EP3SL200F1152I4N - Stratix III L 200K LE FPGA | Altera | Industrial
부품 번호: EP3SL200F1152I4N ⚠ 최종 구매| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $2850 | $2,850.00 |
| 10 | $2620 | $26,200.00 |
| 100 | $2390 | $239,000.00 |
| 500 | $2180 | $1,090,000.00 |
| 1,000 | $1990 | $1,990,000.00 |
EP3SL200F1152I4N 개요
An FPGA (Field Programmable Gate Array) is a programmable logic device consisting of an array of configurable logic blocks (CLBs / LABs), programmable routing, and dedicated hard IP such as DSP blocks, block RAM, transceivers, and PLLs. FPGAs sit above ASICs and microcontrollers in the semiconductor hierarchy: they offer ASIC-class performance and parallelism while remaining reprogrammable after manufacture, which is why they are used in networking, DSP, ASIC prototyping, high-speed imaging, and military/aerospace applications. The Stratix III L sub-family specifically targets applications requiring high logic density with reduced static power relative to the standard Stratix III.
Key features of the EP3SL200F1152I4N include the 65nm low-power CMOS process, embedded multipliers for DSP, multi-gigabit transceivers (MGTs) supporting SERDES rates up to several Gbps, programmable power technology (configurable logic array blocks can be set to high-speed or low-power mode), and design security via bitstream encryption with AES. The 1152-ball FC-FBGA package enables high I/O count and high signal integrity for parallel interfaces. Operating junction temperature is industrial grade (-40C to +100C or wider, per the I4 speed/temperature code).
Architecturally, the Stratix III L series uses an adaptive logic module (ALM) of eight inputs, which is more efficient than the four-input LUT of older FPGAs; this increases effective logic utilization. The 65nm process integrates embedded SRAM with built-in error correction, dedicated 18x18 multipliers for DSP, and per-channel PLL/DCM clock management. Power is managed through programmable logic regions and an internal voltage regulator that supports dynamic voltage scaling.
Typical applications include high-end telecommunications line cards, ASIC prototyping, high-performance digital signal processing (radar, software-defined radio), broadcast video processing, medical imaging systems, and military secure communications. The wide transceivers make it suitable for chip-to-chip and backplane SERDES links.
When designing with this part, ensure the PCB has a 1152-ball BGA footprint with proper microvia stack-up and matched impedance traces for the transceiver channels. Use the Altera Quartus II design suite (version 13.1 or earlier for Stratix III support) and verify that the bitstream AES key is provisioned before field deployment for anti-tamper protection. The I4 speed grade is the slowest of the Stratix III family; choose a faster speed grade (C4 or I3) only when timing closure demands it, since faster grades consume more power.
This page synthesizes distributor pricing, drop-in pin-compatible same-family alternatives, and practical PCB design notes that are not consolidated in any single manufacturer document.
드롭인 대체품: EP3SL200F1152I4N — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP3SL200F1152I4N (동일 폼 팩터 및 풋프린트) — 차이점: Logic Elements, Package, Speed Grade, Process Technology, Family.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP3SL200F1152C4N
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
EP3SL200F1152C5N
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
EP3SL200F1152C7N
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
EP3SL200F1152I3N
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
EP3SL150F1152I3N
✅ 드롭인✓ 재고 있음
$1395 / 개
데이터시트 보기 →EP3SL110F1152I3N
✅ 드롭인✓ 재고 있음
$335 / 개
데이터시트 보기 →EP3SE260F1152I4N
✅ 드롭인✓ 재고 있음
$2050 / 개
데이터시트 보기 →EP3SL200F1152I4N 최대 정격 & 전기적 특성
| Series | Stratix III L |
| Family | Stratix III |
| Logic Elements | 200,000 |
| Logic Array Blocks (LABs) | 8,000 |
| Adaptive Logic Modules (ALMs) | 80,160 |
| User I/Os | 744 |
| Total Embedded Memory Bits | 10,901,504 (approx. 10.9 Mbit) |
| Embedded Multipliers (18x18) | Yes (DSP blocks) |
| Transceivers | Multi-gigabit SERDES MGTs |
| Process Technology | 65 nm CMOS |
| Core Voltage (Vccint) | 1.1 V |
| 패키지 | 1152-ball FC-FBGA (F1152) |
| Speed Grade | I4 (industrial, slowest) |
| 동작 온도 | -40C to +100C (industrial) |
| Configuration | AES-128 bitstream encryption supported |
| 실장 유형 | Surface Mount (BGA) |
| RoHS 상태 | Compliant |
EP3SL200F1152I4N 1152-ball fc-fbga (f1152) 핀 구성 가이드
EP3SL200F1152I4N(1152-ball fc-fbga (f1152) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP3SL200F1152I4N.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP3SL200F1152I4N 적합 용도: 6 애플리케이션s: ASIC Prototyping and Emulation, Telecommunications Line Cards, Software Defined Radio and DSP, Broadcast Video Processing, Medical Imaging Systems, Military and Aerospace Secure Communications.
ASIC Prototyping and Emulation
The EP3SL200F1152I4N's 200,000 logic elements and 8,000 LABs make it well-suited for ASIC prototyping and in-circuit emulation, where the 1152-ball FC-FBGA package delivers 744 user I/Os to map large ASIC designs. Quartus II design flows support incremental compile and partition-based synthesis, allowing multi-FPGA partitioning of ASICs exceeding 5 million gates. Designers can validate ASIC RTL at near-real-time speeds before committing to silicon, de-risking the tape-out process. The Stratix III low-power architecture also allows extended debug sessions without thermal throttling.
추천
Telecommunications Line Cards
In telecom line cards, the EP3SL200F1152I4N's 65nm low-power architecture and multi-gigabit transceivers enable aggregation switches, framer/mapper functions, and packet-processing engines at line-rate speeds. The 1152-ball FC-FBGA package allows dense I/O for SGMII/XAUI/SFI interfaces plus external memory buses (DDR2/DDR3) up to 800 MHz. Industrial temperature support (-40C to +100C) makes the part deployable in outdoor and central-office environments. AES-128 bitstream encryption protects the design against reverse engineering, important for carrier-grade equipment.
추천
Software Defined Radio and DSP
The EP3SL200F1152I4N is well-suited for software-defined radio (SDR) and high-performance DSP applications. Its dedicated 18x18 multipliers, large embedded memory (10.9 Mbit), and multi-gigabit transceivers (SERDES) enable real-time FFT, channelization, and modulation/demodulation across wide bandwidths. According to the Stratix III Device Handbook, the EP3SL200 can sustain over 200 GMACs of DSP throughput at 300 MHz, suitable for radar baseband, electronic warfare, and 4G LTE PHY layer processing. The industrial temperature grade supports outdoor military and aerospace deployments.
추천
Broadcast Video Processing
Broadcast video processing benefits from the EP3SL200F1152I4N's 744 user I/Os for parallel video interfaces (e.g., SDI, DisplayPort, HDMI) plus the 10.9 Mbit block RAM for line buffers and frame stores. At 200K logic elements, designers can implement multi-stream 3G-SDI routers, up/down/cross-converters, and color-space converters in a single device. The low-power 65nm process reduces chassis cooling requirements, valuable in compact broadcast equipment. AES bitstream encryption protects proprietary video processing IP from cloning.
추천
Medical Imaging Systems
In medical imaging equipment (CT, MRI, ultrasound, digital X-ray), the EP3SL200F1152I4N provides the computational density to perform real-time image reconstruction (filtered back-projection, iterative reconstruction) and beamforming. The 1152-ball FC-FBGA enables simultaneous interfaces to high-speed ADCs (LVDS), DDR3 memory for image buffers, and PCIe links to host CPUs. Industrial temperature support is acceptable for controlled clinical environments, while the AES bitstream encryption supports FDA cybersecurity guidance for medical device IP protection.
추천
Military and Aerospace Secure Communications
The EP3SL200F1152I4N is qualified for military and aerospace secure communications due to its AES-128 bitstream encryption, industrial temperature range, and high logic density. The 1152-ball FC-FBGA supports multiple high-speed SERDES channels for tactical radio links, satellite modems, and electronic-countermeasures subsystems. Legacy defense programs continue to use Stratix III silicon because of validated software baselines and existing cryptographic key infrastructure. Its L (low-power) sub-family variant offers extended mission endurance on battery-powered platforms.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP3SL200F1152I4N — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP3SL200F1152C4N | EP3SL200F1152I3N | EP3SL150F1152I3N | EP3SL110F1152I3N | EP3SE260F1152I4N |
|---|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera | Altera |
| Package | 1152-ball FC-FBGA (F1152) | 1152-ball FC-FBGA (F1152) - same | 1152-ball FC-FBGA (F1152) - same | 1152-ball FC-FBGA (F1152) - same | 1152-ball FC-FBGA (F1152) - same | 1152-ball FC-FBGA (F1152) - same |
| Logic Elements | 200,000 | 200,000 | 200,000 | 150,000 | 110,000 | 260,000 |
| Speed Grade | I4 (industrial slowest) | C4 (commercial mid) | I3 (industrial mid) | I3 (industrial mid) | I3 (industrial mid) | I4 (industrial slowest) |
| Operating Temperature | -40C to +100C (industrial) | 0C to +85C (commercial) | -40C to +100C (industrial) | -40C to +100C (industrial) | -40C to +100C (industrial) | -40C to +100C (industrial) |
| Process Technology | 65 nm CMOS | 65 nm CMOS | 65 nm CMOS | 65 nm CMOS | 65 nm CMOS | 65 nm CMOS |
| Core Voltage | 1.1 V | 1.1 V | 1.1 V | 1.1 V | 1.1 V | 1.1 V |
| Lifecycle Status | Last Time Buy | Last Time Buy | Last Time Buy | Last Time Buy | Last Time Buy | Last Time Buy |
주요 차별점
- Highest-density Stratix III L FPGA on 1152-ball FC-FBGA (vs EP3SL150F1152I3N)
- Industrial temperature support on 200K LE silicon (vs EP3SL200F1152C4N)
- AES-128 bitstream encryption with 65nm low-power silicon (vs EP3SE260F1152I4N)
설계 노트
Estimated: the 1152-ball FC-FBGA package requires a 1.0 mm ball pitch PCB footprint with microvia (laser-drilled) stack-up, typically a 6-8 layer board with 0.4 mm via-in-pad. Decoupling capacitors (0.1uF X7R + 10uF bulk) must be placed within 5 mm of every Vccint/Vccpd/Vccram power ball; long traces will degrade core voltage during transients. For multi-gigabit SERDES channels, maintain 100-ohm differential impedance with matched trace lengths within 0.13 mm (5 mils). A solid GND plane directly under the BGA is mandatory to control return paths.
Estimated: at full 200K logic utilization with 80% toggle rate and 65nm process, the EP3SL200F1152I4N can dissipate 5-8 W. Without airflow on a standard JEDEC 4-layer test board, junction-to-ambient thermal resistance (theta_JA) is approximately 12-15 C/W per Altera thermal guidelines. Provide at least 200 LFM of forced-air cooling or attach a heatsink via thermal interface material (TIM) to the package lid to keep Tj below 100C. Use the Quartus II PowerPlay early power estimator to model your actual design before committing to thermal solution.
Place configuration pins (nCONFIG, nSTATUS, CONF_DONE, MSEL[0..3]) within 50 mm of the EPCS/EPCQ configuration flash or JTAG header to avoid signal-integrity issues during bitstream loading. JTAG chain signals (TCK, TMS, TDI, TDO) require 10 kohm pull-ups on TCK/TMS/TDI per Altera Boundary-Scan specification. Multi-gigabit transceiver reference clock inputs require a clean 100 MHz or 156.25 MHz source with phase noise below -100 dBc/Hz at 100 kHz offset; route clocks on inner layers with GND guard traces on both sides.
Do not migrate bitstreams between speed grades: an I4 bitstream will not run reliably on a C4 device even with the same package, because speed-grade fusing is locked at silicon level. When designing for field upgrades, choose the slowest speed grade that meets timing so you have headroom. Avoid pulling CONFIG_DONE low after configuration: this can confuse the AES decryption state machine. Always generate final bitstreams with the Quartus II 13.1 toolchain (the last release supporting Stratix III) and verify against the ASMI configuration interface timing before programming.
규정 준수 정보
RoHS and REACH compliant per Altera/Intel material declaration. Not AEC-Q100 qualified (Stratix III was not designed for automotive under-hood). Lead-free FC-FBGA package with SAC305 solder balls. AES-128 bitstream encryption supports IP protection for military/aerospace programs.
