EP3SL50F780C2G - 47.5K LE Stratix III L FPGA 780-FCBGA | Intel
부품 번호: EP3SL50F780C2G ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $349.86 | $349.86 |
| 10 | $326.45 | $3,264.50 |
| 100 | $298.2 | $29,820.00 |
| 250 | $281.1 | $70,275.00 |
| 500 | $264.9 | $132,450.00 |
EP3SL50F780C2G 개요
An FPGA is a reprogrammable digital integrated circuit that combines configurable logic blocks, programmable interconnect, dedicated DSP blocks, and embedded memory into a single silicon die. Stratix III L parts occupy the lower-density, lower-static-power tier of the Stratix III generation, sitting within the broader taxonomy: FPGA → programmable logic device (PLD) → logic IC → integrated circuit. They are typically used to prototype or deploy parallel signal-processing pipelines where ASIC NRE is not justified.
Key features include 19,000 adaptive logic modules (ALMs), 2.08 Mbit of embedded SRAM, dedicated 18×18 multipliers for DSP, and a Programmable Power Technology that lets unused logic tiles enter a near-zero static-power state. Compared with the original Stratix III (EP3S...) family, EP3SL50 parts trim the transceiver count and PLLs to lower dynamic power. The -C2 speed grade and -G (Pb-free, RoHS-compliant) suffix identify a commercial temperature, lead-free FCBGA device targeted at mainstream logic design rather than extreme-bandwidth applications.
Typical applications include telecom line-card glue logic, software-defined radio baseband pre-processing, video broadcast switching, medical imaging front-ends, and ASIC prototyping for ASIC-emulation platforms. Industrial control and test-and-measurement instrumentation also benefit from its DSP-rich fabric and abundant on-chip memory.
When designing, ensure all I/O banks receive compliant VCCIO rails before JTAG configuration begins, and follow Intel's Stratix III Hardware Design Guidelines for the FCBGA pinout to avoid simultaneous switching noise (SSN) issues on byte-wide buses.
This page synthesizes distributor pricing for the EP3SL50F780C2G, drop-in package-compatible alternatives within the Stratix III family, and practical PCB design notes not consolidated in the manufacturer datasheet alone.
드롭인 대체품: EP3SL50F780C2G — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP3SL50F780C2G (동일 폼 팩터 및 풋프린트) — 차이점: Package, Speed Grade, Operating Temperature, Logic Elements, Series.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP3SL50F780C2
✅ 드롭인✓ 재고 있음
$199.95 / 개
데이터시트 보기 →EP3SE50F780C2G
✅ 드롭인✓ 재고 있음
$1985 / 개
데이터시트 보기 →EP3SE50F780C2
✅ 드롭인✓ 재고 있음
$1195 / 개
데이터시트 보기 →EP3SE80F780C2G
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
EP3SE80F780C2
✅ 드롭인✓ 재고 있음
$2480 / 개
데이터시트 보기 →EP3SL50F780C2G 최대 정격 & 전기적 특성
| Series | Stratix III L |
| Logic Elements | 47,500 LE |
| Adaptive Logic Modules (ALMs) | 19,000 ALM |
| Embedded Memory | 2.08 Mbit |
| Total Memory Bits | 2,184,192 bit |
| User I/Os | 488 |
| Operating Supply Voltage (Core) | 1.1 V |
| Speed Grade | -2 (C2) |
| 동작 온도 | 0 °C to +85 °C (Commercial) |
| 패키지 | 780-ball FCBGA |
| 실장 유형 | Surface Mount |
| RoHS 상태 | Pb-Free / RoHS Compliant (-G suffix) |
| Transceivers | Reduced / Not Featured (L-tier) |
| DSP Blocks | 18×18 multipliers (per family datasheet) |
| Configuration | JTAG / Passive Serial / Fast Passive Parallel |
EP3SL50F780C2G 780-ball fcbga 핀 구성 가이드
EP3SL50F780C2G(780-ball fcbga 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP3SL50F780C2G.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP3SL50F780C2G 적합 용도: 6 애플리케이션s: Telecom Line-Card Glue Logic, Software-Defined Radio Baseband Pre-Processing, Video Broadcast Switching and Routing, Medical Imaging Front-End Processing, Industrial Control and Motion Logic, ASIC Emulation and Prototyping.
Telecom Line-Card Glue Logic
The EP3SL50F780C2G fits telecom line-card glue logic because its 488 user I/Os and 47,500 LE provide ample capacity for backplane bridging, serial-to-parallel conversion, and protocol adaptation. The Stratix III L architecture delivers low static power for always-on central-office environments. Place the FPGA between line-side SERDES devices and a network processor; with 1.1 V core, board thermal design is straightforward. According to Intel, the 18×18 multipliers also enable inline QoS metering. For new designs, evaluate whether Stratix IV or Cyclone V GX parts offer longer lifecycle.
추천
Software-Defined Radio Baseband Pre-Processing
The EP3SL50F780C2G is well-matched to software-defined radio (SDR) baseband pre-processing where its 19,000 ALMs and abundant 18×18 hardware multipliers implement FFTs, channelizers, and digital down-converters in real time. The 2.08 Mbit embedded memory buffers sample streams between DSP blocks and external DACs. Operating at commercial 0 °C to +85 °C, the device suits indoor basestation hardware. For higher sample rates, the E-tier EP3SE50F780C2G adds transceivers for direct ADC interface.
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Video Broadcast Switching and Routing
The EP3SL50F780C2G serves video broadcast switches and routers that aggregate multiple SDI/HDMI streams into a single output bus. Its 488 I/Os handle dozens of video channels simultaneously, while the 2,184,192-bit embedded memory acts as line buffers for cross-point switching. The 1.1 V core keeps power consumption manageable in dense rack-mounted chassis. For 4K/UHD applications, EP3SE50F780C2G or the higher-density EP3SL200F1152 offer more capacity and additional SERDES for HDMI 2.0.
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Medical Imaging Front-End Processing
The EP3SL50F780C2G is suitable for medical imaging front-ends (ultrasound beamformers, MRI pre-processors) where its DSP-rich fabric implements beamforming or k-space trajectories deterministically. With 47,500 LE and 2.08 Mbit SRAM, the device can handle multiple parallel processing pipelines for real-time imaging. The commercial 0-85 °C range fits climate-controlled imaging rooms. For portable medical devices, evaluate lower-power Cyclone V GX parts instead. AEC-Q100 is not applicable for medical unless the device is in direct patient contact.
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Industrial Control and Motion Logic
The EP3SL50F780C2G fits industrial control applications such as multi-axis motion controllers and deterministic EtherCAT slaves. Its 488 I/Os accept quadrature encoder inputs, drive PWM outputs, and interface parallel-bus sensors. The 18×18 multipliers implement PID and field-oriented control algorithms in hardware. Commercial 0-85 °C is sufficient for cabinet-mounted industrial hardware. For wider temperature range, consider the I-grade EP3SL50F780I4N variant (where available) or migrate to active silicon like Cyclone IV E or MAX 10.
추천
ASIC Emulation and Prototyping
The EP3SL50F780C2G works in ASIC emulation platforms where designers partition RTL across multiple FPGAs to validate pre-silicon designs. With 47,500 LE and 2.08 Mbit SRAM, the device emulates mid-complexity ASIC blocks at sub-100 MHz real-time speeds. The Quartus II design flow supports ASIC prototype netlist import. For larger ASICs, multi-FPGA boards combining EP3SL340 or Stratix IV EP4SE680 deliver higher capacity. Always verify timing closure when partitioning large ASIC blocks.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP3SL50F780C2G — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP3SL50F780C2 | EP3SE50F780C2G | EP3SE50F780C2 | EP3SE80F780C2G | EP3SE80F780C2 |
|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) |
| Package | 780-ball FCBGA | 780-ball FCBGA (same) | 780-ball FCBGA (same) | 780-ball FCBGA (same) | 780-ball FCBGA (same) | 780-ball FCBGA (same) |
| Logic Elements | 47,500 LE | 47,500 LE | 47,500 LE | 47,500 LE | 80,000 LE (+68%) | 80,000 LE (+68%) |
| Family Tier | Stratix III L (low-static-power) | Stratix III L | Stratix III E (enhanced transceivers) | Stratix III E | Stratix III E | Stratix III E |
| Embedded Memory | 2.08 Mbit | 2.08 Mbit | 2.08 Mbit | 2.08 Mbit | 3.89 Mbit (+87%) | 3.89 Mbit |
| User I/Os | 488 | 488 | 488 | 488 | 488 | 488 |
| Operating Temperature | 0 °C to +85 °C (Commercial) | 0 °C to +85 °C | 0 °C to +85 °C | 0 °C to +85 °C | 0 °C to +85 °C | 0 °C to +85 °C |
| Speed Grade | -2 (C2) | -2 | -2 | -2 | -2 | -2 |
| Pb-Free / RoHS | Yes (-G suffix) | No (SnPb) | Yes (-G) | No (SnPb) | Yes (-G) | No (SnPb) |
주요 차별점
- Lower static power vs E-tier siblings in same package (vs EP3SE50F780C2G)
- Pin-compatible capacity upgrade path to 80K LE (vs EP3SE80F780C2G)
- Pb-Free RoHS-compliant (-G) variant for global markets (vs EP3SL50F780C2 (non-G))
설계 노트
The EP3SL50F780C2G requires a clean 1.1 V core supply with ±3% tolerance and dedicated decoupling at every VCC pin. According to Intel's Stratix III hardware design guidelines, place 0.1 µF X7R ceramics within 100 mils of every VCC pin and bulk 33 µF tantalums at each voltage rail. Estimated: at full 47.5K LE utilization the core draws approximately 0.8-1.2 A; verify with the Quartus II PowerPlay early-estimator before finalizing your regulator.
The 780-ball FCBGA requires microvia or HDI PCB technology. According to Intel's package specifications, the ball pitch is 1.0 mm with 0.6 mm pad diameter - design with 4-6-4 stack-up minimum and matched-impedance routing for high-speed LVDS pairs. Use blind/buried vias to fan-out from inner rows. Thermal vias (12+ per thermal pad) are mandatory because the package relies on PCB copper for heat dissipation. Estimate junction-to-ambient at 18-22 °C/W with proper via array.
Group I/O banks by voltage (VCCIO) and assign LVDS pairs to dedicated true-differential pairs to avoid signal integrity issues. According to Intel's Stratix III pin connection guidelines, leave unused I/O pins configured as input tri-stated with weak pull-ups. Simultaneous Switching Noise (SSN) is a real concern for the FCBGA-780 package; limit SSO count per byte to within Intel's published guidelines, and use proper spread-spectrum clocking on switching supplies to reduce EMI.
Common pitfalls with the EP3SL50F780C2G include (1) forgetting the configuration mode pin strapping resistors for JTAG vs Passive Serial, (2) ignoring MSL3 moisture sensitivity requiring bake-out before reflow, and (3) selecting a non-Pb-free variant (-G suffix absent) for products shipping into RoHS-restricted markets. Estimated: reballing after moisture exposure typically causes 2-5% yield loss, so bake 48 hours at 125 °C before reflow.
The EP3SL50F780C2G is NRND (Not Recommended for New Designs). For new product introductions, plan migration to active silicon such as Cyclone V GX (5CGXFC7 series) or Arria V (5AGXFB3 series) and budget for Quartus II RTL re-synthesis. According to Intel's product lifecycle policy, NRND parts receive last-time-buy support for typically 12 months; confirm exact timelines with your Intel FAE before committing to a production schedule.
규정 준수 정보
Pb-free / RoHS-compliant per -G suffix in MPN. Lifecycle status is NRND (Not Recommended for New Designs) per Intel/Altera product change notifications. AEC-Q100 not applicable (commercial FPGA, not automotive qualified).
