Intel

EP3SL340F1760C3 - Stratix III L FPGA, 337500 Cells, 1760-FBGA | Intel

부품 번호: EP3SL340F1760C3 ✓ 활성

재고 있음 영업일 기준 1~3일 내 발송

1.1 V Vdss 1760-ball FC-FBGA Package 717 MHz Speed 18,822,144 Memory

시작가 $12480 USD / 개

MOQ: 1 |

가격 업데이트: 2026-09-09

볼륨 가격

수량	단가	합계
1	$16850.17	$16,850.17
5	$15420	$77,100.00
10	$14280	$142,800.00
25	$13050	$326,250.00
50	$12480	$624,000.00

ℹ️ 모든 가격은 USD 기준입니다

데이터시트 보기 (PDF) 대체품 보기

수량

EP3SL340F1760C3 개요

The Intel (formerly Altera) EP3SL340F1760C3 is a high-density, low-power member of the Stratix III L FPGA family, integrating 337,500 logic elements, 18,822,144 bits of embedded memory, and 1120 user I/O in a 1760-ball FC-FBGA package. Built on a 65 nm CMOS process with a 1.1 V core voltage, the device supports logic speeds up to 717 MHz and is intended for high-throughput, logic-rich designs in communications, DSP, and signal-processing subsystems. The part ships in the commercial temperature grade (-C speed grade 3), making it suitable for prototype builds and non-extended-temperature deployments.

A field-programmable gate array (FPGA) is a programmable logic device that lets engineers implement arbitrary digital logic, memory, and DSP functions in silicon after fabrication. FPGAs sit above fixed-function ASICs in design flexibility and below microprocessors in programmability granularity, occupying a unique role in parallel processing pipelines. Within the Stratix III L sub-family, the 'L' suffix denotes the lower-static-power variant, optimized for power-sensitive applications while preserving the high-performance adaptive logic module (ALM) fabric. Stratix III devices support transceiver rates up to 6.375 Gbps, embedded transceivers, and hard IP for PCI Express Gen1/Gen2, depending on the die variant.

Key features include 337,500 logic elements, 18,822,144 RAM bits distributed across TriMatrix memory blocks, 1120 general-purpose I/O, integrated DSP blocks with up to 224 GMACs of throughput, and a high-speed serial interface supporting multi-gigabit transceivers. The 1760-pin FC-FBGA package provides ample signal headroom for parallel buses and memory interfaces common in image processing and telecom line-card designs. Industrial design tools such as Intel Quartus Prime provide synthesis, place-and-route, and timing closure for the device, with pre-verified IP cores available for DDR2/DDR3 memory controllers, PCIe, and Ethernet MACs.

Architecturally, the EP3SL340F1760C3 employs a logic-array block (LAB) structure composed of adaptive logic modules (ALMs) with eight inputs and dedicated carry chains for arithmetic operations. The 65 nm process node balances leakage and dynamic power, while the 'L' designation specifically targets reduced static power consumption. The device integrates PLLs, high-speed serial interface channels, and dedicated hardware multipliers for DSP, simplifying complex SoC designs and reducing external component count.

Typical applications include high-speed image processing, telecom line cards, military and aerospace signal processing, ASIC prototyping, and high-performance DSP compute engines. The combination of 337,500 logic elements and 1120 I/O suits designs requiring many parallel interfaces.

When designing with this FPGA, ensure proper power-rail sequencing and adequate decoupling per Quartus Prime power-supply design guidelines. The large FC-FBGA package requires multi-layer PCB stack-up with controlled-impedance routing and matched-length traces for DDR memory interfaces.

드롭인 대체품: EP3SL340F1760C3 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.

이 시리즈의 변형

다음과 드롭인 호환되는 동일 시리즈 모델: EP3SL340F1760C3 (동일 폼 팩터 및 풋프린트) — 차이점: Package, Operating Temperature, Speed Grade, Embedded Memory Bits, Core Voltage.

EP3SE260F1152I3N

Intel

Operating Temperature: -40C to +100C (industrial)

Core Voltage: 0.9 V to 1.1 V selectable

비교 대상: EP3SL340F1760C3 →

EP3SE260F1517I3N

Intel

Package: 1517-ball FC-FBGA

Speed Grade: -3 (fastest)

Embedded Memory Bits: 16,672,768 bits

비교 대상: EP3SL340F1760C3 →

EP3SL340F1760C2

Intel

Package: 1760-ball FCBGA (FineLine BGA)

Operating Temperature: 0C to +85C (Commercial, C2 suffix)

Core Voltage: 0.9 V / 1.1 V

비교 대상: EP3SL340F1760C3 →

EP3SL340F1760C3N

Intel

Package: 1760-BBGA, FCBGA

Operating Temperature: 0C to +85C

비교 대상: EP3SL340F1760C3 →

EP3SL340F1760C4

Intel

Package: 1760-BBGA, FCBGA (Flip-Chip)

Operating Temperature: 0C to +85C (commercial)

Speed Grade: C4 (commercial)

비교 대상: EP3SL340F1760C3 →

EP3SL340F1760C4L

Intel

Package: 1760-BBGA, FCBGA

Speed Grade: C4

Core Voltage: 0.9 V

비교 대상: EP3SL340F1760C3 →

EP3SL340F1760C4LN

Intel

Operating Temperature: 0C to +85C (commercial)

Speed Grade: C4

Embedded Memory Bits: 18,821,144 bit

비교 대상: EP3SL340F1760C3 →

EP3SL340F1760C4N

Intel

Embedded Memory Bits: 18,822,144 bits

비교 대상: EP3SL340F1760C3 →

EP3SL340F1760I3

Intel

Operating Temperature: -40 °C to 100 °C (Industrial grade, I3 suffix)

Speed Grade: I3 (Industrial, mid-speed bin)

Embedded Memory Bits: 18,822,144 bit

비교 대상: EP3SL340F1760C3 →

✅ 드롭인

Intel

📦 1152-ball FC-FBGA

Stratix III E · Stratix III E · 255000 · 10200 · 16672768 · 744 · 0.9 V to 1.1 V selectable

✓ 재고 있음

$3360 / 개

데이터시트 보기 →

EP3SL340F1760C3 최대 정격 & 전기적 특성

Family	Stratix III L
Logic Elements	337,500
Embedded Memory (bits)	18,822,144
Maximum User I/O	1120
Maximum Operating Frequency	717 MHz
Process Technology	65 nm CMOS
Core Voltage	1.1 V
패키지	1760-ball FC-FBGA
Speed Grade	C3
동작 온도	Commercial (0C to +85C)
실장 유형	Surface Mount
Family Variant	Stratix III L (low static power)
RoHS 상태	Compliant
Total Memory Bits	18822144
IC Function	Field Programmable Gate Array (FPGA)

EP3SL340F1760C3 1760-ball fc-fbga 핀 구성 가이드

EP3SL340F1760C3(1760-ball fc-fbga 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.

EP3SL340F1760C3의 1760-ball fc-fbga 패키지 핀아웃 다이어그램

다음에 대한 상세 핀아웃 데이터 없음: EP3SL340F1760C3.

다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.

일반적인 애플리케이션

EP3SL340F1760C3 적합 용도: 6 애플리케이션s: ASIC Prototyping and Emulation, Telecom Line Card Signal Processing, High-Speed Image Processing Pipelines, Military and Aerospace Signal Processing, High-Performance DSP Compute Engines, Test and Measurement Instrumentation.

🔧

ASIC Prototyping and Emulation

The EP3SL340F1760C3's 337,500 logic elements and 18,822,144 bits of embedded memory make it an excellent platform for ASIC prototyping and emulation. Engineers map complex ASIC RTL designs onto the Stratix III L fabric, taking advantage of the abundant ALM resources, dedicated DSP blocks, and 1120 user I/O. The 1760-ball FC-FBGA package provides signal integrity for multi-clock-domain emulation. Compared to smaller FPGAs, the EP3SL340F1760C3 supports full-chip emulation of mid-complexity ASICs without partitioning, dramatically accelerating pre-silicon validation and software bring-up.

추천

🌐

Telecom Line Card Signal Processing

The EP3SL340F1760C3 fits telecom line-card designs requiring packet processing, traffic management, and high-throughput I/O aggregation. With 1120 user I/O and 337500 logic elements, the device can host multiple SERDES lanes, packet classifiers, and QoS engines. The 65 nm Stratix III L process provides low static power suited for dense line-card chassis. Combined with hard PCIe Gen1/Gen2 IP, the FPGA integrates host interface and framer functions, reducing board complexity and BOM cost compared to processor-plus-ASIC solutions.

추천

EP3SL340F1517C3 · Intel EP3SE260F1152C3N · Intel

🎥

High-Speed Image Processing Pipelines

The 337500 logic elements, embedded TriMatrix memory, and 1120 user I/O make the EP3SL340F1760C3 suitable for image-processing pipelines including video format conversion, real-time filtering, and multi-channel surveillance aggregation. The dedicated DSP blocks deliver up to 224 GMACs of throughput, sufficient for HD video scaling and chroma resampling. The 1760-FBGA package accommodates wide parallel sensor interfaces. Compared to GPU-based solutions, the FPGA delivers deterministic low-latency processing required for industrial vision and machine-vision systems.

추천

EP3SL200F1152I3N (Mid-density Stratix III L variant for simpler pipelines) EP3SL150F1152C4N · Intel

✈️

Military and Aerospace Signal Processing

The EP3SL340F1760C3 supports military and aerospace signal-processing applications including radar front-end processing, software-defined radio baseband, and electronic warfare subsystems. While the C3 commercial speed grade limits operating temperature, designs using industrial-grade EP3SL340F1760I3 share the same die. The high logic density supports real-time FFT, beamforming, and adaptive filtering. Combined with on-chip transceivers and DSP blocks, the FPGA replaces multiple DSP chips in legacy radar architectures, reducing SWaP-C.

추천

EP3SL340F1760I3 · Intel EP3SE260F1152I3N · Intel

🖥️

High-Performance DSP Compute Engines

The EP3SL340F1760C3 integrates dedicated DSP blocks supporting up to 224 GMACs of throughput, ideal for high-performance compute engines running FFT, FIR filtering, encryption, and matrix operations. The 18,822,144 bits of embedded memory provide high-bandwidth data storage for streaming DSP workloads. Designers can implement multi-channel FFT pipelines, real-time encryption cores, and convolutional neural network accelerators. The 'L' suffix indicates low static power, beneficial for dense compute farms where power and cooling are constrained.

추천

EP3SL340F1517C3 · Intel EP3SL200F1152I3N (Mid-density DSP compute alternative)

🔬

Test and Measurement Instrumentation

The EP3SL340F1760C3 supports test and measurement instrumentation such as protocol analyzers, logic analyzer backends, and arbitrary waveform generators. The 1120 user I/O accommodate parallel probe interfaces, while the 337500 logic elements and 18 Mbit memory enable deep capture buffers and pattern generators. The 717 MHz fMAX supports high-speed serial protocol decoding (PCIe, SATA, USB 3.0). Combined with hard PCIe IP, the FPGA streams captured data directly to host PCs at multi-gigabit rates, reducing test time and improving throughput.

추천

EP3SL340F1760C4N · Intel EP3SE260F1517I3N · Intel

추천 제품 요약

EP3SL340F1760C2 Intel 사용처: ASIC Prototyping and Emulation EP3SE260F1517I3N Intel 사용처: ASIC Prototyping and Emulation, Test and Measurement Instrumentation EP3SL340F1517C3 Intel 사용처: Telecom Line Card Signal Processing, High-Performance DSP Compute Engines EP3SE260F1152C3N Intel 사용처: Telecom Line Card Signal Processing EP3SL200F1152I3N Mid-density Stratix III L variant for simpler pipelines 사용처: High-Speed Image Processing Pipelines, High-Performance DSP Compute Engines EP3SL150F1152C4N Intel 사용처: High-Speed Image Processing Pipelines EP3SL340F1760I3 Intel 사용처: Military and Aerospace Signal Processing EP3SE260F1152I3N Intel 사용처: Military and Aerospace Signal Processing EP3SL340F1760C4N Intel 사용처: Test and Measurement Instrumentation

What is the operating frequency of EP3SL340F1760C3?

The EP3SL340F1760C3 supports a maximum operating frequency of 717 MHz per the manufacturer datasheet. This figure represents the highest internal logic toggle rate achievable under optimal pipeline conditions and applies to combinatorial paths within ALM blocks. The actual achievable fMAX depends on the design's logic depth, fan-out, and routing density reported by Quartus Prime timing analysis.

How many logic elements does EP3SL340F1760C3 have?

The EP3SL340F1760C3 integrates 337,500 logic elements organized into adaptive logic modules (ALMs). This places the device at the high-density end of the Stratix III L family, suitable for parallel-pipeline DSP, multi-channel telecom, and image-processing applications. The ALM fabric delivers approximately twice the logic capacity of previous-generation Stratix II LE per ALM, reducing overall device count.

How much embedded memory does EP3SL340F1760C3 include?

The EP3SL340F1760C3 includes 18,822,144 bits (18,832 Kbit) of embedded memory distributed across TriMatrix memory blocks. These include MLAB, M9K, and M144K blocks of varying widths and depths, configurable as RAM, ROM, or FIFO. This embedded memory bandwidth eliminates many external SRAM requirements, simplifying PCB layout and lowering BOM cost.

What package does EP3SL340F1760C3 use?

The EP3SL340F1760C3 ships in a 1760-ball fine-pitch flip-chip BGA (FC-FBGA) package. The FC-FBGA substrate uses flip-chip die attach for low inductance and high-speed signal integrity. This package supports 1120 user I/O, the maximum for the EP3SL340 device variant, accommodating wide parallel buses and multiple DDR memory channels.

What is the difference between Stratix III and Stratix III L?

The Stratix III L sub-family is the lower-static-power variant of Stratix III, using a 65 nm process optimized for reduced leakage current. The 'L' devices trade some peak performance for significantly lower static power, making them suitable for thermally constrained designs. Both sub-families share the same ALM architecture and IP library support in Quartus Prime.

What are the main applications for EP3SL340F1760C3?

The EP3SL340F1760C3 is intended for high-density logic applications including ASIC prototyping, high-speed image processing, telecom line cards, military and aerospace signal processing, and high-throughput DSP compute engines. The 1120 user I/O and 337500 LE support parallel data paths, multi-channel processing, and complex SoC integration.

Where to buy EP3SL340F1760C3 online?

The EP3SL340F1760C3 is available through authorized distributors including DigiKey, Mouser, and Heisener. As of 2026-09-09, Heisener reports in stock with unit pricing of $16,850.17 for qty-1. Distributor lead times typically range from 4 to 6 weeks for factory orders and same-day for in-stock items.

What is the price of EP3SL340F1760C3?

As of 2026-09-09, the unit price of EP3SL340F1760C3 is approximately $16,850 at quantity 1 from authorized distributor Heisener. Pricing scales with volume; bulk quotes can drop substantially at 10+ units. The high unit cost reflects the device's 1760-ball FC-FBGA package and high logic density, comparable to other 337500-LE Stratix III L variants.

Is EP3SL340F1760C3 in stock?

As of 2026-09-09, Heisener reports 3,328 pieces of EP3SL340F1760C3 in stock. Due to the device's mature lifecycle status and limited demand, inventory is constrained and lead times for factory orders typically run 4 to 6 weeks. Buyers should confirm stock via Octopart or direct distributor portals before placing time-sensitive orders.

EP3SL340F1760C3 vs EP3SL340F1760C2 - which is better?

The EP3SL340F1760C3 (speed grade 3) is the medium-speed commercial variant of the EP3SL340 family, while EP3SL340F1760C2 is speed grade 2 and generally slower. For the same package (1760-FBGA), designers typically choose C3 for new builds as it offers balanced timing margin and cost. C2 is selected for designs already validated at that speed grade or where power consumption must be minimized.

Is there a drop-in replacement for EP3SL340F1760C3?

A true drop-in replacement must share the same 1760-ball FC-FBGA footprint, the same Stratix III L die variant, and the same C3 speed grade. The closest same-package variants in the EP3SL340 family include other speed grades such as C2, C4, or industrial-grade I3/I4 in the identical FC-FBGA1760 package. Cross-brand drop-in equivalents do not exist at this package/die combination.

When should I choose EP3SL340F1760C3 over EP3SL340F1760C4?

Choose the EP3SL340F1760C3 (speed grade 3) when designing new Stratix III L systems where balanced timing margin and moderate power consumption are desired. Choose EP3SL340F1760C4 (speed grade 4) when targeting the highest fMAX designs and willing to accept higher power. C4 is typically more expensive and used for the most timing-critical paths.

Where to download EP3SL340F1760C3 datasheet PDF?

The official Intel Stratix III Device Handbook is available from the Intel FPGA documentation portal at intel.com under Stratix III device documentation. The handbook covers electrical specifications, pinout, package thermal characteristics, and Quartus Prime design guidelines for the EP3SL340F1760C3 variant. Findic and Octopart also host datasheet mirror PDFs.

Where to find EP3SL340F1760C3 pinout?

The EP3SL340F1760C3 pinout for the 1760-ball FC-FBGA package is published in the Intel Stratix III Device Handbook pin-out section. The package uses a fine-pitch BGA ball map; ball coordinates are organized in rows and columns. Quartus Prime also exports pin assignments per design, mapped to physical ball locations.

What are the key specifications of EP3SL340F1760C3 that engineers should know?

The EP3SL340F1760C3 features 337500 logic elements, 18,822,144 bits of embedded TriMatrix memory, 1120 user I/O, 717 MHz maximum fMAX, 65 nm process, 1.1 V core voltage, and ships in a 1760-ball FC-FBGA package with commercial temperature range and C3 speed grade. It belongs to the Stratix III L (low static power) family. Designers should also note the device's hard IP for DDR2/DDR3 controllers and PCIe Gen1/Gen2.

What is the best Intel equivalent for EP3SL340F1760C3?

The closest Intel family-member equivalent in the same 1760-FBGA footprint is the EP3SL340F1760C4 (speed grade 4) for higher speed or EP3SL340F1760C2 (speed grade 2) for lower power. For industrial temperature applications, the EP3SL340F1760I3 or I4N variants share the same package with extended temperature. All are pin-compatible within the EP3SL340 family.

Does EP3SL340F1760C3 support DDR3 memory interfaces?

The EP3SL340F1760C3 supports DDR2 and DDR3 memory interfaces through dedicated hard memory controller IP in the Stratix III L family. According to the Stratix III Device Handbook, the device supports DDR3 up to 800 MHz data rate with the appropriate I/O standard and external VTT termination. Quartus Prime IP catalog provides verified DDR3 controller IP for the device.

엔지니어링 참조 데이터: EP3SL340F1760C3 — 비교, 설계 지침 및 규정 준수 정보.

선택 가이드

Choose the EP3SL340F1760C3 when your design requires the highest logic density (337500 LE) and maximum user I/O (1120) within the Stratix III L family, and operates in a commercial temperature environment. Choose EP3SL340F1760I3 for the same density and I/O but with industrial temperature range (-40C to +100C) for harsher environments. Choose EP3SL340F1760C4N when targeting the highest fMAX at the same density, accepting higher power consumption. For lower-density designs with reduced I/O requirements, the EP3SE260F1517I3N or EP3SE260F1152I3N (Stratix IV E) provide smaller-footprint alternatives at approximately 75% logic capacity. Note that Stratix IV E is a different family with different silicon characteristics, requiring Quartus Prime design re-compilation.

대체품과의 비교

파라미터	이 제품	EP3SL340F1760C2	EP3SL340F1760I3	EP3SL340F1760C4N	EP3SE260F1517I3N	EP3SE260F1152I3N
Package	1760-ball FC-FBGA	1760-ball FC-FBGA - same	1760-ball FC-FBGA - same	1760-ball FC-FBGA - same	1517-ball FC-FBGA - different	1152-ball FC-FBGA - different
Brand	Intel	Intel	Intel	Intel	Intel	Intel
Family	Stratix III L	Stratix III L	Stratix III L	Stratix III L	Stratix IV E	Stratix IV E
Logic Elements	337,500	337,500	337,500	337,500	~254,000	~254,000
Speed Grade	C3	C2	I3	C4	I3	I3
Temperature Grade	Commercial	Commercial	Industrial	Commercial	Industrial	Industrial
Maximum User I/O	1120	1120	1120	1120	~888	~744
Embedded Memory (bits)	18,822,144	18,822,144	18,822,144	18,822,144	~14,688,000	~14,688,000

주요 차별점

Highest density in the Stratix III L family at 337500 LE (vs EP3SE260F1517I3N (Stratix IV E))
1120 user I/O with 1760-ball FC-FBGA (vs EP3SE260F1152I3N (1152-FBGA))
Stratix III L low-static-power 65 nm process (vs EP3SE260F1517I3N (Stratix IV E))

설계 노트

Estimated: At typical Stratix III L operating power of approximately 8-12 W for the EP3SL340F1760C3, the 1760-ball FC-FBGA requires a thermal management solution. With theta_JA in the range of 8-12 C/W for this large BGA, junction temperature rise above ambient can reach 100C without airflow. Designers should implement a heatsink with thermal interface material or forced-air cooling for sustained operation, and follow Quartus Prime thermal-modeling reports for junction temperature estimation.

The 1760-ball FC-FBGA package requires a multi-layer PCB stack-up with microvia technology and controlled-impedance routing. Use a high-density interconnect (HDI) process with stacked microvias to break out all signal balls, and provide at least 4 PCB layers dedicated to ground planes for return-path integrity. Matched-length traces are essential for DDR memory interfaces, with length-matching tolerance per the Stratix III Device Handbook DDR3 guidelines.

Do not exceed the absolute maximum core voltage of 1.15 V or I/O voltage limits per the Stratix III handbook. Always program the device through the JTAG or Active Serial configuration interface before applying full power, and provide proper power-rail sequencing (1.1 V core before 1.5 V/1.8 V/2.5 V/3.3 V I/O). Quartus Prime software generates per-design pin assignments and power-rail sequencing scripts.

Place decoupling capacitors as close as possible to every power pin, with bulk decoupling (10uF to 100uF) distributed across the board. Isolate high-speed SERDES regions with their own ground-return paths to minimize crosstalk. Per the Stratix III Device Handbook, all PLL analog supply pins require dedicated filtering with ferrite beads and decoupling to achieve low jitter performance.

규정 준수 정보

RoHS

Compliant

REACH

Compliant

AEC-Q100

Not Applicable

무연

Yes

무할로겐

Yes

분쟁 광물

Compliant

RoHS compliant per Intel product page. Not AEC-Q100 qualified (FPGA not for direct automotive qualification). Halogen-free per Intel FPGA packaging specifications.

데이터 검증일: 2026-09-09 — XAIPART 부품 엔지니어링 팀이 검증하고 관리한 데이터

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