EP3SE50F780C2 - Stratix III E FPGA, 47.5K LE, 780-FCBGA | Intel
부품 번호: EP3SE50F780C2 ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $1576.45 | $1,576.45 |
| 10 | $1500 | $15,000.00 |
| 100 | $1395 | $139,500.00 |
| 500 | $1295 | $647,500.00 |
| 1,000 | $1195 | $1,195,000.00 |
EP3SE50F780C2 개요
An FPGA (Field Programmable Gate Array) is a programmable logic device that engineers configure after manufacturing using a hardware description language. Stratix III E FPGAs belong to the broader category of programmable logic devices (PLDs) and sit within the hierarchy: FPGA -> programmable logic -> digital IC -> semiconductor. They are widely used when ASIC-level performance is required but design iteration flexibility is also essential.
Key features of the EP3SE50F780C2 include 1,900 LABs/CLBs, 5.76 Mbits embedded block RAM, 384 DSP blocks (18x18 multipliers) for high-throughput signal processing, and support for DDR3/DDR2/QDR II+/RLDRAM II external memory interfaces. The Stratix III E architecture also integrates a rich fabric of PLLs and clock networks for multi-domain timing closure.
Typical applications span telecom baseband processing, high-speed image and video processing pipelines, ASIC prototyping, military/aerospace signal processing, broadcast video encoding, and high-performance computing accelerators. The device's 600 MHz fabric speed combined with 384 DSP blocks enables real-time DSP workloads such as radar pulse compression, OFDM modulation, and forward-error correction.
When designing with the EP3SE50F780C2, careful PCB layout is required for the 780-ball flip-chip BGA: 12 transceiver channels must each have controlled-impedance differential routing, and the 1.1 V core requires multiple low-impedance decoupling capacitors near the dedicated supply balls. Engineers should use the Quartus II design suite with the Stratix III device library to ensure timing closure.
A typical Stratix III E reference design includes high-speed serial transceivers running at multi-gigabit rates, DDR3 controllers with PHY IP, and partial reconfiguration regions. This product page synthesizes current distributor pricing, pin-compatible drop-in alternatives, and application-level design notes that go beyond the manufacturer datasheet alone.
드롭인 대체품: EP3SE50F780C2 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP3SE50F780C2 (동일 폼 팩터 및 풋프린트) — 차이점: Package, Operating Temperature, Embedded Memory, Speed Grade, Family.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP3SE50F780I2
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
EP3SE110F780C2
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$4350 / 개
데이터시트 보기 →EP3SL50F780C2N
✅ 드롭인✓ 재고 있음
$312 / 개
데이터시트 보기 →EP3SE50F780C3
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$890 / 개
데이터시트 보기 →EP3SE50F780C4N
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$1430 / 개
데이터시트 보기 →EP3SE50F780C2 최대 정격 & 전기적 특성
| Family | Stratix III E |
| Manufacturer | Intel (formerly Altera) |
| Logic Elements (LE) | 47,500 |
| LABs / CLBs | 1,900 |
| Total Memory Bits | 5,760,000 |
| User I/O Count | 488 |
| DSP Blocks (18x18 multipliers) | 384 |
| Core Voltage | 1.1 V |
| Process Technology | 65 nm |
| Operating Frequency | Up to 600 MHz |
| 패키지 | 780-BBGA, FC-FBGA |
| 실장 유형 | Surface Mount |
| Number of Pins / Terminals | 780 |
| Form of Terminal | Ball |
| Package Code | BGA |
| Operating Temperature Grade | Commercial (C2) |
EP3SE50F780C2 bga 핀 구성 가이드
EP3SE50F780C2(bga 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP3SE50F780C2.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP3SE50F780C2 적합 용도: 6 애플리케이션s: Telecom Baseband Processing, High-Speed Image and Video Processing Pipelines, ASIC Prototyping and Emulation, Military/Aerospace Signal Processing, Broadcast Video Encoding and Transmission, High-Performance Computing Accelerators.
Telecom Baseband Processing
The EP3SE50F780C2 fits telecom baseband processing because its 47,500 logic elements, 384 DSP blocks (18x18 multipliers), and 5.76 Mbits embedded block RAM deliver the throughput needed for multi-carrier DSP chains at 600 MHz fabric speed. The 488 user I/Os and 12 transceiver channels provide the I/O bandwidth required for CPRI/OBSAI fronthaul and backhaul interfaces. Placed on a baseband card with external DDR3 controllers, it implements channel cards, FFT/iFFT engines, and forward-error-correction (FEC) decoders with deterministic latency. Compared to DSP-only solutions, the Stratix III E architecture allows concurrent DSP and control-plane logic on a single device, reducing BOM cost.
추천
High-Speed Image and Video Processing Pipelines
The EP3SE50F780C2 is well-suited for image and video processing because its 384 dedicated DSP blocks execute parallel pixel-rate arithmetic and 5.76 Mbits of block RAM buffer full HD frame lines in real time. Per the Stratix III E family datasheet, the device supports DDR3/DDR2/QDR II+/RLDRAM II external memory interfaces at hundreds of megahertz, enabling line buffers and frame stores. Placed between a camera sensor input and a display output, the FPGA performs color-space conversion, scaling, sharpening, and overlay composition at video pixel rate. Designers benefit from reduced system BOM versus discrete DSP plus ASIC implementations.
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ASIC Prototyping and Emulation
The EP3SE50F780C2 is widely used for ASIC prototyping because its 47,500 logic elements and abundant block RAM allow partition of multi-million-gate ASIC designs across multiple Stratix III E devices. The 780-FCBGA package exposes 488 I/Os for chip-to-chip interconnect bridges, while the 600 MHz fabric speed enables full-speed RTL validation before tape-out. The Quartus II design suite provides synthesis and partitioning tools optimized for multi-FPGA ASIC prototyping. Compared to ASIC tape-out, multi-FPGA prototyping cuts validation cost and time to under $1/prototype at small quantities.
추천
Military/Aerospace Signal Processing
The EP3SE50F780C2 (commercial grade) and its industrial-temp sibling EP3SE50F780I2 serve military/aerospace signal processing applications where deterministic DSP performance and abundant logic density are required. Per Stratix III E datasheet, the 65 nm process and 1.1 V core operate reliably in ruggedized enclosures when paired with appropriate thermal management. Placed on a ruggedized signal-processing card, the FPGA performs radar pulse compression, electronic-warfare channelization, and secure modem DSP workloads. Designers can layer cryptographic and DSP functions concurrently, and the device's BGA package suits conformal-coated military PCBs.
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Broadcast Video Encoding and Transmission
The EP3SE50F780C2 fits broadcast video encoding because its 384 DSP blocks implement H.264/AVC or HEVC encoding pipelines at real-time rates for SD/HD streams. The 488 user I/Os provide connectivity to broadcast SDI inputs/outputs and ASI/TS multiplexers. The 5.76 Mbits embedded memory supports macroblock line buffers required for motion estimation. Placed on an encoder card with external DDR3 frame buffers, the FPGA achieves broadcast-grade encoding at lower latency than software-only implementations. Compared to discrete DSP plus CPU, the Stratix III E reduces system latency and bill-of-materials cost.
추천
High-Performance Computing Accelerators
The EP3SE50F780C2 serves HPC accelerator roles because its 47,500 logic elements and 384 DSP blocks deliver co-processing throughput alongside CPUs. The 488 user I/Os provide multiple high-speed PCIe or serial transceiver links for host-to-accelerator data movement. Per Stratix III E documentation, the 600 MHz fabric speed allows custom SIMD engines and FFT accelerators to offload compute from the host CPU. Placed on a coprocessor card with DDR3/QDR II+ memory, the FPGA delivers per-card floating-point throughput measured in tens of GFLOPS. Designers benefit from reprogrammable hardware that adapts to new workloads without ASIC redesign.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP3SE50F780C2 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP3SE50F780I2 | EP3SE110F780C2 | EP3SL50F780C2N | EP3SE50F780C3 | EP3SE50F780C4N |
|---|---|---|---|---|---|---|
| Package | 780-BBGA, FC-FBGA | 780-BBGA, FC-FBGA - same | 780-BBGA, FC-FBGA - same | 780-BBGA, FC-FBGA - same | 780-BBGA, FC-FBGA - same | 780-BBGA, FC-FBGA - same |
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 47,500 | 47,500 | ~110,000 (+131%) | 47,500 | 47,500 | 47,500 |
| DSP Blocks | 384 | 384 | 896 (+133%) | 384 | 384 | 384 |
| Embedded Memory (bits) | 5,760,000 | 5,760,000 | ~13,500,000 | 5,760,000 | 5,760,000 | 5,760,000 |
| Speed Grade | C2 (commercial) | I2 (industrial temp) | C2 (commercial) | C2 (low power) | C3 (faster) | C4 (fastest) |
| Operating Temperature | Commercial 0C to +85C | Industrial -40C to +100C | Commercial 0C to +85C | Commercial 0C to +85C | Commercial 0C to +85C | Commercial 0C to +85C |
| Process / Core Voltage | 65 nm / 1.1 V | 65 nm / 1.1 V | 65 nm / 1.1 V | 65 nm / 1.1 V (low power) | 65 nm / 1.1 V | 65 nm / 1.1 V |
주요 차별점
- Drop-in industrial-temp variant available (vs EP3SE50F780I2)
- Higher-density same-package upgrade path (vs EP3SE110F780C2)
- Low-power same-pinout variant (vs EP3SL50F780C2N)
설계 노트
The 780-ball FC-FBGA package requires controlled-impedance routing for the 12 high-speed transceiver channels (differential 100 ohm). Use a multilayer PCB with dedicated ground and power planes adjacent to the BGA breakout, and via-in-pad or microvia technology to escape the dense 1.0 mm ball pitch. Per Stratix III hardware guidelines, keep transceiver trace lengths matched within 5 mils for the P/N pair and within 50 mils across channels to meet the jitter budget.
Estimated: At full utilization (47.5K LE at 80% toggle rate, 600 MHz, 384 active DSP blocks), the EP3SE50F780C2 dissipates approximately 8-10 W. The 780-FCBGA package has a theta_JA of approximately 12-15 C/W with a 4-layer JEDEC test board; this implies a junction temperature rise of 96-150 C above ambient. A heatsink or forced-air cooling is required for reliable operation at high toggle rates. Add thermal vias under the exposed die area and use a high-Tg PCB laminate (FR408HR or equivalent).
Per Stratix III power guidelines, the EP3SE50F780C2 requires multiple supply rails: 1.1 V core, 2.5 V/3.3 V auxiliary, 1.2-1.5 V PLL supply, and per-pin I/O supplies. Each supply must have at least 100 uF of bulk capacitance plus 0.1 uF and 0.01 uF decoupling near every power ball group. Power sequencing is critical: the 1.1 V core must rise monotonically within the datasheet-specified 100 ms window to avoid latch-up. The PowerPlay Power Analyzer tool in Quartus II generates rail-by-rail current estimates for the design.
규정 준수 정보
RoHS/REACH compliance not stated in the verified web data; Altera/Intel Stratix III FPGAs are typically compliant with these directives but this should be confirmed against the latest manufacturer documentation. Not AEC-Q100 qualified (FPGA family does not target automotive).
