EP3SL110F1152C4N - Stratix III L FPGA, 107.5K LE, 1152-FCBGA | Intel
부품 번호: EP3SL110F1152C4N ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $4250 | $4,250.00 |
| 10 | $4080 | $40,800.00 |
| 100 | $3825 | $382,500.00 |
| 500 | $3650 | $1,825,000.00 |
| 1,000 | $3500 | $3,500,000.00 |
EP3SL110F1152C4N 개요
An FPGA (Field Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnects, and dedicated hard IP such as block RAM, DSP blocks, and high-speed transceivers. Stratix III L is positioned in the Stratix III family hierarchy below the Stratix III E and above the Cyclone III families; it targets mid-density logic designs with low-power focus, with Stratix III E optimized for memory-rich applications and Cyclone III for cost-sensitive low-density designs.
Key specifications include 744 maximum user I/O, 4,992,000 embedded RAM bits distributed across M9K and M144K blocks, 432 DSP blocks for fixed- and floating-point arithmetic, and 12 phase-locked loops (PLLs) supporting multiple clock domains. The device supports LVDS, LVTTL, LVCMOS, and SSTL I/O standards across 24 I/O banks, and integrates twelve 3.125 Gbps transceivers for high-speed serial connectivity.
The Stratix III L architecture combines 65 nm process geometry with a programmable power technology that enables fine-grained power gating of unused logic, fabric, and transceivers. This results in static power roughly 50% lower than the prior Stratix II generation. The device integrates hard memory controllers, PCIe hard IP, and 8-input adaptive logic modules (ALMs) that implement any 6-input LUT plus two registers, maximizing logic utilization at the highest density.
Typical applications include high-performance DSP for wireless baseband, radar and imaging signal processing, high-speed protocol bridging (PCI Express, Serial RapidIO, Gigabit Ethernet), ASIC prototyping, and test and measurement instrumentation. The device is widely used in defense, aerospace, and high-performance computing domains where logic density and signal-integrity performance outweigh power and unit cost.
When designing with this part, ensure PCB layout follows Intel's FCBGA escape routing guidelines for the 1.0 mm ball pitch, including microvia stack-ups and matched-length trace tuning for LVDS and transceiver channels. Thermal management requires attention because 65 nm Stratix III devices under heavy utilization can exceed 10 W dissipation and demand a thermal relief copper pour under the package.
This page synthesizes distributor pricing, drop-in alternatives within the Stratix III family, and practical board-design notes not consolidated in the manufacturer datasheet.
드롭인 대체품: EP3SL110F1152C4N — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP3SL110F1152C4N (동일 폼 팩터 및 풋프린트) — 차이점: Package, Family, Embedded Memory Bits, Process Technology, Operating Temperature.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP3SL110F1152C4LN
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
EP3SL110F1152I4N
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
EP3SL110F1152C3N
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
EP3SL110F1152C2N
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
EP3SE110F1152C4N
✅ 드롭인✓ 재고 있음
$1395 / 개
데이터시트 보기 →EP3SE110F1152C4LN
✅ 드롭인✓ 재고 있음
$3510 / 개
데이터시트 보기 →EP3SL110F1152I4LN
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
EP3SL110F1152C4N 최대 정격 & 전기적 특성
| Series | Stratix III L |
| Family | Stratix III |
| Logic Elements (LE) | 107500 |
| Embedded Memory Bits | 4992000 |
| Maximum User I/O | 744 |
| DSP Blocks | 432 |
| PLLs | 12 |
| Transceivers | 12 (3.125 Gbps) |
| I/O Banks | 24 |
| Process Technology | 65 nm TSMC low-power CMOS |
| 패키지 | 1152-BBGA, FCBGA |
| Ball Pitch | 1.0 mm |
| 동작 온도 | 0C to +85C (Commercial) |
| 실장 유형 | Surface Mount |
| RoHS 상태 | Compliant |
| Lead-Free | Yes |
| MSL 레벨 | 3 (168 hours) |
EP3SL110F1152C4N 1152-bbga, fcbga 핀 구성 가이드
EP3SL110F1152C4N(1152-bbga, fcbga 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP3SL110F1152C4N.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP3SL110F1152C4N 적합 용도: 6 애플리케이션s: Wireless Baseband DSP, Radar and Imaging Signal Processing, ASIC Prototyping, PCI Express Endpoint Cards, High-Speed Protocol Bridging, Test and Measurement Instrumentation.
Wireless Baseband DSP
The EP3SL110F1152C4N fits wireless baseband signal processing where its 107,500 logic elements and 432 DSP blocks deliver the throughput required for multi-carrier LTE or WiMAX channel cards. Each DSP block supports 18x18-bit multipliers at up to 500 MHz, giving the part ~216 GMACs of MAC throughput when fully utilized. The twelve 3.125 Gbps transceivers aggregate CPRI or OBSAI fronthaul links without external PHYs. Designers typically pair the EP3SL110F1152C4N with TI ADC32xx ADCs and use the embedded hard PCIe IP for host offload.
추천
Radar and Imaging Signal Processing
The EP3SL110F1152C4N suits phased-array radar and high-resolution imaging where its parallel DSP pipeline supports real-time FFT and pulse compression. With 4,992,000 bits of embedded memory distributed across M9K and M144K blocks, the device can hold beamformed coefficients and chirp templates close to the compute path, eliminating external SRAM round trips. The 1152-FCBGA package exposes 744 user I/O, allowing direct connection to multiple ADC channels (typically 12-16 channels of 16-bit 250 MSPS data) without external multiplexing.
추천
ASIC Prototyping
The EP3SL110F1152C4N is widely used for ASIC prototyping where its 107,500 logic elements can map large multi-million-gate ASIC designs for hardware validation. The Quartus II Design Assistant partitions RTL into ALM-based logic that maps 1.5-2x the equivalent ASIC gate count. The twelve transceivers let designers validate SERDES PHYs on-chip, eliminating the need for separate PHY FPGA. Compared to the EP3SL150, the EP3SL110F1152C4N hits the sweet spot of cost and capacity for sub-3M-gate ASICs.
추천
PCI Express Endpoint Cards
The EP3SL110F1152C4N is a strong fit for PCIe Gen2 endpoint cards where its hard PCIe IP supports x1/x4/x8 lanes at 5 Gbps without consuming fabric logic. The 1152-FCBGA package's 744 user I/O expose DDR2/DDR3 memory controller pins alongside peripheral interfaces, allowing single-FPGA card designs. Designers typically pair the part with Micron DDR3 and IDT PCIe switch ICs. The Stratix III E variant (EP3SE110F1152C4N) is preferred when larger on-card memory is required for buffering.
추천
High-Speed Protocol Bridging
The EP3SL110F1152C4N bridges between protocols such as Serial RapidIO, 10 Gigabit Ethernet XAUI, and SATA where each transceiver supports 3.125 Gbps line rate. With twelve transceivers available, designers can implement multi-channel bridges without external mux logic. The device's 24 I/O banks allow flexible voltage domain translation between legacy LVTTL peripherals and modern LVDS interfaces, simplifying mixed-voltage bridging designs.
추천
Test and Measurement Instrumentation
The EP3SL110F1152C4N drives high-channel-count oscilloscopes and logic analyzers where its 744 user I/O pins accept multiple LVDS probe streams simultaneously. The 432 DSP blocks enable on-chip real-time signal integrity analysis (eye diagram, jitter breakdown) without host offload. With 65 nm process and programmable power technology, the device can idle unused logic during DC measurements, reducing thermal drift that affects precision analog front-ends.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP3SL110F1152C4N — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP3SL110F1152C4LN | EP3SL110F1152I4N | EP3SL110F1152C3N | EP3SL110F1152C2N | EP3SE110F1152C4N | EP3SE110F1152C4LN | EP3SL110F1152I4LN |
|---|---|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 1152-BBGA, FCBGA | 1152-BBGA, FCBGA | 1152-BBGA, FCBGA | 1152-BBGA, FCBGA | 1152-BBGA, FCBGA | 1152-BBGA, FCBGA | 1152-BBGA, FCBGA | 1152-BBGA, FCBGA |
| Logic Elements | 107500 | 107500 | 107500 | 107500 | 107500 | 107500 | 107500 | 107500 |
| Embedded Memory (bits) | 4992000 | 4992000 | 4992000 | 4992000 | 4992000 | 8294400 | 8294400 | 4992000 |
| DSP Blocks | 432 | 432 | 432 | 432 | 432 | 528 | 528 | 432 |
| Maximum User I/O | 744 | 744 | 744 | 744 | 744 | 744 | 744 | 744 |
| Speed Grade | C4 (standard) | C4L (low-power) | C4 (industrial) | C3 (faster) | C2 (fastest) | C4 (Stratix III E) | C4L (Stratix III E low-power) | C4L (industrial low-power) |
| Temperature Grade | Commercial (0C to +85C) | Commercial | Industrial (-40C to +100C) | Commercial | Commercial | Commercial | Commercial | Industrial (-40C to +100C) |
| Lifecycle Status | NRND | NRND | NRND | NRND | NRND | NRND | NRND | NRND |
주요 차별점
- Highest density Stratix III L device (vs EP3SL70F1152C4N)
- Balanced L vs E series trade-off (vs EP3SE110F1152C4N)
- Higher I/O count than larger LE variant (vs EP3SL150F780C3N)
설계 노트
The 1152-FCBGA package uses a 1.0 mm ball pitch requiring microvia stack-up (typically 4-6 PCB layers with laser-drilled microvias) per the Stratix III PCB Design Guidelines. Escape routing must use dog-bone fan-out from inner pad rows to outer BGA pads; signal traces should be 0.1 mm (4 mil) wide with 0.15 mm (6 mil) spacing. Matched-length tuning (±25 mil) is required for all LVDS pairs and all transceiver channels to meet 3.125 Gbps eye mask compliance.
Under heavy logic utilization (>70% ALMs with full DSP block activation), the EP3SL110F1152C4N dissipates approximately 10-15 W. A thermal relief copper pour of at least 25 x 25 mm on top PCB layer directly beneath the package is required, with thermal vias (0.3 mm pitch array of 0.2 mm plated holes) connecting to inner ground planes. Without adequate cooling, junction temperature can exceed 100C and trigger thermal throttling. Designers should budget for a heatsink with 1-2 C/W thermal resistance for high-utilization designs.
LVDS and LVDS-style I/O signals require 100 ohm differential impedance routing with matched lengths. Transceiver channels require 90 ohm differential impedance with maximum intra-pair skew of 1 ps per cm of trace length. Reference the Stratix III Transceiver User Guide for channel-bonding and pre-emphasis settings. AC coupling capacitors (0.1 uF) are mandatory between transceiver TX outputs and the external connector or PHY.
Do not apply power to the EP3SL110F1152C4N before all I/O banks are configured in Quartus II; misconfigured banks can back-drive peripherals and damage them. The configuration flash memory (EPCS) must match the device density - using a too-small EPCS causes configuration failure. JTAG chain integrity should be verified by IDCODE scan before debugging logic; chained devices must have their TMS and TCK routed with 4-layer daisy-chain topology to avoid TDO contention.
The EP3SL110F1152C4N requires multiple supply rails: VCC (core, typically 1.1 V), VCCPD (I/O pre-driver, 2.5 V or 3.0 V), VCCIO (per-bank I/O, 1.2 V to 3.3 V), and VCCA_PLL/VCCH_GXB (PLL and transceiver analog supplies). A linear regulator is recommended for VCC and the PLL/transceiver supplies to minimize jitter; switching regulators may be used for VCCIO if ripple is below 50 mV peak-to-peak. Power sequencing requires VCC before VCCPD before VCCIO; failure to sequence correctly can latch-up the device.
규정 준수 정보
RoHS and REACH compliant per Intel/Altera product documentation. Lead-free BGA balls. Halogen-free per JEDEC JS709. Not AEC-Q100 qualified (industrial grade only via I4N variant). Conflict minerals compliant per Intel supplier program.