable power delivery, and appropriate thermal analysis are essential. Exact signal functions, package-ball names, timing limits, transceiver details, and configuration requirements remain datasheet-dependent.
This page consolidates verified distributor specifications, current unit pricing, package details, datasheet access, and a conservative drop-in comparison. Where the available cross-reference data does not prove pin-to-pin compatibility, no unverified substitute is presented as a drop-in replacement.
드롭인 대체품: EP3SE260F1152I4L — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP3SE260F1152I4L (동일 폼 팩터 및 풋프린트) — 차이점: Package, Speed Grade, Process Technology, Core Voltage, Embedded Memory.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP3SE260F1152I4
✅ 드롭인✓ 재고 있음
$1750 / 개
데이터시트 보기 →EP3SE260F1152I3
✅ 드롭인✓ 재고 있음
$16500 / 개
데이터시트 보기 →EP3SE260F1152I3N
✅ 드롭인✓ 재고 있음
$3360 / 개
데이터시트 보기 →EP3SE260F1152I3G
✅ 드롭인✓ 재고 있음
$1240 / 개
데이터시트 보기 →EP3SE110F1152I4L
✅ 드롭인✓ 재고 있음
$4317.9 / 개
데이터시트 보기 →EP3SE260F1152I4L 최대 정격 & 전기적 특성
| Product Type | Field-Programmable Gate Array (FPGA) |
| Series | Stratix III E |
| Logic Elements | 255000 |
| Embedded Memory | 16672768 bit |
| Logic Array Blocks | 10200 LAB |
| User I/O Count | 744 |
| Core Voltage | 0.9 V |
| Supply Voltage Range | 0.86 V to 1.15 V |
| Process Technology | 65 nm |
| Reported Clock Frequency | 375 MHz |
| 패키지 | 1152-BBGA, FCBGA |
| Alternative Package Description | 1152-FBGA, 35 mm x 35 mm |
| 핀 수 | 1152 |
| 실장 유형 | Surface Mount |
| Manufacturer | Intel / Altera |
EP3SE260F1152I4L 1152-fbga, 35 mm x 35 mm 핀 구성 가이드
EP3SE260F1152I4L(1152-fbga, 35 mm x 35 mm 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP3SE260F1152I4L.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP3SE260F1152I4L 적합 용도: 6 애플리케이션s: Communications Infrastructure, Industrial Automation, Test and Measurement, Video and Image Processing, High-Speed Data Acquisition, Legacy Embedded Control.
Communications Infrastructure
EP3SE260F1152I4L fits communications infrastructure that needs substantial programmable logic and a large number of external connections. The device provides 255,000 logic elements, 16,672,768 embedded memory bits, and 744 I/Os, allowing parallel protocol processing, packet buffering, and interface aggregation in one FPGA. Its Stratix III E architecture can be configured for control-plane functions, data-path logic, and legacy interface conversion. The 0.9 V supply and 65 nm process make power integrity and signal integrity important, while the obsolete lifecycle status requires a supply-chain review. Use the manufacturer configuration and timing documentation before production.
추천
Industrial Automation
EP3SE260F1152I4L is appropriate for industrial automation controllers that require deterministic programmable logic and many field connections. Its 10,200 LABs and 744 I/Os can support motor-control sequencing, machine vision interfaces, timing logic, sensor aggregation, and safety-related control partitioning. The 16,672,768 memory bits provide storage for lookup tables, buffers, and protocol state information. The 1152-pin FCBGA package is a high-density surface-mount design that requires a controlled-impedance PCB, complete power distribution, and careful thermal analysis. Because the supplied data does not confirm temperature or compliance ratings, verify industrial-environment requirements before use.
추천
Test and Measurement
EP3SE260F1152I4L can serve as a configurable processing and control platform in test and measurement equipment. The combination of 255,000 logic elements and 16,672,768 memory bits supports waveform formatting, trigger logic, data reduction, timing generation, and instrument-interface processing. Its 744 I/Os are useful when the instrument must coordinate multiple ADCs, DACs, sensors, displays, or communication ports. The 65 nm Stratix III E process and 0.9 V supply emphasize clean power and deterministic clock distribution. The verified data does not include detailed timing or thermal limits, so the FPGA must be qualified using the complete manufacturer datasheet and the intended measurement accuracy requirements.
추천
Video and Image Processing
EP3SE260F1152I4L is suitable for legacy video and image-processing systems that need high-density programmable datapaths. The FPGA can be configured to implement pixel pipelines, frame buffering, filtering, format conversion, timing generation, and interface adaptation. The verified capacity of 16,672,768 embedded memory bits is useful for line buffers, lookup tables, and small frame stores, while 744 I/Os support multiple parallel data and control interfaces. The device is not a substitute for a modern image-processing SoC, and the obsolete status may limit long-term support. Existing designs should retain verified clock constraints, memory interfaces, and package-ball assignments before any redesign or procurement decision.
추천
High-Speed Data Acquisition
EP3SE260F1152I4L fits high-speed data-acquisition systems that need configurable capture, buffering, and preprocessing. Its 255,000 logic elements and 10,200 LABs can implement multiple parallel acquisition channels, digital filtering, decimation, packetization, and time-stamping functions. The 16,672,768 embedded memory bits provide local storage for transient buffers and data formatting, while 744 I/Os help interface to converters, clocks, control devices, and host systems. The device uses a 0.9 V core supply according to verified listings, so power integrity and decoupling are central to stable operation. Exact converter compatibility, timing performance, and signal-integrity constraints must be verified from the device documentation.
추천
Legacy Embedded Control
EP3SE260F1152I4L is a practical fit for maintaining legacy embedded-control platforms already designed around the Stratix III E family. It can consolidate state machines, protocol handlers, memory interfaces, timing logic, and application-specific datapaths while preserving a familiar FPGA design flow. The 1152-pin FCBGA package makes it best suited to an existing board or a controlled redesign rather than a new low-cost platform. The 65 nm process and 0.9 V supply should be handled according to the original manufacturer design guidance, including power sequencing and thermal management. Before extending production, verify available inventory, software support, and any required obsolescence or longevity plan.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP3SE260F1152I4L — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP3SE260F1152I4 | EP3SE260F1152I3 | EP3SE260F1152I3N | EP3SE260F1152I3G | EP3SE110F1152I4L |
|---|---|---|---|---|---|---|
| Package | 1152-BBGA, FCBGA | 1152-BBGA, FCBGA | 1152-BBGA, FCBGA | 1152-BBGA, FCBGA | 1152-BBGA, FCBGA | 1152-BBGA, FCBGA |
| Brand | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera |
| Series | Stratix III E | Stratix III E | Stratix III E | Stratix III E | Stratix III E | Stratix III E |
| Process Technology | 65 nm | 65 nm | 65 nm | 65 nm | 65 nm | 65 nm |
주요 차별점
- High verified logic capacity (vs EP3SE110F1152I4L)
- Large user-I/O resource (vs EP3SE110F1152I4L)
- High embedded-memory density (vs EP3SE110F1152I4L)
- Targeted legacy Stratix III E platform (vs EP3SE260F1152I3)
설계 노트
Use a 0.9 V core supply for EP3SE260F1152I4L, while recognizing that the supplied data also reports a 0.86 V to 1.15 V supply range. This range is a system-design fact from the part listing, not permission to select any voltage without checking the manufacturer operating conditions. Confirm the exact rail tolerances, current requirements, power-up sequence, and I/O-bank voltages from the manufacturer datasheet. Place local decoupling at the package power pins and maintain a low-impedance ground reference.
The 1152-pin FCBGA package requires a fan-out strategy that preserves continuous ground and power planes beneath the device. Escape each BGA row with the smallest practical via and trace arrangement, then use the FPGA design-software pin information to separate power, configuration, clock, transceiver, and user-I/O routes. The supplied evidence confirms the package family and 35 mm by 35 mm description, but it does not include a complete ball map. Do not begin PCB fabrication from an assumed pinout.
Thermal analysis is required for EP3SE260F1152I4L, especially when using its 255,000 logic elements and 744 I/Os at high activity. The verified data does not provide power dissipation, junction temperature, thermal resistance, or airflow guidance, so those values must be obtained from the manufacturer documentation rather than estimated. Use a complete board-level model, provide an appropriate thermal path, and verify that the selected heat-spreader or enclosure solution keeps every FPGA and power component within its allowed operating range.
Do not select a replacement solely because it is another Stratix III E device with a similar MPN. EP3SE260F1152I4, EP3SE260F1152I3, EP3SE260F1152I3N, EP3SE260F1152I3G, and EP3SE110F1152I4L are listed as related candidates, but the supplied evidence does not fully prove identical speed, temperature, ordering, or pin behavior. Obtain the full manufacturer package drawing, ordering-code definition, and migration guidance before making a drop-in claim. Also validate the legacy toolchain and configuration memory requirements.
규정 준수 정보
The supplied verified data does not establish RoHS, REACH, AEC-Q100, lead-free, halogen-free, or conflict-minerals status. AEC-Q100 is not applicable to the supplied product classification evidence, but formal qualification status is not documented.