EP4CE75F23C9L - 75K LE Cyclone IV E FPGA, 484-FBGA | Intel
부품 번호: EP4CE75F23C9L ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $220.26 | $220.26 |
| 10 | $198.2 | $1,982.00 |
| 100 | $165.19 | $16,519.00 |
| 500 | $145 | $72,500.00 |
| 1,000 | $132.5 | $132,500.00 |
EP4CE75F23C9L 개요
A Field Programmable Gate Array (FPGA) is a reconfigurable semiconductor whose logic architecture is built from an array of programmable logic blocks (LABs), routing channels, and dedicated hardware blocks such as embedded memory, multipliers, PLLs, and (on some families) transceivers. FPGAs sit in the broader taxonomy of programmable logic devices (PLDs) -> programmable logic -> integrated circuit -> semiconductor. Cyclone IV E belongs to the low-power, cost-optimized Cyclone IV family which targets high-volume, cost-sensitive applications where ASICs and ASSPs are uneconomical.
Key differentiating features of the EP4CE75F23C9L include: 75,408 logic elements (LEs), 4,713 LABs, 2,810,880 embedded RAM bits organized as M9K memory blocks, 200 embedded 18x18 hardware multipliers, and 4 general-purpose PLLs. The device supports up to 292 single-ended or 146 differential I/Os across 8 I/O banks, with per-bank reference voltage support for LVDS, SSTL, HSTL, and LVPECL interfaces. Configuration is supported through JTAG, Active Serial (AS), Passive Serial (PS), and Fast Passive Parallel (FPP) modes using Altera/Intel Quartus design software.
Architecturally, Cyclone IV E devices are built on a 60 nm low-power SRAM process with a 1.0 V core (VCCINT) and a separate 1.2 V analog PLL supply (VCCPLL). I/O banks operate at 1.2 V to 3.3 V with support for mixed-voltage interfacing. This split-rail topology, combined with on-chip clock management, enables the EP4CE75F23C9L to deliver ASIC-class performance-per-watt while retaining full design-time reconfigurability.
Typical applications include industrial motor control and machine vision, video processing and broadcast equipment, automotive infotainment prototypes, telecommunications line cards, consumer display controllers, and PCIe endpoint bridges. The combination of high logic density and 200 18x18 multipliers makes the EP4CE75F23C9L particularly suitable for DSP-heavy designs such as real-time video filtering and baseband processing.
Design consideration: route all four PLL analog supplies through pi-filters and place decoupling within 5 mm of each power pin; the embedded M9K memory blocks have independent clocking requirements and require an additional decoupling network on each M9K bank supply pin. Use Quartus Pin Planner to assign VREF groups per bank when mixing SSTL and LVCMOS standards on the same bank.
This page synthesizes distributor pricing, drop-in alternatives drawn from the same Cyclone IV E family, and practical design notes that go beyond the manufacturer datasheet.
드롭인 대체품: EP4CE75F23C9L — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP4CE75F23C9L (동일 폼 팩터 및 풋프린트) — 차이점: Process Technology, Embedded 18x18 Multipliers, Package, Configuration Modes, Family.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP4CE75F23C8N
✅ 드롭인✓ 재고 있음
$42.3 / 개
데이터시트 보기 →EP4CE75F23C8LN
✅ 드롭인✓ 재고 있음
$108.5 / 개
데이터시트 보기 →EP4CE75F23C8L
✅ 드롭인✓ 재고 있음
가격 문의
데이터시트 보기 →EP4CE75F23C7N
✅ 드롭인✓ 재고 있음
$136.85 / 개
데이터시트 보기 →EP4CE75F23C6N
✅ 드롭인✓ 재고 있음
$189.5 / 개
데이터시트 보기 →EP4CE75F23C7
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$148 / 개
데이터시트 보기 →EP4CE75F23C9L 최대 정격 & 전기적 특성
| Series | Cyclone IV E |
| Family | Cyclone IV E Field Programmable Gate Array |
| Logic Elements (LEs) | 75,408 |
| Logic Array Blocks (LABs) | 4,713 |
| Embedded Memory | 2,810,880 bits (M9K blocks) |
| Embedded 18x18 Multipliers | 200 |
| General-Purpose PLLs | 4 |
| User I/O Pins | 292 |
| I/O Banks | 8 |
| 패키지 | 484-ball FBGA (FineLine BGA) |
| Process Technology | 60 nm |
| Core Voltage (VCCINT) | 1.0 V / 1.2 V |
| 동작 온도 | 0C to +85C (commercial) |
| Configuration Modes | AS / PS / FPP / JTAG |
| RoHS 상태 | Compliant |
EP4CE75F23C9L 484-ball fbga (fineline bga) 핀 구성 가이드
EP4CE75F23C9L(484-ball fbga (fineline bga) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP4CE75F23C9L.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP4CE75F23C9L 적합 용도: 7 애플리케이션s: Industrial Motor Control, Machine Vision and Video Processing, Telecommunications Line Cards, Automotive Infotainment Prototypes, Consumer Display Controllers, PCIe Endpoint Bridges, Test and Measurement Instrumentation.
Industrial Motor Control
The EP4CE75F23C9L is well-suited for industrial motor control where 200 18x18 hardware multipliers enable real-time vector (FOC) and trapezoidal commutation algorithms. Its 75,408 logic elements provide headroom for custom protection logic, encoder interfaces (QEP/Hall), and EtherCAT/IP protocol stacks, while the 4 on-chip PLLs generate jitter-clean clocks for PWM and resolver excitation. Industrial designers pair the device with the TI TMS320F28335 DSP or onboard ADC front-ends, leveraging the 292 user I/O to absorb multi-axis feedback. The commercial 0C to +85C temperature range suits panel-mount enclosures without active thermal management.
추천
Machine Vision and Video Processing
The EP4CE75F23C9L's 2,810,880 embedded RAM bits and 200 multipliers support real-time image pipelines - Bayer demosaicing, Sobel edge detection, and H.264 baseline encode at D1/720p resolutions. The 484-ball FBGA exposes LVDS pairs across 8 banks, enabling direct attachment to MT9V024 or OV5640 image sensors without external bridge chips. The 4 PLLs derive pixel clocks and DDR memory clocks for frame buffering in external SDRAM. Designers commonly pair the FPGA with a Micron MT48LC16M16A2 SDRAM for line buffers; Intel's Video and Image Processing (VIP) IP cores accelerate development by 3-6 months versus rolling custom logic.
추천
Telecommunications Line Cards
In telecom line cards, the EP4CE75F23C9L implements glue logic, TDM crossbars, and protocol adaptation between T1/E1 framers and backplane SERDES. The device's 4 PLLs synthesize jitter-compliant clocks for LIU interfaces, while the 292 I/O handles per-channel status LEDs, alarms, and hot-swap control. Cyclone IV E's 1.0 V core and 60 nm process deliver low power per channel, an important metric when designing dense line cards with hundreds of channels per board. The device interfaces with Broadcom BCM6301/6302 DSL chipsets or PMC Sierra framers; pin-compatible migration to EP4CE115F29C8N is possible if channel count grows.
추천
Automotive Infotainment Prototypes
The EP4CE75F23C9L accelerates pre-production automotive infotainment designs where LVDS to HDMI conversion, CAN bus bridging, and audio sample-rate conversion must be validated before ASIC tape-out. Its 75,408 logic elements can host a Tensilica-compatible audio DSP and a CAN-to-Ethernet gateway simultaneously, while 200 hardware multipliers handle ASRC polyphase filtering. The 8 I/O banks mix 3.3 V LVCMOS for legacy MCUs with 1.8 V LVDS for modern displays without level shifters. For production, designs migrate to ASIC or Cyclone V; the EP4CE75 remains the most cost-effective pre-silicon validation platform. Engineers typically pair it with NXP TJA1040 CAN transceivers and TI PCM3168A audio codecs.
추천
Consumer Display Controllers
Consumer display controller boards use the EP4CE75F23C9L to bridge HDMI/DVI/DisplayPort inputs to LVDS or eDP panel outputs, performing resolution scaling, color-space conversion, and OSD overlay in hardware. The 200 embedded multipliers enable multi-tap polyphase scaling at 1080p60 with sub-pixel precision, while 2,810,880 RAM bits buffer two full HD frames. The 8 I/O banks let one device ingest HDMI and simultaneously output LVDS to a TFT panel without external bridges. Designers frequently pair the FPGA with a Macronix MX25L25635F configuration flash and an ITE IT66121 HDMI receiver; cost reduction is possible by stepping down to EP4CE40F23C8N for 720p-only designs.
추천
PCIe Endpoint Bridges
The EP4CE75F23C9L implements a PCIe Gen1 x1/x4 endpoint bridge when paired with external PHY chips, providing cost-effective host-side connectivity for industrial PCs, test equipment, and data acquisition cards. Its 75,408 logic elements fit the PCIe Hard IP plus custom DMA engines and interrupt controllers, while the 4 PLLs supply the 100 MHz reference clock required by PCIe PHY devices. The 292 user I/O exposes up to 8 lanes of PCIe when using sub-LVDS signaling on dedicated clock-capable pins. The C9 speed grade meets PCIe Gen1 timing with margin; designers can migrate to EP4CE75F23C8N for tighter budgets. Pair with a TI XIO1100 X1 PHY or Microchip PM8531B for full link-up.
추천
Test and Measurement Instrumentation
In test and measurement instruments such as logic analyzers, protocol analyzers, and bench-top scopes, the EP4CE75F23C9L performs high-speed state-machine triggering, protocol decode, and ADC/DAC interface glue. Its 200 multipliers handle FFT-based spectral displays, while 292 user I/O connect to MSO probe heads and front-panel controls. The 4 PLLs synthesize independent sample clocks for each acquisition channel, eliminating the need for external clock generators. Pair with TI ADS5560 ADCs and a Lattice LCMXO2-256ZE clock buffer for sub-ns correlation; designers value the same-footprint migration to EP4CE115F29C8N when channels scale beyond 32.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP4CE75F23C9L — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP4CE75F23C8N | EP4CE75F23C8LN | EP4CE75F23C7N | EP4CE75F23C6N |
|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel |
| Package | 484-ball FBGA | 484-ball FBGA - same | 484-ball FBGA - same | 484-ball FBGA - same | 484-ball FBGA - same |
| Logic Elements | 75,408 | 75,408 - same | 75,408 - same | 75,408 - same | 75,408 - same |
| Speed Grade | C9 (9 ns) | C8 (8 ns) - 11% faster | C8 (8 ns) - 11% faster | C7 (7 ns) - 22% faster | C6 (6 ns) - 33% faster |
| Temperature Grade | Commercial (0C to +85C) | Industrial (-40C to +85C) | Industrial (-40C to +85C) | Industrial (-40C to +85C) | Industrial (-40C to +85C) |
| User I/O | 292 | 292 - same | 292 - same | 292 - same | 292 - same |
| Embedded Multipliers (18x18) | 200 | 200 - same | 200 - same | 200 - same | 200 - same |
| Embedded Memory | 2,810,880 bits | 2,810,880 bits - same | 2,810,880 bits - same | 2,810,880 bits - same | 2,810,880 bits - same |
| General-Purpose PLLs | 4 | 4 - same | 4 - same | 4 - same | 4 - same |
| RoHS Status | Compliant | Compliant | Compliant (Pb-free) | Compliant | Compliant |
주요 차별점
- Same-package faster speed grade with industrial temperature (vs EP4CE75F23C8N)
- Higher logic density and memory at the same FBGA footprint (vs EP4CE55F23C9L)
- Largest Cyclone IV E device with same package (vs EP4CE115F23C9L)
설계 노트
The Cyclone IV E EP4CE75F23C9L requires three power rails: VCCINT (1.0 V or 1.2 V core), VCCIO (per-bank, 1.2 V to 3.3 V), and VCCPLL (1.2 V analog PLL supply). Decouple each VCCINT pin with a 0.1 uF X7R ceramic within 5 mm, and add a bulk 47 uF tantalum or polymer capacitor per VCCINT island. VCCPLL must be filtered through a pi-network (ferrite bead + 10 uF + 0.1 uF) to minimize PLL jitter - shared switching noise will directly degrade transceiver timing margin.
The 484-ball FBGA uses a 1.0 mm pitch with a staggered depopulated ball map; route signals on inner layers with 0.1 mm (4 mil) traces and 0.15 mm (6 mil) spaces. Match all differential pairs to within 0.13 mm (5 mil) length tolerance and target 100 ohm differential impedance for LVDS, 50 ohm single-ended for LVCMOS. Use a 4-layer stack-up with continuous VCC/GND planes under the BGA - lack of a solid reference plane is the single most common cause of FPGA signal-integrity failures on the bench.
Do not rely on MSEL pin pull-ups alone for configuration mode selection - all four MSEL pins must be strapped cleanly to VCCIO8 or GND with 4.7 kohm resistors; floating MSEL pins cause intermittent configuration failures in production. When using Active Serial configuration, the EPCS or EPCQ flash must be powered up before or simultaneously with VCCINT, otherwise the FPGA will fail to recognize the configuration device and fall back to JTAG. Always check MSEL before debugging a 'dead' board.
Estimated: at 100% LE utilization, 50% toggle rate, and typical 1.2 V/1.0 V supply, the EP4CE75F23C9L dissipates approximately 1.5 W to 2.5 W. The 484-FBGA's theta_JA is roughly 15 C/W with a standard 4-layer JEDEC test board, yielding a junction temperature rise of 23-38 C above ambient. For enclosed industrial enclosures without forced airflow, derate junction-to-air by 30% and verify with a thermal probe on the top-side BGA package, not the bottom of the PCB.
Source-synchronous interfaces (DDR, LVDS, SSTL) must use the dedicated DQS/DQ groups and clock-capable pins listed in the Cyclone IV device handbook chapter 8; software-defined DQS pins will fail timing closure. For DDR2 SDRAM interfaces, set OCT (on-chip termination) to 50 ohm Rs=25 ohm to match typical 1.8 V memory modules; mismatched impedance is the leading cause of intermittent memory errors at 200 MHz and above.
규정 준수 정보
RoHS and REACH compliance confirmed per Intel/Altera Cyclone IV E product page. Halogen-free per JEDEC JS709. AEC-Q100 not qualified - choose automotive-grade Cyclone IV GX or external AEC-Q100 parts for vehicle applications.