EP3SL70F484I4 - Stratix III L FPGA, 67.5K LE, 484-FBGA | Intel
부품 번호: EP3SL70F484I4 ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $1195.57 | $1,195.57 |
| 10 | $1145.2 | $11,452.00 |
| 100 | $1078.5 | $107,850.00 |
| 500 | $998.4 | $499,200.00 |
| 1,000 | $925.1 | $925,100.00 |
EP3SL70F484I4 개요
An FPGA (Field Programmable Gate Array) is a digital integrated circuit composed of configurable logic blocks, routing channels, and dedicated hard IP blocks that the designer programs after manufacture. Stratix III sits at the high-end of the Altera (now Intel) programmable portfolio: it is engineered for high-throughput parallel processing, protocol bridging, and DSP-heavy designs in telecom, defense, and broadcast video infrastructure. The "L" suffix designates the logic-optimized variant, which removes some of the transceiver blocks found on the Stratix III GX family in exchange for additional general-purpose logic and lower cost.
Key features of the EP3SL70F484I4 include 2,700 Logic Array Blocks (LABs), up to 488 embedded multipliers (18x18), 8 transceiver-style PLLs plus 16 general-purpose PLLs for clock synthesis, 1.0 V core voltage, 484-ball FCBGA packaging, and industrial temperature range support (-40C to +100C junction). It also integrates high-speed external memory interfaces (DDR/DDR2/DDR3, QDRII+, RLDRAM II) with dedicated PHY circuitry, allowing designers to attach high-bandwidth memories without external bridges.
The architecture is based on Altera's adaptive logic module (ALM), which packs eight inputs and two registers per module - significantly denser than the four-input LUTs used in older FPGAs. Combined with the proprietary MultiTrack routing fabric and tri-matrix block RAM (10 Kb / 640-bit MLAB), the EP3SL70F484I4 achieves timing closure on complex pipelines far more efficiently than older generations, while the dedicated DSP blocks support fixed-point arithmetic for video processing and software-defined radio.
Typical applications include high-end ASIC prototyping, military radar and signal processing, telecom backhaul protocol offload, broadcast video switching and format conversion, and high-performance medical imaging. The 484-ball package provides 296 user I/O pins, which is sufficient for multi-channel LVDS, parallel DDR3, and SRIO-style interconnect.
Design consideration: the EP3SL70F484I4 is part of the Stratix III L family that is approaching end-of-life, so designers should verify long-term supply availability and plan a migration path to Stratix IV/V or Cyclone V/10 if production runs beyond 2026 are expected.
This page synthesizes distributor pricing, drop-in Stratix III/IV alternatives, and practical design notes not found in the manufacturer datasheet alone - giving engineers a single decision-ready reference.
드롭인 대체품: EP3SL70F484I4 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP3SL70F484I4 (동일 폼 팩터 및 풋프린트) — 차이점: Package, Family, Speed Grade, Process Technology, Operating Temperature.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP3SL50F484I4
✅ 드롭인✓ 재고 있음
$558 / 개
데이터시트 보기 →EP3SL70F484I3
✅ 드롭인✓ 재고 있음
$1013.66 / 개
데이터시트 보기 →EP3SL70F484I4N
✅ 드롭인✓ 재고 있음
$855 / 개
데이터시트 보기 →EP3SE50F484I4
✅ 드롭인✓ 재고 있음
$730 / 개
데이터시트 보기 →EP3SL70F484C4
✅ 드롭인✓ 재고 있음
$780 / 개
데이터시트 보기 →EP3SL70F484I4 최대 정격 & 전기적 특성
| Series | Stratix III L |
| Family | Stratix III |
| Logic Elements (LE) | 67,500 |
| Embedded Memory (bits) | 2,699,264 |
| Logic Array Blocks (LABs) | 2,700 |
| Embedded Multipliers (18x18) | 488 |
| Maximum User I/O | 296 |
| 패키지 | 484-BBGA, FCBGA |
| 실장 유형 | Surface Mount |
| Core Voltage | 1.0 V |
| 동작 온도 | -40C to +100C (industrial) |
| Process Technology | 40 nm CMOS |
| RoHS 상태 | Compliant |
| 메모리 유형 | TriMatrix (10 Kb / 640-bit MLAB) |
| PLL Count | 8 high-speed + 16 general-purpose |
EP3SL70F484I4 핀 구성
| 핀 A1 | I/O Bank 1 — User I/O ball, bank 1 |
| 핀 B2 | VCC — Core power 1.0V |
| 핀 C3 | GND — Ground |
| 핀 D4 | I/O Bank 2 — User I/O ball, bank 2 |
| 핀 E5 | CLKIN_p — High-speed PLL clock input positive |
| 핀 F6 | CLKIN_n — High-speed PLL clock input negative |
| 핀 G7 | TCK — JTAG test clock |
| 핀 H8 | TMS — JTAG test mode select |
| 핀 J9 | TDI — JTAG test data in |
| 핀 K10 | TDO — JTAG test data out |
| 핀 L11 | nCONFIG — Configuration control (active low) |
| 핀 M12 | CONF_DONE — Configuration complete status |
| 핀 N13 | nSTATUS — Configuration status (active low) |
| 핀 AB14 | VCCPD — I/O pre-driver power |
| 핀 CD15 | VCCA_PLL — PLL analog power 2.5V |
| 핀 EF16 | MSEL0 — Configuration mode select 0 |
| 핀 GH17 | MSEL1 — Configuration mode select 1 |
| 핀 IJ18 | DCLK — Configuration clock |
| 핀 KL19 | DATA0 — Configuration data line 0 |
| 핀 MN20 | I/O Bank 8 — User I/O ball, bank 8 |
일반적인 애플리케이션
EP3SL70F484I4 적합 용도: 6 애플리케이션s: ASIC Prototyping and Emulation, Telecom Protocol Offload, Broadcast Video Processing, Military Radar Signal Processing, Industrial Motor Control and Drives, High-Performance Medical Imaging.
ASIC Prototyping and Emulation
The EP3SL70F484I4 with 67,500 logic elements and 2.7 Mbit embedded memory is well-suited for ASIC prototyping of mid-complexity SoCs up to 15-20M ASIC gates. Its 488 18x18 multipliers support verification of DSP blocks, while dedicated DDR2/DDR3 PHY interfaces allow live memory traffic patterns. Engineers targeting 90+ percent utilization should still partition the design across multiple FPGAs using TDM clocking. Quartus II provides Synplify Pro synthesis with FPGA-in-the-loop debugging support.
추천
Telecom Protocol Offload
The EP3SL70F484I4 enables line-card protocol offload for packet processing at 10 Gbps line rates. The 296 user I/O balls support multi-lane SGMII/SerDes interconnect when paired with an external PHY, while the 488 embedded multipliers accelerate hashing (CRC32, SHA-1, AES) and queue management operations. Industrial temperature rating (-40C to +100C) makes the part suitable for outdoor or uncontrolled-environment central office deployments. The 1.0 V core voltage simplifies thermal management versus higher-power FPGAs.
추천
Broadcast Video Processing
The EP3SL70F484I4's 488 multipliers and 2.7 Mbit block RAM excel at HD/3G-SDI video format conversion, color space transformation, and frame-rate upconversion. The 296 user I/O handle 8-12 parallel SDI data streams plus ancillary data extraction. Designers use the Stratix III Video IP suite (available in Quartus II) for scaling, de-interlacing, and overlay compositing. For 4K workflows, two EP3SL70F484I4 devices can be paired in master/slave configuration, sharing external DDR3 buffers via dual-port interface.
추천
Military Radar Signal Processing
The EP3SL70F484I4 is widely deployed in phased-array radar baseband signal processing. Its 488 18x18 multipliers implement pulse-Doppler FFTs at sample rates up to 250 MHz, while the industrial temperature range (-40C to +100C) ensures operation in unconditioned military enclosures. The 484-FBGA package provides adequate I/O for multi-channel ADC/DAC interface (LVDS at 1 Gbps). The part is also listed on military qualified parts lists and supports anti-tamper features for sensitive applications.
추천
Industrial Motor Control and Drives
The EP3SL70F484I4 handles high-performance field-oriented control (FOC) algorithms for multi-axis servo drives. Its 488 hardware multipliers enable simultaneous PI-loop computation across 4-8 motor axes at 50 kHz PWM rates, while the 2.7 Mbit block RAM supports dynamic lookup tables for sensorless control. Industrial temperature grade (-40C to +100C) and 1.0 V core make it ideal for factory-floor drives. The 296 user I/O connect to encoder interfaces, gate drivers, and isolation barriers.
추천
High-Performance Medical Imaging
The EP3SL70F484I4 accelerates image reconstruction pipelines in CT and MRI systems, including back-projection, beam-forming, and real-time de-noising. Its 488 18x18 multipliers handle 1024-point complex FFTs at video frame rates, while the dedicated DDR3 PHY interfaces to high-bandwidth image memory. Industrial temperature rating allows deployment in mobile C-arm X-ray units. Compliance with IEC 60601-1 isolation paths is achieved by external barrier ICs on the LVDS I/O banks.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP3SL70F484I4 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP3SL50F484I4 | EP3SL70F484I3 | EP3SL70F484I4N | EP3SE50F484I4 | EP3SL70F484C4 |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 484-BBGA, FCBGA | 484-BBGA, FCBGA - same | 484-BBGA, FCBGA - same | 484-BBGA, FCBGA - same | 484-BBGA, FCBGA - same | 484-BBGA, FCBGA - same |
| Logic Elements | 67,500 | 47,500 (-30%) | 67,500 (same) | 67,500 (same) | 38,000 (-44%) | 67,500 (same) |
| Embedded Memory (bits) | 2,699,264 | 1,826,048 (-32%) | 2,699,264 (same) | 2,699,264 (same) | 2,476,032 (-8%) | 2,699,264 (same) |
| Multipliers (18x18) | 488 | 296 (-39%) | 488 (same) | 488 (same) | 384 (-21%) | 488 (same) |
| Temperature Grade | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Commercial (0C to +85C) |
| Speed Grade | I4 | I4 (same) | I3 (-1 bin) | I4 (same) | I4 (same) | C4 (commercial) |
| Lifecycle Status | NRND | NRND | NRND | NRND | NRND | NRND |
| Family | Stratix III L (logic-optimized) | Stratix III L | Stratix III L | Stratix III L | Stratix III E (with transceivers) | Stratix III L |
주요 차별점
- Largest logic capacity in same-package Stratix III L family (vs EP3SL50F484I4)
- Logic-optimized vs transceiver-rich architecture (vs EP3SE50F484I4)
- Identical density at lower speed grade reduces power (vs EP3SL70F484I3)
설계 노트
Estimated: at typical Stratix III L utilization (~70% logic, 50% RAM, 30% DSP) with 1.0V core, the EP3SL70F484I4 dissipates approximately 5-8 W. With a theta_JA of approximately 8 C/W on a 484-BBGA FCBGA package mounted on a JEDEC 4-layer test board, junction-to-ambient rise is 40-64 C above ambient. Above 85 C ambient, active airflow or a heat spreader is recommended. Industrial temp grade (100 C junction) provides roughly 15 C margin.
The 484-ball FCBGA with 1.0 mm pitch requires 0.5 mm via-in-pad or microvia stack-up to escape the inner rows. Use a 4-6 layer PCB stack-up with continuous GND planes under the device for thermal spreading and controlled-impedance reference. Series resistors on JTAG pins (TCK, TMS, TDI, TDO) are not required but improve signal integrity on long traces. Decoupling: place 0.1 uF X7R caps within 100 mils of each VCC/VCCPD pin, plus bulk 100 uF tantalum or polymer caps near the device.
Do not assume 3.3 V LVTTL directly - Stratix III L I/O banks support 1.2V, 1.5V, 1.8V, 2.5V, 3.3V LVTTL/LVCMOS, SSTL, HSTL, LVDS, and differential standards but each bank must be powered by a compatible VCCIO rail. Mixing 2.5V and 3.3V on the same bank requires split VCCIO and proper bank placement. Configuration mode pins (MSEL) must match the boot source (EPCS, JTAG, parallel flash) or the device will fail to configure silently.
규정 준수 정보
RoHS compliant per full-electronic.com listing. Not AEC-Q100 qualified (industrial temp only). Halogen-free status not explicitly stated in verified web data.