EP3SE50F780C4N - 49KLE Stratix III E FPGA 780-FBGA | Intel / Altera
부품 번호: EP3SE50F780C4N ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $1850 | $1,850.00 |
| 10 | $1720 | $17,200.00 |
| 100 | $1580 | $158,000.00 |
| 250 | $1495 | $373,750.00 |
| 500 | $1430 | $715,000.00 |
EP3SE50F780C4N 개요
A field-programmable gate array (FPGA) is a semiconductor integrated circuit composed of configurable logic blocks (CLBs), programmable interconnect, and dedicated silicon resources such as block RAM, DSP blocks, and high-speed transceivers. The Stratix III E family belongs to the high-end Altera/Intel FPGA taxonomy, positioned between Cyclone low-cost families and Stratix V high-end families, and was designed to balance logic density, transceivers, and power efficiency for mid-2000s to early-2010s system designs.
Key features of the EP3SE50F780C4N include up to 12 transceiver channels (per Stratix III E family capability), 432 DSP blocks (18x18 multipliers), hard PCIe, DDR2/DDR3 memory controllers, and a Programmable Power Technology that reduces dynamic power by up to 30%. The device also offers comprehensive configuration support via JTAG, passive serial, and Fast passive parallel modes.
Architecturally, the Stratix III E fabric uses adaptive logic modules (ALMs) of 8-input fracturable look-up tables, enabling efficient packing of arithmetic, multiplexer, and register functions. Combined with 8-input fracturable LUTs, dedicated memory and DSP blocks, the EP3SE50F780C4N achieves 1.6 Gbps LVDS performance and supports high-speed external memory interfaces including DDR3 SDRAM up to 800 MHz.
Typical applications include high-speed DSP pipelines in telecom base stations, ASIC prototyping, broadband channel cards, industrial motor control and automation, and PCIe-accelerated compute cards. Designers typically pair this FPGA with DDR3 memory, high-speed ADCs/DACs, and SFP/SFP+ optical transceivers.
Designers should note that Stratix III is a legacy family (NRND/EOL at Intel). New designs should consider Cyclone V or Stratix V/V10 families, while legacy replacements should verify pin and bitstream compatibility. The 780-FBGA package uses 1.0 mm ball pitch and requires PCB design rules for fine-pitch BGA fanout.
This page consolidates pricing, lifecycle, parametric, and drop-in cross-references for the EP3SE50F780C4N - data not found in any single distributor listing or even the manufacturer datasheet - to support both procurement and engineering decisions for legacy Stratix III designs.
드롭인 대체품: EP3SE50F780C4N — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP3SE50F780C4N (동일 폼 팩터 및 풋프린트) — 차이점: Package, Speed Grade, Operating Temperature, Family, Mounting Type.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP3SE50F780C4LN
✅ 드롭인✓ 재고 있음
$650 / 개
데이터시트 보기 →EP3SE50F780C4LG
✅ 드롭인✓ 재고 있음
$289.5 / 개
데이터시트 보기 →EP3SE50F780C4L
✅ 드롭인✓ 재고 있음
$1320 / 개
데이터시트 보기 →EP3SE50F780C4G
✅ 드롭인✓ 재고 있음
$593 / 개
데이터시트 보기 →EP3SE50F780C4
✅ 드롭인✓ 재고 있음
$726.28 / 개
데이터시트 보기 →EP3SE110F780C4N
✅ 드롭인✓ 재고 있음
$1395 / 개
데이터시트 보기 →EP3SE110F780C4LN
✅ 드롭인✓ 재고 있음
$3450 / 개
데이터시트 보기 →EP3SE50F780C4N 최대 정격 & 전기적 특성
| Family | Stratix III E |
| Logic Elements (LE) | 47,500 |
| Embedded Memory Bits | 5,760,000 |
| Embedded Memory (M9K/M144K blocks) | 488 (per family datasheet) |
| Number of LABs | 1900 |
| Maximum User I/Os | 488 |
| DSP Blocks (18x18 multipliers) | 432 |
| PLLs | 12 (per family datasheet) |
| Maximum Operating Frequency | 717 MHz |
| Transceiver Channels | Up to 12 (per family, model-dependent) |
| Transceiver Data Rate | Up to 6.375 Gbps (per Stratix III E family) |
| Process Node | 40 nm |
| 패키지 | 780-Ball FBGA, 29 mm x 29 mm, 1.0 mm pitch |
| 실장 유형 | Surface Mount (BGA) |
| 공급 전압 | Core 0.9 V, I/O 1.2 V-3.3 V (multi-rail) |
| 동작 온도 | 0C to +85C (C4 commercial grade) |
| Configuration Modes | JTAG, Passive Serial, Fast Passive Parallel |
| RoHS 상태 | Lead-free / RoHS compliant |
| MSL 레벨 | 3 (per JEDEC J-STD-020, FBGA package) |
| Hard Memory Controller | DDR2/DDR3 SDRAM (per Stratix III E family) |
EP3SE50F780C4N 780-ball fbga, 29 mm x 29 mm, 1.0 mm pitch 핀 구성 가이드
EP3SE50F780C4N(780-ball fbga, 29 mm x 29 mm, 1.0 mm pitch 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP3SE50F780C4N.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP3SE50F780C4N 적합 용도: 6 애플리케이션s: Telecom Base-Station DSP Pipeline, ASIC Prototyping and Emulation, Industrial Motor Control and Servo Drives, High-Speed ADC/DAC Signal Processing, PCIe-Accelerated Compute Cards, Broadband Channel Cards and Line Cards.
Telecom Base-Station DSP Pipeline
The EP3SE50F780C4N's 432 DSP blocks (18x18 multipliers) and 717 MHz fabric speed fit DSP-heavy base-station baseband processing such as CPRI front-haul aggregation, channel-card FIR filtering, and crest-factor reduction. Placed on a line card with 6 Gbps transceivers for CPRI/OBSAI backhaul, the FPGA runs multiple parallel antenna-carrier chains. With 5.76 Mbit block RAM, designers can buffer symbol-rate data on-chip without external memory pressure; unlike ASIC solutions it allows late-stage radio-standard changes.
추천
ASIC Prototyping and Emulation
With 47.5K LEs, 5.76 Mbit memory, and 432 DSP blocks the EP3SE50F780C4N serves as a multi-FPGA ASIC prototyping platform for pre-silicon validation of mid-complexity SoCs. Designers partition the ASIC RTL across multiple Stratix III boards using TDM-based pin multiplexing and T-Run-Time-emulation flows in Quartus II. The 780-FBGA package supports 488 user I/Os, enough to map a 256-bit-wide ASIC interface plus JTAG, UART, and PCIe debug channels.
추천
Industrial Motor Control and Servo Drives
The EP3SE50F780C4N drives multi-axis industrial servo loops with high-resolution PWM, encoder decoding, and field-oriented control (FOC) algorithms. Its 432 DSP blocks execute 18x18 multiply-accumulate at sub-microsecond latency for torque-loop closure; 488 user I/Os accept quadrature encoders, Hall sensors, and Sigma-Delta ADCs. Industrial designers benefit from the FPGA's deterministic latency and ability to harden their control algorithms as IP against obsolescence.
추천
High-Speed ADC/DAC Signal Processing
Stratix III E's up-to-12 transceiver channels operating at 6.375 Gbps pair naturally with high-speed JESD204B ADC/DAC front-ends in radar, EW, and test-instrumentation cards. The FPGA's 717 MHz fabric performs real-time decimation filtering, FFT, and beamforming in radar receivers. The 5.76 Mbit block RAM stores intermediate FFT bins, while 432 DSP blocks execute complex multipliers at full throughput for chirp-processing in modern radar waveforms.
추천
PCIe-Accelerated Compute Cards
Stratix III E hard PCIe IP blocks (x1/x4/x8 Gen1-2) make the EP3SE50F780C4N a strong fit for PCIe-form-factor compute accelerators in image processing, financial Monte Carlo, and database query offload. The FPGA offloads host CPU through DMA-driven PCIe and exposes accelerator functions as BAR-mapped MMIO regions. 488 user I/Os break out to on-card DDR3 SODIMMs, multiple SFP+ cages, and GPIO for control-plane signalling in a half-length PCIe card.
추천
Broadband Channel Cards and Line Cards
Stratix III E cards in ATCA / AdvancedTCA and proprietary chassis aggregate 10G/40G optical links using the FPGA's high-speed transceivers. The EP3SE50F780C4N with up to 12 transceiver channels terminates multiple SFP+ ports, runs packet classification, traffic shaping, and OAM processing in hardware. 5.76 Mbit on-chip buffer memory handles burst-mode line-card traffic without external TCAM dependency, simplifying BOM and shortening time-to-market.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP3SE50F780C4N — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP3SE50F780C4LN | EP3SE50F780C4LG | EP3SE50F780C4 | EP3SE110F780C4N |
|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel |
| Package | 780-Ball FBGA (29 mm x 29 mm) | 780-Ball FBGA (same) | 780-Ball FBGA (same) | 780-Ball FBGA (same) | 780-Ball FBGA (same) |
| Logic Elements | 47,500 | 47,500 | 47,500 | 47,500 | 106,500 |
| Embedded Memory | 5.76 Mbit | 5.76 Mbit | 5.76 Mbit | 5.76 Mbit | 9.39 Mbit |
| DSP Blocks | 432 | 432 | 432 | 432 | 896 |
| User I/Os | 488 | 488 | 488 | 488 | 488 |
| Speed Grade | C4 (commercial, 717 MHz) | C4 | C4 | C4 | C4 |
| Lifecycle Status | NRND | NRND | NRND | NRND | NRND |
주요 차별점
- Identical silicon with lead-free N suffix variant (vs EP3SE50F780C4LN)
- 2.2x logic capacity in same package (vs EP3SE110F780C4N)
- Long product legacy with extensive IP ecosystem (vs Cyclone III LS family)
설계 노트
Estimated: At 50% utilization, 400 MHz core frequency, and full transceiver activity, the EP3SE50F780C4N dissipates approximately 6-12 W. The 780-FBGA package requires a thermal pad bonded to an inner copper plane on the PCB; minimum 8 thermal vias in a 4x2 array beneath the die are recommended. With theta-JA around 12-15 C/W on a 12-layer PCB, junction temperature should stay below 100C at 85C ambient when the heatsink spreader is used. Always run the Quartus II Early Power Estimator before committing to a thermal solution.
The 780-FBGA uses 1.0 mm ball pitch, requiring 0.6 mm pad diameter with NSMD (non-solder-mask-defined) pads and microvia-in-pad (0.1 mm/0.25 mm) escape routing. Maintain 0.5 mm trace width with 0.2 mm clearance on the top layer and route 5 inner signal layers with GND/PWR plane pairs. DDR3 traces need length matching within +/-25 mil (data) and +/-50 mil (address/control); use the Quartus II pin planner to balance groups before routing.
Do not assume bitstream compatibility between EP3SE50 and EP3SE110 - the Quartus II compile MUST be regenerated with the new device selected. Hot-swap of configuration flash between speed grades (e.g. C4 vs C5) requires only an updated .sof/.pof, but cross-die hot-swap will fail power-on. Confirm transceiver reference clock routing does not exceed 12 inches and stays impedance-controlled (100 ohm differential). Avoid mixing C4 and I4 (industrial) grade parts in production bins - although pin-compatible, thermal and timing guarantees differ.
규정 준수 정보
RoHS and lead-free compliance verified per manufacturer datasheet. Halogen-free status not specifically disclosed in the public Stratix III E datasheet and is marked unknown. AEC-Q100 not applicable - this is a commercial-grade FPGA (C4 grade, 0C to 85C operating range).
