EP3SL70F484I4G - Stratix III L FPGA, 67.5K LE, 484-FBGA | Intel
부품 번호: EP3SL70F484I4G ⚠ 최종 구매| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $1126.63 | $1,126.63 |
| 10 | $1070.3 | $10,703.00 |
| 25 | $1013.97 | $25,349.25 |
| 50 | $957.64 | $47,882.00 |
| 100 | $901.31 | $90,131.00 |
EP3SL70F484I4G 개요
An FPGA (Field Programmable Gate Array) is a semiconductor device whose logic fabric, routing, and I/O can be reconfigured after manufacture. Stratix® III L sits within the FPGA taxonomy as a high-end, low-static-power variant of Altera's (now Intel) Stratix III family, optimized for applications that demand high logic density, abundant DSP, and low dynamic power. The 'SL' (Stratix III Low-power) family extends the Stratix III generation with programmable power technology that reduces static consumption while preserving performance.
Key features of the EP3SL70F484I4G include 296 user I/Os that support multiple I/O standards (LVDS, LVTTL, LVCMOS, HSTL, SSTL), 2.57 Mbit of embedded SRAM organized as M9K/M144K blocks, 48 DSP blocks for fixed- and floating-point arithmetic, and 8 PLLs with fractional-N support. The 484-ball FC-FBGA package is a wire-bond-free flip-chip BGA that improves signal integrity and thermal dissipation, making it well suited for high-speed parallel buses and serializer/deserializer (SerDes) lanes.
The 65 nm CMOS process and Stratix III architecture deliver an excellent logic-to-power ratio for compute-intensive workloads. Programmable Power Technology enables unused logic and routing to be powered down automatically, while dedicated hard IP blocks (memory, DSP, PLLs, transceivers on higher-density members) accelerate common functions. The result is a flexible platform for ASIC prototyping, high-throughput data acquisition, and real-time signal processing.
Typical applications for this part include high-performance digital signal processing (radar, beamforming, software-defined radio), high-speed video and image processing pipelines, ASIC prototyping and emulation, industrial test and measurement equipment, and high-speed data-acquisition front ends. The 484-ball FC-FBGA package and industrial-grade temperature range (-40C to +100C) also suit telecom and aerospace ground systems.
When designing with the EP3SL70F484I4G, ensure a multi-layer PCB with continuous power and ground planes is used to maintain signal integrity for the LVDS pairs and high-speed clocks. Decouple each core and I/O bank with a combination of bulk and high-frequency ceramic capacitors placed as close to the balls as physically possible, and follow Altera's pin-out and power-sequencing guidelines in the device handbook to avoid in-rush latch-up at power-up.
This page synthesizes distributor pricing, drop-in package-compatible alternatives, and practical design notes that complement (but do not replace) the official Altera/Intel Stratix III device handbook.
드롭인 대체품: EP3SL70F484I4G — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP3SL70F484I4G (동일 폼 팩터 및 풋프린트) — 차이점: Package, Speed Grade, Family, Operating Temperature, Process Technology.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP3SL70F484I4
✅ 드롭인✓ 재고 있음
$925.1 / 개
데이터시트 보기 →EP3SL70F484I4N
✅ 드롭인✓ 재고 있음
$855 / 개
데이터시트 보기 →EP3SL70F484I3G
✅ 드롭인✓ 재고 있음
$305 / 개
데이터시트 보기 →EP3SL70F484I3
✅ 드롭인✓ 재고 있음
$1013.66 / 개
데이터시트 보기 →EP3SL70F484C4G
✅ 드롭인✓ 재고 있음
$1485 / 개
데이터시트 보기 →EP3SL70F484C4N
✅ 드롭인✓ 재고 있음
$580 / 개
데이터시트 보기 →EP3SL70F484I4G 최대 정격 & 전기적 특성
| Series | Stratix® III L |
| Number of Logic Elements (LE) | 67,500 |
| Adaptive Logic Modules (ALM) | 27,000 ALM |
| Embedded Memory | 2.57 Mbit |
| Number of I/O | 296 |
| Number of CLB / LAB | 2,700 LAB-equivalent |
| Supply Voltage (Core) | 1.1 V |
| Transceivers | None on this device variant |
| Process Technology | 65 nm CMOS |
| 패키지 | 484-ball FC-FBGA |
| 실장 유형 | Surface Mount |
| 동작 온도 | -40C to +100C (Industrial) |
| 최대 클록 주파수 | 450 MHz |
| RoHS 상태 | Compliant |
EP3SL70F484I4G 484-ball fc-fbga 핀 구성 가이드
EP3SL70F484I4G(484-ball fc-fbga 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP3SL70F484I4G.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP3SL70F484I4G 적합 용도: 6 애플리케이션s: High-Performance DSP / Software-Defined Radio, ASIC Prototyping and Emulation, High-Speed Video and Image Processing, Industrial Test and Measurement, Telecom Baseband and Fronthaul, Aerospace Ground Systems and Defense.
High-Performance DSP / Software-Defined Radio
The EP3SL70F484I4G's 67,500 logic elements, 27,000 adaptive logic modules, and dedicated DSP blocks deliver the arithmetic throughput required for software-defined radio (SDR), radar, and beamforming front ends. With 296 user I/Os and PLL-based clock conditioning, it can simultaneously capture wide-bandwidth ADC data, run FFT and channelisation engines, and drive LVDS-to-ASIC links. Compared with a discrete DSP-plus-FPGA split, the integrated Stratix III L device lowers PCB complexity, latency between samples, and BOM cost. The 1.1 V core, programmable power technology, and 65 nm CMOS process reduce dynamic power versus older 90 nm FPGAs, which is critical when the device is fully utilised in multi-antenna MIMO or wideband EW systems.
추천
ASIC Prototyping and Emulation
Engineers prototyping multi-million-gate ASIC designs rely on Stratix III L FPGAs because of their high LE density, abundant embedded SRAM (2.57 Mbit on EP3SL70F484I4G), and rich I/O count for split-board prototyping. The 484-ball FC-FBGA provides 296 user I/Os, sufficient for bridging modern ASIC pin counts across multiple FPGAs using TDM and SerDes. Quartus II synthesis supports incremental compile, allowing the same EP3SL70F484I4G to be reused across multiple prototype revisions. Compared with ASIC emulation boxes built from older FPGAs, this part offers a balanced power/performance envelope at lower cost per LE.
추천
High-Speed Video and Image Processing
The EP3SL70F484I4G supports multi-channel LVDS and DDR-style memory interfaces required by modern video and image processing pipelines. With 67,500 LE and 27,000 ALM, the device can simultaneously run input capture (Camera Link / CoaXPress front ends), real-time image enhancement, and output formatting at 1080p60 or higher. The 2.57 Mbit of embedded SRAM is sufficient for line buffering in pipelined video engines, and the 8 PLLs allow independent clock domains for sensor, memory, and display. Compared with mid-range Cyclone FPGAs, the EP3SL70F484I4G delivers roughly twice the DSP and memory bandwidth, reducing the need for external frame buffers.
추천
Industrial Test and Measurement
Industrial ATE (automatic test equipment) and laboratory instruments use high-density FPGAs like the EP3SL70F484I4G to control backplanes, perform protocol translation, and run on-board DSP for sensor conditioning. Its industrial temperature grade (-40C to +100C) and 484-ball FC-FBGA package are well matched to 6U/3U PXI/PXIe cards. The 296 user I/O can drive multiple instrument buses (GPIB, LXI, parallel analog), and the 2.57 Mbit of embedded SRAM enables deep capture buffers for oscilloscopes and logic analyzers. Compared with discrete CPLD-plus-DSP designs, this part reduces board area and BOM while improving design flexibility.
추천
Telecom Baseband and Fronthaul
Telecom baseband cards and fronthaul CPRI bridges use Stratix III L FPGAs to combine DSP for channel cards with high-speed serial interface logic. The EP3SL70F484I4G provides 67,500 LE for Turbo/Convolutional decoding, while 296 I/Os allow parallel bus interfacing to ASICs and DSP clusters. The 1.1 V core and programmable power technology help meet strict telecom power budgets per slot, and the industrial temperature grade suits indoor/outdoor base station enclosures. The 65 nm CMOS process is mature and supported by long-life programs, an important consideration for carrier-class equipment with 10+ year deployment cycles.
추천
Aerospace Ground Systems and Defense
Defense and aerospace ground systems - flight simulators, mission computers, and signal-intelligence receivers - require industrial-temperature FPGAs with verified long-term support. The EP3SL70F484I4G's industrial-grade -40C to +100C range and RoHS-compliant 484-ball FC-FBGA package are well matched to ruggedised chassis and VME/VPX backplanes. The 67,500 LE/27,000 ALM envelope handles multi-channel DSP for radar warning, EW, and electronic surveillance. Because the Stratix III family is mature and well-documented, programs with long qualification cycles can rely on stable silicon and a stable Quartus II toolchain. Compared with newer Agilex devices, the EP3SL70F484I4G offers better long-term cost predictability on legacy programs.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP3SL70F484I4G — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP3SL70F484I4 | EP3SL70F484I4N | EP3SL70F484I3G | EP3SL70F484C4G |
|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel |
| Package | 484-ball FC-FBGA | 484-ball FC-FBGA (same) | 484-ball FC-FBGA (same) | 484-ball FC-FBGA (same) | 484-ball FC-FBGA (same) |
| Number of Logic Elements | 67,500 LE | 67,500 LE | 67,500 LE | 67,500 LE | 67,500 LE |
| Adaptive Logic Modules (ALM) | 27,000 ALM | 27,000 ALM | 27,000 ALM | 27,000 ALM | 27,000 ALM |
| Embedded Memory | 2.57 Mbit | 2.57 Mbit | 2.57 Mbit | 2.57 Mbit | 2.57 Mbit |
| Number of User I/O | 296 I/O | 296 I/O | 296 I/O | 296 I/O | 296 I/O |
| Speed Grade | -4 (I4) | -4 (I4) | -4 (I4) | -3 (I3, slower) | -4 (C4) |
| Temperature Grade | -40C to +100C (Industrial) | -40C to +100C (Industrial) | -40C to +100C (Industrial) | -40C to +100C (Industrial) | 0C to +85C (Commercial) |
| Core Voltage | 1.1 V | 1.1 V | 1.1 V | 1.1 V | 1.1 V |
주요 차별점
- Stratix III L low-power family with Programmable Power Technology (vs EP3SL50F484I4G)
- Industrial temperature grade -40C to +100C (vs EP3SL70F484C4G)
- -4 fastest speed grade (vs EP3SL70F484I3G)
설계 노트
The 484-ball FC-FBGA package requires a 4- to 6-layer PCB with continuous power and ground planes. Use microvia-in-pad or via-on-pad technology (1.0 mm ball pitch) to escape the dense ball grid. Route all differential pairs (LVDS) with 100 ohm controlled impedance and length-match within the tolerance specified in the Stratix III device handbook. Place at least one 0.1 uF and one 10 uF ceramic decoupling capacitor per VCC/VCCIO/GVCC pin group, with the smallest values placed as close to the balls as physically possible.
Estimated: the EP3SL70F484I4G core can draw several amps under full DSP and logic utilisation. A switching regulator with sub-1% accuracy, followed by an LDO post-regulator near the device, is recommended to hold the 1.1 V rail within 30 mV of nominal. Follow the Stratix III power-up sequence (VCCINT then VCCPD, then VCCIO) to avoid in-rush latch-up. Use power-good (PGOOD) signals from each rail to gate downstream supplies.
Estimated: at full logic utilisation the Stratix III L EP3SL70 range typically dissipates 4-7 W, depending on toggle rate and junction temperature. The 484-ball FC-FBGA's exposed die-side thermal pad must be soldered to a continuous copper plane to keep theta_JA within datasheet limits. Consider a thermal relief pad with at least 200 thermal vias under the BGA, and avoid running the device continuously above +85C junction for extended periods.
Do not hot-swap or restream EP3SL70F484I4G devices without following the JTAG-driven configuration procedure in the Stratix III handbook. Always assert nCONFIG and nSTATUS correctly during power-up. For multi-FPGA prototyping, ensure MSEL pins are strapped to the correct mode (AS/PS/FPP/JTAG) before applying power. Never connect unused I/Os to noisy signals - leave them in a defined input-tristate state with weak pull-up.
규정 준수 정보
RoHS and lead-free per Altera/Intel product packaging marking. AEC-Q100 not applicable (FPGA IC). Halogen-free status not explicitly stated in the verified distributor snippets and is marked unknown.