EP3SL200H780C4 - Stratix III L FPGA, 200K LE, 780-BGA | Altera
부품 번호: EP3SL200H780C4 ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $1850 | $1,850.00 |
| 10 | $1720 | $17,200.00 |
| 100 | $1560 | $156,000.00 |
| 500 | $1380 | $690,000.00 |
| 1,000 | $1210 | $1,210,000.00 |
EP3SL200H780C4 개요
Key features include a Stratix III L core fabric built on a 40 nm TSMC process, an internal operating frequency up to 800 MHz, and an enhanced MultiTrack interconnect with TriMatrix memory blocks. The device supports up to 12 transceiver channels (per Stratix III L family capabilities), hard PCIe Gen1/Gen2 IP cores, and dedicated DSP blocks capable of delivering multiple GMACs/s of DSP throughput. It also integrates hard memory controllers for DDR3/DDR2/QDRII+/RLDRAM II external memory interfaces with on-chip termination.
What is an FPGA? An FPGA (Field Programmable Gate Array) is a semiconductor integrated circuit composed of configurable logic blocks (CLBs), programmable interconnects, and dedicated silicon resources such as block RAM, DSP slices, PLLs, and high-speed transceivers. FPGAs sit within the broader category of programmable logic devices (PLDs) under the umbrella of logic ICs. Designers use hardware description languages such as VHDL or Verilog to define arbitrary digital functions, allowing the same silicon to be reconfigured for many different applications without changing the PCB.
From an architectural standpoint, the EP3SL200H780C4 leverages a Stratix III L fabric optimized for low dynamic power while preserving timing margin at 800 MHz internal speeds. The MultiTrack interconnect uses a row/column structure that minimizes routing congestion, while the TriMatrix memory blocks deliver three different aspect-ratio RAMs (MLAB, M9K, M144K) selectable at compile time. Hard DSP blocks implement 18x18 multipliers, adders, accumulators, and shift registers, and PCIe hard IP blocks reduce soft-logic footprint for Gen1/2 endpoint and root-port designs.
Typical applications include high-end telecommunications line cards, military radar and electronic-warfare signal processing, ASIC prototyping, high-definition video broadcast equipment, and high-speed serial protocol bridging. The 488 user I/Os also allow direct connection to DDR3 memory buses, high-speed ADC/DAC devices, and parallel data acquisition fabrics.
When designing with the EP3SL200H780C4, ensure the PCB incorporates a minimum of 8 layers with continuous GND planes beneath the BGA to control return paths for the 800 MHz fabric and any high-speed transceivers. Power sequencing for VCC, VCCP, VCCAUX, and VCCPGM must follow the Altera reference design or damage may occur at power-up.
This page synthesizes distributor stock and pricing, same-family drop-in alternatives with the same 780-ball FCBGA footprint, and practical design notes not aggregated elsewhere on the web.
드롭인 대체품: EP3SL200H780C4 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP3SL200H780C4 (동일 폼 팩터 및 풋프린트) — 차이점: Package, Speed Grade, Operating Temperature, Embedded Memory Bits, Family.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP3SL200H780C3N
✅ 드롭인✓ 재고 있음
$4995 / 개
데이터시트 보기 →EP3SL200H780C3
✅ 드롭인✓ 재고 있음
$5900 / 개
데이터시트 보기 →EP3SL200H780C2N
✅ 드롭인✓ 재고 있음
$6050 / 개
데이터시트 보기 →EP3SL200H780C2
✅ 드롭인✓ 재고 있음
$6950 / 개
데이터시트 보기 →EP3SL200H780C4 최대 정격 & 전기적 특성
| Series | Stratix III L |
| Device Type | FPGA - Field Programmable Gate Array |
| Logic Elements | 200,000 |
| Number of LABs/CLBs | 8000 |
| Total RAM Bits | 10,901,504 |
| Number of I/O | 488 |
| Voltage - Supply | 0.9 V (core), 1.1 V, 1.2 V, 1.5 V, 1.8 V, 2.5 V, 3.3 V (I/O) |
| 동작 온도 | 0C to +85C (commercial) |
| Internal Operating Frequency | Up to 800 MHz |
| 실장 유형 | Surface Mount |
| 패키지 / 케이스 | 780-BBGA, FCBGA |
| Supplier Device Package | 780-FCBGA |
| Process Node | 40 nm TSMC |
| Multiplier Count (9-bit) | 488 |
| RoHS 상태 | Compliant (lead-free) |
EP3SL200H780C4 780-fcbga 핀 구성 가이드
EP3SL200H780C4(780-fcbga 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP3SL200H780C4.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP3SL200H780C4 적합 용도: 6 애플리케이션s: High-End Telecom Line Card, Military Radar / EW Signal Processing, ASIC Prototyping, High-Definition Video Broadcast Equipment, High-Speed Serial Protocol Bridging, Industrial Automation Controller.
High-End Telecom Line Card
The EP3SL200H780C4 fits high-density telecom line cards because its 200,000 logic elements, 488 user I/Os, and 10,901,504 bits of embedded RAM support multi-channel framer, mapper, and MAC processing on a single die. Up to 800 MHz internal fabric operation enables wire-speed packet handling at 10G+ line rates. Hard PCIe Gen2 and external memory controllers (DDR3/DDR2/QDRII+) interface directly to network processors, line-card SERDES, and look-aside memories without soft logic overhead. Power consumption in the Stratix III L family is optimized relative to comparable density devices, allowing denser line-card layouts.
추천
Military Radar / EW Signal Processing
The 488 dedicated 18x18 hardware multipliers on EP3SL200H780C4 deliver multi-GMACs/s of DSP throughput needed for radar pulse compression, MTI filtering, and electronic-warfare channelization. The 800 MHz fabric with TriMatrix memory blocks lets designers implement large FFT cores, polyphase filter banks, and adaptive beamforming weights with deterministic latency. 488 user I/Os fan out to multi-channel ADC/DAC arrays (e.g. EV12AS350, AD9230) at sample rates up to 250 MSPS per lane. Industrial-temp variants from the same family support -40C to +100C deployment if extended temperature is required.
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ASIC Prototyping
The EP3SL200H780C4 maps large ASIC RTL blocks because of its 200K logic elements, hardware-debug infrastructure (SignalTap / Logic Analyzer), and abundant M9K/M144K block RAM that mirrors typical ASIC memory hierarchies. The 780-FCBGA footprint exposes 488 user I/Os, allowing realistic ASIC pinout prototyping including DDR3 controller verification at speed. Quartus Prime synthesis and TimeQuest timing closure provide ASIC-grade sign-off metrics. Designers commonly partition the ASIC across multiple Stratix III devices, using the SL200 as one of the largest building blocks.
추천
High-Definition Video Broadcast Equipment
The EP3SL200H780C4 is well suited to HD/3G-SDI broadcast routers, video format converters, and H.264/HEVC pre-processors where the 800 MHz fabric performs multiple channels of 1080p60 processing simultaneously. The 488 hardware multipliers accelerate motion-estimation and deblocking-filter kernels, while the TriMatrix memory absorbs line and frame buffers without external SRAM. 488 user I/Os expose SDI serializer/deserializer interfaces (e.g. LMH0303, GS2971) and HD-SDI crosspoint switches. The FCBGA package supports industrial-temperature 0C to +85C deployment typical of broadcast head-end racks.
추천
High-Speed Serial Protocol Bridging
The EP3SL200H780C4 acts as a low-latency protocol bridge between PCIe Gen2, Serial RapidIO, 10G Ethernet MAC, and custom LVDS interfaces, leveraging hard multi-gigabit transceivers supported in the Stratix III L family. Designers can instantiate soft PCS/PMA macros for additional protocols while the FPGA fabric handles packet reassembly, DMA, and protocol translation. 488 user I/Os support multi-channel LVDS bridges to legacy backplanes. PCI-SIG compliance and timing closure are achievable with Quartus Prime reference designs.
추천
Industrial Automation Controller
Industrial PLCs, motion controllers, and deterministic EtherCAT masters can leverage EP3SL200H780C4 for multi-axis kinematic computation, EtherCAT / Profinet cycle-time management, and machine-vision pre-processing. The 488 hardware multipliers accelerate inverse-kinematics and PID loops across dozens of axes at sub-microsecond cycle times. 488 user I/Os host SSI / BiSS / EnDat encoder interfaces, isolated digital I/O, and high-speed analog front-ends via LVDS. The 0C to +85C operating range and 40 nm low-power Stratix III L fabric suit 24/7 factory-floor operation.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP3SL200H780C4 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP3SL200H780C3N | EP3SL200H780C3 | EP3SL200H780C2N | EP3SL200H780C2 |
|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera |
| Package | 780-FCBGA | 780-FCBGA - same | 780-FCBGA - same | 780-FCBGA - same | 780-FCBGA - same |
| Logic Elements | 200,000 | 200,000 | 200,000 | 200,000 | 200,000 |
| Number of LABs/CLBs | 8000 | 8000 | 8000 | 8000 | 8000 |
| Total RAM Bits | 10,901,504 | 10,901,504 | 10,901,504 | 10,901,504 | 10,901,504 |
| User I/O | 488 | 488 | 488 | 488 | 488 |
| 9-bit Multipliers | 488 | 488 | 488 | 488 | 488 |
| Speed Grade | C4 | C3 (slightly slower) | C3 | C2 (slower, higher yield) | C2 |
| Lead Finish | Lead-free (SnAgCu) | Lead-free | SnPb (leaded) | Lead-free | SnPb (leaded) |
| Operating Temperature | 0C to +85C (commercial) | 0C to +85C | 0C to +85C | 0C to +85C | 0C to +85C |
주요 차별점
- Same-package speed-grade flexibility (vs EP3SL200H780C2N)
- Lead-free (RoHS) compliance (vs EP3SL200H780C3 (SnPb leaded))
- High multiplier density for DSP (vs EP3SE80F780I4 (Stratix III E))
설계 노트
Estimated: at 800 MHz internal fabric and 488 user I/Os toggling simultaneously, route the FCBGA breakout with microvia / stacked-via technology. Use an 8-layer stackup minimum with continuous GND planes on layers 2 and 7 to provide low-impedance return paths for the high-speed fabric. The 1.0 mm ball pitch requires 0.5 mm trace/space escape routing; pair each signal with a continuous ground-reference via fence within 2x the dielectric thickness.
Estimated: VCC core current at 800 MHz can approach 4-6 A on the 200K-LE device; place low-ESR ceramic decoupling within 100 mil of each power pin (VCC, VCCP, VCCAUX, VCCPGM). Implement the Altera-recommended power-on sequence (VCC -> VCCAUX -> VCCIO) with monotonic ramps of 1 ms minimum to avoid in-rush latch-up. Use a dedicated voltage supervisor such as TPS3890 to enforce sequencing.
Estimated: at full logic utilization and 800 MHz fabric toggle, the Stratix III L 780-FCBGA can dissipate 8-12 W. Attach a heatsink with thermal interface material (TIM) rated for 0.1 C-in2/W or better, and provide 200 LFM of forced-air cooling. Avoid placing the FPGA adjacent to high-heat sources to prevent junction-temperature derating.
Do not assume the EP3SL200H780C4 is pin-compatible with EP3SE260H780C4 - although both use the 780-ball FCBGA, the LE count differs (200K vs 260K) which changes utilization metrics and may shift timing closure paths. Always re-run TimeQuest timing analysis after a substitution. Also confirm that the JTAG chain is properly terminated with TCK/TMS pull-ups per IEEE 1149.1.
규정 준수 정보
RoHS-compliant lead-free finish per Altera/Intel PSG product page; AEC-Q100 not applicable (FPGA not automotive qualified); conflict-mineral declaration compliant per Intel PSG CMRT.