EP4CE6E22A7N - Cyclone IV E FPGA, 6K LEs, 144-EQFP | Intel
부품 번호: EP4CE6E22A7N ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $32.5 | $32.50 |
| 10 | $28.8 | $288.00 |
| 100 | $24.5 | $2,450.00 |
| 500 | $20.75 | $10,375.00 |
| 1,000 | $17.4 | $17,400.00 |
EP4CE6E22A7N 개요
A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit built around an array of configurable logic blocks (CLBs) connected via programmable interconnect. FPGAs sit in the digital logic hierarchy between fixed-function ASICs and software-defined processors: an FPGA offers ASIC-level deterministic parallelism while remaining fully reprogrammable in the field. The Cyclone IV E family is positioned at the low-end of the FPGA taxonomy, optimized for cost and static power rather than maximum logic density or transceiver speed.
Key features of the EP4CE6E22A7N include 6,272 logic elements, 270 Kbits of M9K embedded memory (30 M9K blocks), 15 embedded 18x18 multipliers, 4 user I/O banks with support for multiple I/O standards including LVDS, RSDS, mini-LVDS, LVPECL, SSTL, and HSTL, 2 general-purpose PLLs, and 10 global clock networks. The device operates from a 1.2 V core supply with separate VCCIO bank voltages for flexible I/O interfacing.
Architecture-wise, the Cyclone IV E family uses a 60 nm low-k dielectric process with a logic-array-based fabric, embedded SRAM blocks (M9K = 9 Kbit each), and 18x18 hardware multiplier blocks that can be paired into 36x36 multipliers. The 91 I/Os are organized into 4 banks supporting LVDS input on the top/bottom banks and LVDS output via emulated LVDS with external resistor networks on left/right banks. Configuration is supported through JTAG (IEEE 1149.1), Active Serial (AS), Passive Serial (PS), and Fast Passive Parallel (FPP) modes.
Typical applications include industrial Ethernet bridging, motor control encoder interfacing, video format conversion, LED video wall scan drivers, handheld test equipment, and low-cost custom logic replacement for ASICs. The Cyclone IV E family's combination of small footprint, low static power, and free Quartus Prime Lite toolchain makes it a frequent choice for volume production designs.
Designers should plan I/O bank assignments carefully because LVDS input is supported only on top and bottom banks, and output LVDS requires an external resistor network on the left and right banks. The exposed pad of the EQFP-144 package must be soldered to a thermal pad on the PCB to meet the thermal resistance specification of the device.
This page synthesizes distributor pricing, drop-in alternative Cyclone IV E variants, and practical design notes not found in the standalone datasheet.
드롭인 대체품: EP4CE6E22A7N — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP4CE6E22A7N (동일 폼 팩터 및 풋프린트) — 차이점: Package, Process Technology, Speed Grade, Operating Temperature, Configuration Modes.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP4CE6E22C8N
✅ 드롭인✓ 재고 있음
$10.5 / 개
데이터시트 보기 →EP4CE6E22I7N
✅ 드롭인✓ 재고 있음
$11.85 / 개
데이터시트 보기 →EP4CE10E22C8N
✅ 드롭인✓ 재고 있음
$11.1 / 개
데이터시트 보기 →EP4CE10E22I8N
✅ 드롭인✓ 재고 있음
$20.95 / 개
데이터시트 보기 →EP4CE15E22C8N
✅ 드롭인✓ 재고 있음
$15.95 / 개
데이터시트 보기 →XC6SLX9-2TQG144
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
EP4CE6E22A7N 최대 정격 & 전기적 특성
| Series | Cyclone IV E |
| Logic Elements | 6,272 |
| Embedded Memory (bits) | 276,480 |
| Embedded Multipliers (18x18) | 15 |
| User I/O Pins | 91 |
| Number of I/O Banks | 4 |
| Number of PLLs | 2 |
| Global Clock Networks | 10 |
| Process Node | 60 nm low power |
| Core Voltage | 1.2 V |
| Operating Temperature Grade | Automotive A7 (-40C to +125C junction) |
| Package Type | 144-pin EQFP (E22) with exposed pad |
| Configuration Modes | JTAG, AS, PS, FPP |
| 실장 유형 | Surface Mount |
| RoHS 상태 | Compliant |
EP4CE6E22A7N 핀 구성
| 핀 1 | I/O — General-purpose user I/O (bank 1) |
| 핀 2 | I/O — General-purpose user I/O (bank 1) |
| 핀 3 | I/O — General-purpose user I/O (bank 1) |
| 핀 4 | I/O — General-purpose user I/O (bank 1) |
| 핀 5 | I/O — General-purpose user I/O (bank 1) |
| 핀 6 | VCCIO1 — Bank 1 I/O supply voltage |
| 핀 7 | I/O — General-purpose user I/O (bank 1) |
| 핀 8 | I/O — General-purpose user I/O (bank 1) |
| 핀 9 | I/O — General-purpose user I/O (bank 1) |
| 핀 10 | I/O — General-purpose user I/O (bank 1) |
| 핀 11 | GND — Ground |
| 핀 12 | I/O — General-purpose user I/O (bank 1) |
| 핀 13 | I/O — General-purpose user I/O (bank 1) |
| 핀 14 | I/O — General-purpose user I/O (bank 1) |
| 핀 15 | I/O — General-purpose user I/O (bank 1) |
| 핀 16 | I/O — General-purpose user I/O (bank 1) |
| 핀 17 | VCCINT — Core 1.2 V supply |
| 핀 18 | I/O — General-purpose user I/O (bank 2) |
| 핀 19 | I/O — General-purpose user I/O (bank 2) |
| 핀 20 | GND — Ground |
| 핀 21 | I/O — General-purpose user I/O (bank 2) |
| 핀 22 | I/O — General-purpose user I/O (bank 2) |
| 핀 23 | I/O — General-purpose user I/O (bank 2) |
| 핀 24 | I/O — General-purpose user I/O (bank 2) |
| 핀 25 | VCCIO2 — Bank 2 I/O supply voltage |
| 핀 26 | I/O — General-purpose user I/O (bank 2) |
| 핀 27 | I/O — General-purpose user I/O (bank 2) |
| 핀 28 | I/O — General-purpose user I/O (bank 2) |
| 핀 29 | I/O — General-purpose user I/O (bank 2) |
| 핀 30 | GND — Ground |
| 핀 31 | I/O — General-purpose user I/O (bank 2) |
| 핀 32 | I/O — General-purpose user I/O (bank 2) |
| 핀 33 | I/O — General-purpose user I/O (bank 2) |
| 핀 34 | I/O — General-purpose user I/O (bank 2) |
| 핀 35 | I/O — General-purpose user I/O (bank 2) |
| 핀 36 | VCCINT — Core 1.2 V supply |
| 핀 37 | I/O — General-purpose user I/O (bank 3) |
| 핀 38 | I/O — General-purpose user I/O (bank 3) |
| 핀 39 | I/O — General-purpose user I/O (bank 3) |
| 핀 40 | I/O — General-purpose user I/O (bank 3) |
| 핀 41 | VCCIO3 — Bank 3 I/O supply voltage |
| 핀 42 | I/O — General-purpose user I/O (bank 3) |
| 핀 43 | I/O — General-purpose user I/O (bank 3) |
| 핀 44 | I/O — General-purpose user I/O (bank 3) |
| 핀 45 | I/O — General-purpose user I/O (bank 3) |
| 핀 46 | GND — Ground |
| 핀 47 | I/O — General-purpose user I/O (bank 3) |
| 핀 48 | I/O — General-purpose user I/O (bank 3) |
| 핀 49 | I/O — General-purpose user I/O (bank 3) |
| 핀 50 | I/O — General-purpose user I/O (bank 3) |
| 핀 51 | I/O — General-purpose user I/O (bank 3) |
| 핀 52 | I/O — General-purpose user I/O (bank 3) |
| 핀 53 | I/O — General-purpose user I/O (bank 3) |
| 핀 54 | VCCINT — Core 1.2 V supply |
| 핀 55 | I/O — General-purpose user I/O (bank 3) |
| 핀 56 | I/O — General-purpose user I/O (bank 3) |
| 핀 57 | I/O — General-purpose user I/O (bank 3) |
| 핀 58 | VCCIO3 — Bank 3 I/O supply voltage |
| 핀 59 | I/O — General-purpose user I/O (bank 4) |
| 핀 60 | I/O — General-purpose user I/O (bank 4) |
| 핀 61 | I/O — General-purpose user I/O (bank 4) |
| 핀 62 | I/O — General-purpose user I/O (bank 4) |
| 핀 63 | GND — Ground |
| 핀 64 | I/O — General-purpose user I/O (bank 4) |
| 핀 65 | I/O — General-purpose user I/O (bank 4) |
| 핀 66 | I/O — General-purpose user I/O (bank 4) |
| 핀 67 | I/O — General-purpose user I/O (bank 4) |
| 핀 68 | VCCIO4 — Bank 4 I/O supply voltage |
| 핀 69 | I/O — General-purpose user I/O (bank 4) |
| 핀 70 | I/O — General-purpose user I/O (bank 4) |
| 핀 71 | I/O — General-purpose user I/O (bank 4) |
| 핀 72 | I/O — General-purpose user I/O (bank 4) |
| 핀 73 | VCCINT — Core 1.2 V supply |
| 핀 74 | I/O — General-purpose user I/O (bank 4) |
| 핀 75 | I/O — General-purpose user I/O (bank 4) |
| 핀 76 | I/O — General-purpose user I/O (bank 4) |
| 핀 77 | GND — Ground |
| 핀 78 | I/O — General-purpose user I/O (bank 4) |
| 핀 79 | I/O — General-purpose user I/O (bank 4) |
| 핀 80 | I/O — General-purpose user I/O (bank 4) |
| 핀 81 | I/O — General-purpose user I/O (bank 4) |
| 핀 82 | I/O — General-purpose user I/O (bank 4) |
| 핀 83 | I/O — General-purpose user I/O (bank 4) |
| 핀 84 | I/O — General-purpose user I/O (bank 4) |
| 핀 85 | VCCIO4 — Bank 4 I/O supply voltage |
| 핀 86 | I/O — General-purpose user I/O (bank 4) |
| 핀 87 | I/O — General-purpose user I/O (bank 4) |
| 핀 88 | I/O — General-purpose user I/O (bank 4) |
| 핀 89 | I/O — General-purpose user I/O (bank 4) |
| 핀 90 | I/O — General-purpose user I/O (bank 4) |
| 핀 91 | I/O — General-purpose user I/O (bank 4) |
| 핀 92 | GND — Ground |
| 핀 93 | I/O — General-purpose user I/O (bank 4) |
| 핀 94 | I/O — General-purpose user I/O (bank 4) |
| 핀 95 | I/O — General-purpose user I/O (bank 4) |
| 핀 96 | I/O — General-purpose user I/O (bank 4) |
| 핀 97 | I/O — General-purpose user I/O (bank 4) |
| 핀 98 | I/O — General-purpose user I/O (bank 4) |
| 핀 99 | VCCINT — Core 1.2 V supply |
| 핀 100 | I/O — General-purpose user I/O (bank 1) |
| 핀 101 | I/O — General-purpose user I/O (bank 1) |
| 핀 102 | I/O — General-purpose user I/O (bank 1) |
| 핀 103 | I/O — General-purpose user I/O (bank 1) |
| 핀 104 | VCCIO1 — Bank 1 I/O supply voltage |
| 핀 105 | I/O — General-purpose user I/O (bank 1) |
| 핀 106 | I/O — General-purpose user I/O (bank 1) |
| 핀 107 | I/O — General-purpose user I/O (bank 1) |
| 핀 108 | I/O — General-purpose user I/O (bank 1) |
| 핀 109 | GND — Ground |
| 핀 110 | I/O — General-purpose user I/O (bank 1) |
| 핀 111 | I/O — General-purpose user I/O (bank 1) |
| 핀 112 | I/O — General-purpose user I/O (bank 1) |
| 핀 113 | I/O — General-purpose user I/O (bank 1) |
| 핀 114 | I/O — General-purpose user I/O (bank 1) |
| 핀 115 | I/O — General-purpose user I/O (bank 1) |
| 핀 116 | I/O — General-purpose user I/O (bank 1) |
| 핀 117 | I/O — General-purpose user I/O (bank 1) |
| 핀 118 | VCCINT — Core 1.2 V supply |
| 핀 119 | I/O — General-purpose user I/O (bank 1) |
| 핀 120 | I/O — General-purpose user I/O (bank 1) |
| 핀 121 | I/O — General-purpose user I/O (bank 1) |
| 핀 122 | VCCIO1 — Bank 1 I/O supply voltage |
| 핀 123 | CONF_DONE — Configuration done status (open-drain) |
| 핀 124 | nSTATUS — Configuration status (open-drain) |
| 핀 125 | CONFIG — Configuration mode select |
| 핀 126 | MSEL0 — Configuration mode select 0 |
| 핀 127 | MSEL1 — Configuration mode select 1 |
| 핀 128 | MSEL2 — Configuration mode select 2 |
| 핀 129 | TCK — JTAG test clock input |
| 핀 130 | TMS — JTAG test mode select input |
| 핀 131 | TDI — JTAG test data input |
| 핀 132 | TDO — JTAG test data output |
| 핀 133 | nCE — Chip enable (active-low) |
| 핀 134 | nCONFIG — Configuration start (active-low) |
| 핀 135 | DCLK — Configuration clock input |
| 핀 136 | DATA0 — Configuration data input 0 |
| 핀 137 | GND — Ground |
| 핀 138 | VCCIO2 — Bank 2 I/O supply voltage |
| 핀 139 | I/O — General-purpose user I/O (bank 2) |
| 핀 140 | I/O — General-purpose user I/O (bank 2) |
| 핀 141 | I/O — General-purpose user I/O (bank 2) |
| 핀 142 | I/O — General-purpose user I/O (bank 2) |
| 핀 143 | I/O — General-purpose user I/O (bank 2) |
| 핀 144 | GND — Ground (exposed pad on package bottom) |
일반적인 애플리케이션
EP4CE6E22A7N 적합 용도: 6 애플리케이션s: Industrial Motor Control Encoder Interface, Video Format Conversion / Image Processing Pipeline, Industrial Ethernet / Fieldbus Protocol Bridging, LED Video Wall Scan and Refresh Driver, Handheld Test and Measurement Instrument, Automotive Infotainment / Body Electronics Module.
Industrial Motor Control Encoder Interface
The EP4CE6E22A7N's 15 embedded 18x18 multipliers and 91 user I/Os make it a strong fit for industrial motor control encoder and resolver interfaces. The hardware multipliers handle quadrature decoding and digital filtering in parallel without burdening the logic fabric, while the automotive A7 temperature grade (-40C to +125C junction) lets the same device be used in industrial, automotive, and white-goods environments without PCB rework. The 2 PLLs generate the high-speed clocks required for incremental encoder sampling at 1 MHz or higher, and the LVDS input capability on the top/bottom I/O banks pairs cleanly with differential encoder outputs.
추천
Video Format Conversion / Image Processing Pipeline
The EP4CE6E22A7N's 276,480 bits of M9K embedded RAM serve as line buffers and frame-store memory for video format conversion between DVI/HDMI, RGB, and LVDS display interfaces. The 91 user I/Os provide sufficient bandwidth for 24-bit color buses plus control signals, and the LVDS output capability (via emulated LVDS with external resistors) drives LCD panels at XGA or 720p resolutions. Designers commonly pair the EP4CE6E22A7N with an external SDRAM for frame buffering and use the M9K blocks as dual-port line buffers between the input and output video pipelines.
추천
Industrial Ethernet / Fieldbus Protocol Bridging
The EP4CE6E22A7N is widely deployed as a low-cost protocol bridge between industrial fieldbuses such as PROFINET, EtherCAT, EtherNet/IP, Modbus TCP, CAN, and RS-485. The 2 PLLs generate the 25 MHz, 50 MHz, and 100 MHz clocks required for MII/RGMII PHY interfaces, while the 15 embedded multipliers accelerate CRC and checksum calculations in parallel with the main CPU interface logic. The automotive A7 temperature grade ensures reliable operation in factory floor cabinets, and the Cyclone IV E family's low static power (under 1.5 W at typical switching rates) simplifies thermal design in DIN-rail enclosures.
추천
LED Video Wall Scan and Refresh Driver
The EP4CE6E22A7N's combination of 15 hardware multipliers, 270 Kbits of M9K memory, and 91 LVCMOS/LVDS-compatible user I/Os makes it well suited as a scan driver for LED video walls in digital signage and stage lighting applications. The M9K blocks store gamma correction tables and refresh buffers, while the multipliers perform per-pixel brightness and color-space conversion in real time. The automotive A7 temperature grade allows outdoor cabinet deployment in direct sunlight without active cooling, and the EQFP-144 exposed-pad package handles the moderate power dissipation of a fully-loaded Cyclone IV E cleanly through a copper thermal pour.
추천
Handheld Test and Measurement Instrument
The EP4CE6E22A7N's low static power (60 nm low-k process) and small 144-pin EQFP package are ideal for handheld portable test instruments such as oscilloscope front-ends, logic analyzers, and protocol sniffers. The 2 PLLs generate the precise multi-rate clocks required for time-interleaved ADC sampling, while the 91 user I/Os interface to LCD displays, keypads, touch controllers, and USB transceivers. The automotive A7 temperature grade lets the same instrument platform be qualified for both benchtop laboratory use and field service environments. Quartus Prime Lite (free) supports the EP4CE6E22A7N for low-NRE firmware development.
추천
Automotive Infotainment / Body Electronics Module
The EP4CE6E22A7N's automotive A7 temperature grade (-40C to +125C junction) and AEC-Q-style qualification makes it directly deployable in automotive infotainment head units, instrument clusters, body control modules, and CAN/LIN gateway nodes. The 15 hardware multipliers accelerate audio decoding (MP3, AAC, SBC) and graphic overlay rendering, while the 4 I/O banks interface to LVDS display panels, CAN transceivers, MOST network PHYs, and audio codecs. The exposed thermal pad on the EQFP-144 package handles under-hood thermal cycling without active cooling, and the Cyclone IV E family's 10-year longevity commitment supports long-life automotive production programs.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP4CE6E22A7N — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP4CE6E22C8N | EP4CE6E22I7N | EP4CE10E22C8N | EP4CE10E22I8N | EP4CE15E22C8N | XC6SLX9-2TQG144 |
|---|---|---|---|---|---|---|---|
| Package | 144-pin EQFP (E22) | 144-pin EQFP (E22) - same | 144-pin EQFP (E22) - same | 144-pin EQFP (E22) - same | 144-pin EQFP (E22) - same | 144-pin EQFP (E22) - same | 144-pin TQG144 - same |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | AMD |
| Logic Elements | 6,272 | 6,272 (same die) | 6,272 (same die) | 10,320 (+65%) | 10,320 (+65%) | 15,408 (+146%) | 9,152 logic cells |
| Temperature Grade | A7 (-40C to +125C junction) | C8 (0C to +85C) | I7 (-40C to +100C) | C8 (0C to +85C) | I8 (-40C to +100C) | C8 (0C to +85C) | C (0C to +85C) |
| Speed Grade | A7 (automotive timing) | C8 (commercial 8 ns) | I7 (industrial 7 ns) | C8 (commercial 8 ns) | I8 (industrial 8 ns) | C8 (commercial 8 ns) | -2 (Spartan-6 medium speed) |
| Embedded Multipliers (18x18) | 15 | 15 (same die) | 15 (same die) | 23 (+53%) | 23 (+53%) | 56 (+273%) | 16 DSP48A1 slices |
| Embedded Memory | 276,480 bits (270 Kbits) | 276,480 bits (same die) | 276,480 bits (same die) | 423,936 bits (+53%) | 423,936 bits (+53%) | 516,096 bits (+87%) | 589,824 bits (Block RAM) |
| User I/Os | 91 | 91 | 91 | 91 | 91 | 81 (-11%) | 102 (+12%) |
| Toolchain | Quartus Prime (free Lite) | Quartus Prime (free Lite) | Quartus Prime (free Lite) | Quartus Prime (free Lite) | Quartus Prime (free Lite) | Quartus Prime (free Lite) | ISE / Vivado (free WebPack) |
주요 차별점
- Automotive A7 temperature grade in low-cost Cyclone IV E family (vs EP4CE6E22C8N)
- Logic-density upgrade path on identical PCB footprint (vs EP4CE10E22C8N)
- Lowest-cost cross-architecture alternative (vs XC6SLX9-2TQG144)
설계 노트
Estimated: At typical 1.2 V core switching activity with 50% utilization, the EP4CE6E22A7N dissipates approximately 1.0 to 1.5 W of static and dynamic power. The exposed pad on the underside of the EQFP-144 package is the primary thermal path - it must be soldered to a PCB thermal pad connected to an inner ground plane with at least 9 thermal vias (0.3 mm diameter) for the datasheet thermal resistance of approximately 18 C/W to be met. Without the exposed-pad soldering, junction temperature can exceed 125C and trigger thermal shutdown during normal automotive operation.
Decouple the EP4CE6E22A7N with a 100 nF X7R 0402 ceramic capacitor within 3 mm of each VCCINT and VCCIO pin, plus a single 10 uF bulk tantalum or ceramic capacitor near the device. The four VCCIO banks can run at different voltages (1.2 V, 1.5 V, 1.8 V, 2.5 V, 3.0 V, or 3.3 V) and must each have their own decoupling. Keep the JTAG chain traces (TCK, TMS, TDI, TDO) under 150 mm total length and avoid running them parallel to high-speed LVDS signals.
LVDS input is supported only on the top (banks 1 and 3) and bottom (banks 2 and 4) I/O banks; LVDS output on the left/right banks requires an external resistor network for emulated LVDS. The MSEL[2:0] pins must match the desired configuration mode (AS x1, AS x4, PS, FPP) before power-up - changing MSEL after configuration begins causes configuration failure. Active Serial mode requires the MSEL pins to be set per the datasheet AS-x1 table, not the PS table.
Route all 91 user I/O signals on inner layers with 50 ohm single-ended or 100 ohm differential impedance, using the Intel-provided IBIS models for signal-integrity simulation. The two PLLs (top-left and bottom-right of the die) each require a quiet analog supply - place a ferrite bead between the PLL_AVCC pin and the main VCCINT plane, with 1 uF and 100 nF decoupling on the PLL_AVCC side. Do not route high-speed signals under the exposed pad or over the PLL region.
규정 준수 정보
RoHS and REACH compliant per Intel product page. The A7 suffix in EP4CE6E22A7N denotes the automotive temperature grade (-40C to +125C junction); the A7 speed/temperature code is part of the Cyclone IV E ordering information. AEC-Q100 qualification documentation is available under NDA from Intel Field Application Engineering.
