EP1S20F484C7 - Stratix FPGA 18460 LEs 484-FBGA | Intel
부품 번호: EP1S20F484C7 ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $268.5 | $2,685.00 |
| 100 | $245 | $24,500.00 |
| 500 | $218.75 | $109,375.00 |
| 1,000 | $195 | $195,000.00 |
EP1S20F484C7 개요
An FPGA (Field-Programmable Gate Array) is a programmable logic device that combines configurable logic blocks, programmable interconnect, and dedicated hard IP such as block RAM, DSP blocks, and PLLs/clock trees. FPGAs belong to the broader class of programmable logic devices, sit alongside CPLDs, ASICs, and ASSPs in the digital-semiconductor hierarchy, and are typically deployed in the prototyping, low-volume production, or system-on-chip glue-logic layer of an embedded design. The Stratix family is the original high-performance Altera (now Intel) FPGA line and was later succeeded by Stratix II, III, IV, V, and 10 families.
Key features include 1,669,248 bits of embedded RAM distributed across multiple TriMatrix memory blocks, high-speed DSP blocks for multiply-accumulate operations, embedded multiplier support, and support for external memory interfaces including DDR SDRAM, FCRAM, QDR SRAM, and SDR SDRAM. The device also integrates high-speed transceiver-ready I/O structures on selected pins, multiple PLLs for clock management, and a JTAG/IEEE 1149.1 boundary-scan test interface. Configuration is supported via passive serial (PS), passive parallel synchronous (PPS), passive parallel asynchronous (PPA), and JTAG modes, with optional in-system programmability.
From an architectural perspective, the EP1S20F484C7 is fabricated on a 1.5 V, 130 nm process and uses Altera's Logic Element (LE) structure, where each LE contains a 4-input look-up table, a programmable register, and dedicated carry-chain logic. LABs group 10 LEs together with local interconnect, and DirectDrive and MultiTrack global routing minimize interconnect delay. The 484-pin FC-FBGA package uses controlled-collapse chip connection (C4) bumps and flip-chip attach, giving lower parasitic inductance than wire-bond alternatives.
Typical applications include telecommunications line cards, military and aerospace signal processing, industrial control and machine vision, medical imaging pipelines, test and measurement instrumentation, and high-speed bus bridges. Designers should consult AN 176 (Stratix design guidelines) and the Stratix Device Handbook for PLL configuration, memory interface timing, and thermal management. This page consolidates distributor pricing, alternative drop-in candidates, and practical design notes beyond the manufacturer datasheet.
드롭인 대체품: EP1S20F484C7 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP1S20F484C7 (동일 폼 팩터 및 풋프린트) — 차이점: Package, Operating Temperature, Configuration Modes, Family, Speed Grade.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP1S20F484C6N
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$440 / 개
데이터시트 보기 →EP1S20F484C5N
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$118 / 개
데이터시트 보기 →EP1S20F484C7N
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$198 / 개
데이터시트 보기 →EP1S20F484C6N
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$440 / 개
데이터시트 보기 →EP1S20F484C5N
✅ 드롭인✓ 재고 있음
$118 / 개
데이터시트 보기 →EP1S20F484I7
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
EP1S20F484C7 최대 정격 & 전기적 특성
| Family | Stratix |
| Series | EP1S20 |
| Process Technology | 130 nm CMOS |
| Core Voltage | 1.5 V |
| Logic Elements | 18,460 |
| Logic Array Blocks (LABs) | 1,846 |
| Total RAM Bits | 1,669,248 |
| Maximum I/O Pins | 361 |
| 패키지 | 484-ball FC-FBGA |
| Package Size | 23 mm x 23 mm |
| Ball Pitch | 1.0 mm |
| Speed Grade | C7 |
| Maximum Internal Frequency | 420.17 MHz |
| 동작 온도 범위 | 0 C to +85 C (Commercial) |
| Configuration Modes | PS, PPS, PPA, JTAG |
| 실장 유형 | Surface Mount |
| Programming Voltage | 1.5 V (in-system via JTAG) |
EP1S20F484C7 23 mm x 23 mm 핀 구성 가이드
EP1S20F484C7(23 mm x 23 mm 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP1S20F484C7.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP1S20F484C7 적합 용도: 6 애플리케이션s: Telecommunications Line Cards, DSP and Signal Processing Pipelines, Industrial Control and Machine Vision, Test and Measurement Instrumentation, Military and Aerospace Signal Processing, Legacy Bus Bridge and Protocol Converter.
Telecommunications Line Cards
The EP1S20F484C7's 18,460 logic elements, integrated TriMatrix memory blocks, and 361 I/O pins make it well suited for telecom line card designs including protocol bridging, TDM bus aggregation, and high-speed serializer/deserializer glue logic. With C7 speed grade delivering up to 420 MHz internal Fmax, the device handles STS-1/STM-0 channel mapping, ATM cell processing, and HDLC framing without external ASICs. The 1.5 V core and rich PLL count simplify clock tree synthesis for backplane-rate switching. Compared to a discrete ASIC+companion-FPGA approach, a single EP1S20F484C7 reduces BOM, board area, and qualification time. Design consideration: route all 1.5 V core supplies with 4-layer PCB stack-up to meet Stratix power-integrity guidelines.
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DSP and Signal Processing Pipelines
Stratix embedded DSP blocks provide dedicated multiply-accumulate units that map cleanly to FIR filters, FFT butterflies, and complex-mixer stages. The EP1S20F484C7 offers enough DSP bandwidth for narrowband communications, software-defined radio baseband, and radar pulse compression at sample rates up to ~100 MHz. Its 1.5 V core keeps dynamic power manageable even at high toggle rates, and the abundant TriMatrix RAM (1.6 Mbits) holds FFT window coefficients and data buffers locally. Compared with a DSP processor, the parallel architecture delivers deterministic latency and 10-50x higher throughput per MHz. Tip: use Quartus II's DSP Builder to map floating-point algorithms to fixed-point DSP blocks and preserve bit-accurate simulation.
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Industrial Control and Machine Vision
Machine vision pre-processors need pipelined pixel-rate processing for filtering, thresholding, and feature extraction. The EP1S20F484C7's 361 user I/O accept multiple parallel camera data buses (LVCMOS/LVTTL), while its 1.5 V core and abundant LABs implement line buffers, convolution kernels, and centroid calculators in hardware. The commercial 0-85 C temperature range covers factory-floor enclosures, and the FC-FBGA 484 package supports rugged PCB construction. Compared with a microcontroller+DSP split, the unified FPGA design cuts latency by an order of magnitude and removes external bus bottlenecks. Design tip: leverage SelectI/O standards to bridge legacy 5 V sensors without external level shifters.
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Test and Measurement Instrumentation
Arbitrary waveform generators, logic analyzers, and protocol analyzers use FPGAs to implement deep pattern memory, hardware sequencing, and trigger engines. The EP1S20F484C7's 1.6 Mbit embedded RAM holds thousands of waveform samples, while the C7 speed grade drives pattern generation up to 420 MHz. The 484-ball FC-FBGA also supports high pin-count LVDS probes for parallel bus capture. Compared with discrete TTL/CMOS logic, a Stratix-based design reduces PCB area by 5-10x and enables firmware-defined instrument personalities. Tip: use the Stratix LVDS channels to build multi-channel timing analyzers with sub-nanosecond resolution.
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Military and Aerospace Signal Processing
Defense and avionics platforms require wideband signal processing, encryption acceleration, and secure I/O for mission-critical data. The EP1S20F484C7 delivers 18,460 logic elements and 1.6 Mbit RAM in a hermetic-grade-compatible FC-FBGA, supporting MIL-STD-1553, ARINC 429, and custom RF backplane interfaces. Designers can implement multi-channel FFT, convolution, and FEC codecs in parallel without processor intervention. Compared with radiation-hardened ASICs, the EP1S20F484C7 cuts NRE cost and shortens design cycles, though for new designs Intel recommends Stratix IV or V for hardened variants. Note: industrial or military temperature grade (-40 to +100 C or wider) is required for aerospace deployment.
추천
Legacy Bus Bridge and Protocol Converter
Many embedded systems still integrate legacy buses such as PCI, VME, ISA, PMC, and proprietary backplanes, and the EP1S20F484C7 is a flexible bridge between mismatched protocols. With 361 I/O pins and TriMatrix RAM, it can implement bus arbitration, DMA, and protocol translation between PCI 32-bit/33 MHz and VME 2eSST, or between parallel RapidIO and serial Ethernet. The C7 speed grade delivers the throughput required for line-rate bridging. Compared with discrete bridge ASICs that are themselves obsolete, the EP1S20F484C7 is a long-term maintainable solution. Design tip: use SOPC Builder to integrate Nios II soft-core when CPU supervision is required.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP1S20F484C7 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP1S20F484C6N | EP1S20F484C5N | EP1S20F484C7N | EP1S20F484C6 | EP1S20F484I7 |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 484-ball FC-FBGA (23x23 mm) | 484-ball FC-FBGA - same | 484-ball FC-FBGA - same | 484-ball FC-FBGA - same | 484-ball FC-FBGA - same | 484-ball FC-FBGA - same |
| Logic Elements | 18,460 | 18,460 | 18,460 | 18,460 | 18,460 | 18,460 |
| Speed Grade | C7 | C6 (faster) | C5 (fastest) | C7 (same) | C6 (faster) | I7 (industrial temp) |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Total RAM Bits | 1,669,248 | 1,669,248 | 1,669,248 | 1,669,248 | 1,669,248 | 1,669,248 |
| Maximum I/O Pins | 361 | 361 | 361 | 361 | 361 | 361 |
| Temperature Range | 0 C to +85 C (Commercial) | 0 C to +85 C | 0 C to +85 C | 0 C to +85 C | 0 C to +85 C | -40 C to +100 C (Industrial) |
| Lead-Free (N suffix) | No (no N suffix) | Yes (Pb-free) | Yes (Pb-free) | Yes (Pb-free) | No | No |
주요 차별점
- Slower C7 speed grade offers cost advantage (vs EP1S20F484C6N)
- Commercial temperature range fits consumer applications (vs EP1S20F484I7)
- Earlier-generation silicon validated by mature tool flow (vs Stratix IV EP4SGX230)
설계 노트
The EP1S20F484C7 requires a regulated 1.5 V core supply with sub-3% tolerance and a separate 3.3 V VCCIO bank supply for I/O. Decoupling must include 100 nF X7R ceramic caps within 100 mil of every VCC pin, plus bulk 33-100 uF tantalum or polymer caps per Stratix PDN guidelines. The FC-FBGA package demands a 4-layer PCB stack-up with a continuous power plane under the device. Inrush current during configuration can exceed 1 A; size the regulator with 1.5x margin.
Route all 361 user I/O signals on inner or outer microstrip layers with controlled impedance matched to the SelectI/O standard selected (3.3 V LVTTL ~50 ohm, LVDS 100 ohm differential). Escape the 484-ball FC-FBGA using 0.5 mm wide traces on a 1.0 mm BGA pitch; breakout routing typically requires at least 4 signal layers plus a power/ground sandwich. Maintain reference plane continuity under all high-speed signals to avoid return-path discontinuities.
Estimated: at 100% utilization with 50% toggle rate at 200 MHz, the EP1S20F484C7 dissipates approximately 4-6 W; with FC-FBGA theta_JA around 15-20 C/W for a 4-layer JEDEC test board, junction temperature may rise 60-120 C above ambient. For commercial 85 C operation, enforce airflow of at least 200 LFM or attach a small heatsink. Industrial-grade I7 variants offer wider thermal envelope but share the same silicon, so thermal design is identical.
Do not assume the EP1S20F484C7 is in-system reprogrammable via JTAG without first configuring the MSEL pins to the correct mode (PS, PPS, PPA, or JTAG). The Quartus II programmer defaults to JTAG, but production boards often need AS or PS configuration from an EPC2/EPC4/EPC8/EPC16 companion PROM. Also avoid mixing 1.5 V and 1.8 V VCCIO on the same bank - this causes I/O contention and is a common debug issue.
규정 준수 정보
RoHS and lead-free status depend on date code and packaging variant; parts with the N suffix are Pb-free per Intel packaging specifications. The device itself is not AEC-Q100 qualified (automotive grade requires a separate qualification program).