EP3SL110F1152I3N - Stratix III L FPGA, 107.5K LE, 1152-BGA | Altera
부품 번호: EP3SL110F1152I3N ⚠ 최종 구매| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $485 | $485.00 |
| 10 | $445 | $4,450.00 |
| 100 | $398 | $39,800.00 |
| 500 | $365 | $182,500.00 |
| 1,000 | $335 | $335,000.00 |
EP3SL110F1152I3N 개요
A Field-Programmable Gate Array (FPGA) is a type of programmable logic device (PLD) that combines programmable logic blocks, configurable interconnect, and dedicated hard IP into a single semiconductor. The Stratix III L family sits within Altera's high-performance FPGA portfolio (FPGA -> programmable logic -> logic IC -> integrated circuit -> semiconductor), positioned below Stratix V but above Cyclone families in density and transceiver capability. FPGAs are widely used to accelerate parallel computation, implement custom interfaces, and prototype ASIC designs before tape-out.
Key features of the EP3SL110F1152I3N include 4,992,000 bits of embedded memory, dedicated DSP blocks for high-speed multiply-accumulate operations, support for external memory interfaces such as DDR3, and on-chip transceivers optimized for backplane and chip-to-chip serial links. The 'L' suffix denotes the lower-power variant of Stratix III, with programmable power technology that dynamically adjusts logic and routing resources based on design timing requirements, reducing static and dynamic power consumption compared to the standard Stratix III device of the same logic density.
The architecture combines an 8-input adaptive logic module (ALM) fabric, 9-Kbit M9K memory blocks, 144-Kbit MLAB memory, variable-precision DSP blocks, and PLLs. The 1152-pin FC-FBGA package exposes up to 744 user I/Os plus dedicated clock, configuration, and power pins, enabling dense PCB designs with multiple high-speed parallel interfaces. Configuration is supported via JTAG, passive serial, fast passive parallel, and Altera-specific modes.
Typical applications include wireline telecom line cards, military and aerospace signal processing, ASIC prototyping, high-performance computing accelerators, test and measurement equipment, and video broadcast infrastructure. The combination of logic density and serial bandwidth suits designs that previously required multiple mid-range FPGAs or a discrete ASIC.
When designing with the EP3SL110F1152I3N, plan thermal management carefully. Estimated: at full logic utilization and 500 MHz operation, core power can reach several watts; the FC-FBGA's exposed die requires a heatsink or thermal interface material and a multi-layer PCB with adequate inner-plane copper for heat spreading. Use Altera Quartus II software for synthesis, place-and-route, and power analysis.
드롭인 대체품: EP3SL110F1152I3N — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP3SL110F1152I3N (동일 폼 팩터 및 풋프린트) — 차이점: Speed Grade, Package, Family, Logic Elements, Process Technology.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP3SL110F1152C4N
✅ 드롭인✓ 재고 있음
$3500 / 개
데이터시트 보기 →EP3SL110F1152C3N
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
EP3SL110F1152C5N
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
EP4SL110F1152I3N
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
EP3SE110F1152I3N
✅ 드롭인✓ 재고 있음
$3980 / 개
데이터시트 보기 →EP3SL110F1152I3N 최대 정격 & 전기적 특성
| Family | Stratix III L |
| Logic Elements | 107,500 |
| Logic Array Blocks (LABs) | 4,300 |
| User I/Os | 744 |
| Embedded Memory Bits | 4,992,000 |
| Process Technology | 65 nm |
| Core Voltage | 1.1 V |
| Maximum Operating Frequency | 500 MHz |
| 패키지 | 1152-ball FC-FBGA |
| 실장 유형 | Surface Mount |
| 동작 온도 | -40C to +100C (Industrial) |
| Configuration Interface | JTAG, Passive Serial, Fast Passive Parallel |
| Speed Grade | I3 |
EP3SL110F1152I3N 1152-ball fc-fbga 핀 구성 가이드
EP3SL110F1152I3N(1152-ball fc-fbga 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP3SL110F1152I3N.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP3SL110F1152I3N 적합 용도: 6 애플리케이션s: Wireline Telecom Line Card Processing, Military and Aerospace Signal Processing, ASIC Prototyping and Emulation, Test and Measurement Instrumentation, High-Performance Computing Accelerator, Video Broadcast and Image Processing.
Wireline Telecom Line Card Processing
The EP3SL110F1152I3N fits wireline telecom line card designs because it integrates 107,500 logic elements, 4,992 Kbits of embedded memory, and dedicated DSP blocks optimized for packet classification and traffic shaping at line rate. According to the Altera Stratix III handbook, the 1152-ball FC-FBGA exposes up to 744 user I/Os, enabling direct interfaces to multiple SFP/QSFP cages, external RLDRAM III, and TDM backplane buses without intermediate bridge logic. The 500 MHz fabric supports multi-channel 10 Gbps Ethernet MAC aggregation, including CRC generation and header parsing per IEEE 802.1Q. Estimated: at 70 percent logic utilization and 400 MHz fMAX, total on-chip power consumption approaches 8 W, which the FC-FBGA integrated heat-spreader surface dissipates with a low-profile heatsink in a 1U chassis.
추천
Military and Aerospace Signal Processing
The EP3SL110F1152I3N suits military and aerospace signal-processing platforms because its industrial -40C to +100C operating range and radiation-tolerant 65 nm process satisfy deployed-environment requirements. The 744 available user I/Os accommodate multi-channel analog front-end ADCs (such as the ADS42JB69 family) and DAC interfaces, while 4,992 Kbits of on-chip M9K memory buffer FFT windows and intermediate results without external SRAM contention. According to the Altera military-grade screening guide, Stratix III devices are commonly used in software-defined radio, electronic warfare, and radar preprocessing modules. Estimated: vibration-sensitive avionics installations should secure the FC-FBGA package with board-level staking compound and mechanical heat-spreader clips per IPC-9701 guidelines.
추천
ASIC Prototyping and Emulation
The EP3SL110F1152I3N is widely used for ASIC prototyping because its 107,500 logic elements and abundant M9K memory blocks can host partitioned ASIC RTL targeting 30-50 M gate-equivalent designs when combined with multi-FPGAs. The 1152-ball FC-FBGA exposes sufficient I/Os to bridge daughter-card interconnect at multi-GHz LVDS speeds, which is essential for connecting multiple FPGAs in a time-domain-multiplexed prototyping rack. According to Altera's ASIC prototyping best-practices guide, designers targeting Stratix III for prototyping should use Quartus II incremental compile and HSSI-based chip-to-chip channels. The device's programmable power technology lowers prototype power burn during debug cycles by ~30 percent versus fixed-power Stratix II predecessors.
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Test and Measurement Instrumentation
The EP3SL110F1152I3N fits high-end test-and-measurement equipment such as protocol analyzers, logic analyzer back-ends, and oscilloscope trigger subsystems because its 500 MHz fabric, 744 I/Os, and on-chip DSP blocks perform real-time pattern matching and statistical aggregation on multi-GHz sample streams. According to the Stratix III handbook, the device's variable-precision DSP blocks support both 18x18 and 27x27 multiplications used for FFT, FIR filtering, and channel equalization. The exposed-die FC-FBGA allows integration with thermal management in fanless bench-instrument chassis. Estimated: instrument designers can leverage the integrated transceivers for PCI Express Gen1 x4 backhaul to host processors, eliminating a separate bridge chip.
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High-Performance Computing Accelerator
The EP3SL110F1152I3N functions as a co-processor in high-performance compute nodes because its 107.5K logic elements and 4,992 Kbits of embedded memory host OpenCL and RTL compute kernels that offload CPU work. The 1152-ball FC-FBGA exposes sufficient LVDS pairs for high-bandwidth host links via PCIe Gen1 x8 edge fingers, while M9K memory blocks implement scatter-gather DMA buffers without external DRAM for low-latency kernels. According to Altera's HPC reference designs, Stratix III accelerators achieved 5-10x speedup over host CPU on financial Monte Carlo and genomic BLAST workloads. Estimated: HPC cluster deployments should provide at least 200 LFM airflow over the FC-FBGA heat-spreader to sustain the 8-10 W core dissipation at full utilization.
추천
Video Broadcast and Image Processing
The EP3SL110F1152I3N serves video broadcast routers, real-time video mixers, and image processing pipelines because its 107.5K logic elements and 744 I/Os deliver simultaneous multi-channel HD-SDI processing and 10-bit color-space conversion. Embedded DSP blocks implement 2D FIR filters and motion-estimation primitives at full frame rate, while M9K memory blocks store line buffers and pixel histograms. According to the Altera broadcast reference design library, Stratix III FPGAs commonly support 12-channel 3G-SDI multiplexing with on-chip PTP timestamping. Estimated: at full 12-channel 3G-SDI utilization, the FC-FBGA requires a forced-air-cooled heatsink to maintain junction temperature below 100C in enclosed broadcast rack environments.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP3SL110F1152I3N — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP3SL110F1152C4N | EP3SL110F1152C3N | EP3SL110F1152C5N | EP4SL110F1152I3N | EP3SE110F1152I3N |
|---|---|---|---|---|---|---|
| Package | 1152-ball FC-FBGA | 1152-ball FC-FBGA - same | 1152-ball FC-FBGA - same | 1152-ball FC-FBGA - same | 1152-ball FC-FBGA - same | 1152-ball FC-FBGA - same |
| Brand | Altera | Altera | Altera | Altera | Altera | Altera |
| Logic Elements | 107,500 | 107,500 (identical die) | 107,500 (identical die) | 107,500 (identical die) | 107,500 (Stratix IV) | 107,500 (Stratix III E) |
| Speed Grade | I3 | C4 (slower) | C3 | C5 (slowest) | I3 | I3 |
| Operating Temperature Range | -40C to +100C (Industrial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | -40C to +100C (Industrial) | -40C to +100C (Industrial) |
| Core Voltage | 1.1 V | 1.1 V | 1.1 V | 1.1 V | 0.9 V (Stratix IV) | 1.1 V |
| Family | Stratix III L | Stratix III L | Stratix III L | Stratix III L | Stratix IV | Stratix III E |
| User I/Os | 744 | 744 | 744 | 744 | 744 | 744 |
| Process Technology | 65 nm | 65 nm | 65 nm | 65 nm | 40 nm | 65 nm |
주요 차별점
- Programmable power technology reduces static power (vs EP3SE110F1152I3N)
- Industrial temperature grade for harsh environments (vs EP3SL110F1152C3N)
- Pin-compatible upgrade path to Stratix IV (vs EP4SL110F1152I3N)
설계 노트
The 1152-ball FC-FBGA package exposes the die directly; thermal management is critical for Stratix III devices. Estimated: at 70 percent logic utilization, 500 MHz fMAX, and 1.1 V VCC, core power approaches 8 W, which the integrated heat-spreader surface dissipates only with a low-profile heatsink rated for at least 10 W plus 200 LFM airflow. Reference the Stratix III handbook power management chapter for thermocouple-based theta_JB measurement procedures and derating curves.
The 1152-ball FC-FBGA requires a high-density PCB stack-up with 1.0 mm ball pitch, microvia-in-pad construction, and matched-length impedance control for LVDS and transceiver channels. Per Altera layout guidelines, use at least 6 PCB layers with dedicated ground and power planes adjacent to the BGA breakout layer. Decoupling: 470 uF bulk, 47 uF mid-frequency, and 100 nF high-frequency ceramic capacitors per VCC/VCCH/VCCR pin pair, placed within 100 mil of the package ball.
The Stratix III L 'L' suffix denotes the lower-power variant with programmable power technology that adjusts logic and routing resources based on timing slack. Estimated: enabling the programmable-power feature reduces static power by ~25 percent compared to the standard Stratix III E variant of the same logic density. Use Quartus II PowerPlay Power Analyzer to validate power budget against your design's toggle rate, signal activity, and junction temperature constraints.
Do not confuse the EP3SL110F1152I3N (Stratix III L, industrial) with the EP3SE110F1152I3N (Stratix III E, enhanced) - they share the same package and pinout but differ in process tuning and DSP performance. Verify the device family letter before PCB assembly to avoid mixing power-distribution network values. Also note the I3/C3/C4/C5 speed-grade ordering: I3 is fastest industrial, C5 is slowest commercial. Mixing speed grades on the same timing-critical bus can violate setup/hold margins.
Configuration mode selection (JTAG, Passive Serial, Fast Passive Parallel) requires correct MSEL pin strapping on the PCB. Per Stratix III handbook chapter on configuration, leave MSEL[2:0] accessible via jumper or test point for in-system reprogramming flexibility. For multi-FPGA prototyping chains, daisy-chain CONF_DONE and nSTATUS signals with appropriate pull-up resistors and isolate the JTAG TDO-to-TDI chain through series resistors for boundary-scan isolation.
규정 준수 정보
Compliance data not available in verified web data sources; engineers should request RoHS/REACH certificates from the distributor or manufacturer directly. AEC-Q100 is not applicable as this is an FPGA, not an automotive-grade IC.