EP4CE75F29C8 - Cyclone IV E FPGA, 75K LE, 780-FBGA | Intel / Altera
부품 번호: EP4CE75F29C8 ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $220.77 | $220.77 |
| 10 | $198.69 | $1,986.90 |
| 100 | $165.58 | $16,558.00 |
| 500 | $138 | $69,000.00 |
| 1,000 | $121.42 | $121,420.00 |
EP4CE75F29C8 개요
An FPGA (Field Programmable Gate Array) is a reprogrammable digital logic device consisting of an array of configurable logic blocks (CLBs), programmable routing, dedicated memory blocks (M9K/M10K), DSP blocks, and high-speed I/O transceivers. FPGAs sit in the wider taxonomy of programmable logic devices (PLDs) and are used when designers need hardware-level parallelism, deterministic timing, or post-production design changes that ASICs and microcontrollers cannot economically provide.
Key features of the EP4CE75F29C8 include 4 PLLs for clock management, 274 embedded 18x18 multipliers (DSP blocks), 4.6 Mbits of total RAM across 245 M9K blocks, configuration via active serial (AS), passive serial (PS), JTAG, or Fast Passive Parallel (FPP) modes, and a Cyclone IV E series -8 commercial speed grade. The device supports LVDS, SSTL, LVCMOS, and LVTTL I/O standards and is rated for industrial temperature ranges in the 'F29' 780-pin FineLine BGA package.
Architecturally, the EP4CE75F29C8 uses 4-input look-up tables (4-LUTs) and embedded memory columns that enable efficient implementation of state machines, FIFOs, and arithmetic pipelines. Its high multiplier count allows cost-effective DSP-intensive designs such as video processing and motor control, while the 1.2 V core reduces dynamic power compared to previous Cyclone III generations.
Typical applications include industrial motor control and drives, factory automation controllers, video surveillance and image processing pipelines, automotive infotainment prototypes, communications infrastructure line cards, and cost-sensitive ASIC prototyping. The 780-FBGA footprint also gives generous routing headroom for high-pin-count parallel buses and multiple memory interfaces (DDR/DDR2 SDRAM).
When designing with this device, allocate at least 2 layers for power and ground in the PCB stack-up, place decoupling capacitors within 100 mil of every VCC/VCCIO pin, and use the Quartus II / Quartus Prime design software for synthesis, place-and-route, and timing closure. Verify signal-integrity budgets on DDR interfaces with the IBIS models available on the Intel FPGA support site.
This page synthesizes distributor pricing, drop-in same-package alternatives, and practical PCB/design notes not found on a single manufacturer datasheet, helping hardware engineers make faster, more informed decisions for Cyclone IV E mid-density FPGA selection.
드롭인 대체품: EP4CE75F29C8 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP4CE75F29C8 (동일 폼 팩터 및 풋프린트) — 차이점: Package, Process Technology, Operating Temperature, Speed Grade, Configuration Method.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP4CE75F29C8N
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$149.75 / 개
데이터시트 보기 →EP4CE75F29C7N
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$152.7 / 개
데이터시트 보기 →EP4CE75F29C7
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$199.96 / 개
데이터시트 보기 →EP4CE55F29C8
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$95.41 / 개
데이터시트 보기 →EP4CE55F29C8N
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$285 / 개
데이터시트 보기 →EP4CE75F29C8 최대 정격 & 전기적 특성
| Series | Cyclone IV E |
| Logic Elements (LE) | 75,408 |
| Total Memory Bits | 2,810,880 bits |
| Embedded Memory (M9K blocks) | 245 |
| Embedded Multipliers (18x18) | 274 |
| PLLs | 4 |
| User I/O Pins | 426 |
| 패키지 | 780-ball FineLine BGA (FBGA-780) |
| 동작 온도 | 0C to +85C (commercial) |
| Core Voltage | 1.2 V |
| Speed Grade | -8 |
| Process Node | 60 nm low-power |
| Configuration Modes | AS, PS, JTAG, FPP |
| I/O Standards | LVDS, LVCMOS, LVTTL, SSTL |
| RoHS 상태 | Compliant |
EP4CE75F29C8 780-ball fineline bga (fbga-780) 핀 구성 가이드
EP4CE75F29C8(780-ball fineline bga (fbga-780) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP4CE75F29C8.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP4CE75F29C8 적합 용도: 6 애플리케이션s: Industrial Motor Control and Drives, Video Surveillance and Image Processing, Factory Automation and PLC Controllers, ASIC Prototyping and Emulation, Communications Line-Card Interface, Automotive Infotainment Prototyping.
Industrial Motor Control and Drives
The EP4CE75F29C8 is well suited to industrial motor control because its 274 embedded 18x18 multipliers handle field-oriented control (FOC) and Park/Clarke transforms in real time without offloading to a separate DSP. The 75,408 logic elements accommodate multiple PWM channels, encoder interfaces, and safety state machines in parallel, while the 4 PLLs generate precise switching frequencies up to hundreds of kHz. With 426 user I/O, designers can connect to multi-axis resolver, Hall-sensor, and CAN bus peripherals directly. Estimated: at 100 MHz core and 60% utilization, dynamic power stays under ~1.5 W, allowing convection cooling in sealed IP65 drive enclosures.
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Video Surveillance and Image Processing
The EP4CE75F29C8's 4.6 Mbits of embedded RAM across 245 M9K blocks is ideal for line buffering in video pipelines, supporting D1 (720x480) and partial HD (1280x720) real-time processing without external SRAM. Its 274 dedicated 18x18 multipliers accelerate Sobel, Gaussian, and motion-estimation kernels, while 426 user I/O pins accept parallel camera sensor buses (BT.656, BT.1120, or LVDS). The 780-FBGA package provides the routing escape needed for SDRAM and DDR2 image buffers. According to the Cyclone IV Device Handbook, this device family has been widely deployed in mid-range IP camera SoM designs since 2010.
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Factory Automation and PLC Controllers
Industrial PLC designs benefit from the EP4CE75F29C8's deterministic parallel architecture: 75,408 LE execute ladder-logic-equivalent state machines and IEC 61131-3 soft-PLC cores while 426 user I/O drive 24V opto-isolated field buses. The 4 PLLs synthesize isolated timing domains for Profibus, EtherCAT, or Modbus interfaces. Commercial 0C to +85C temperature grade is adequate for indoor cabinet mounting, and the 780-FBGA's 1.0 mm ball pitch is compatible with standard 4-layer FR-4 stack-ups. Estimated: with industrial-grade decoupling (10uF + 0.1uF per bank), the design meets EN 61131-2 EMC requirements in field-deployed installations.
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ASIC Prototyping and Emulation
The EP4CE75F29C8 is widely used as a building block in ASIC and SoC prototyping because its 75K logic elements map cleanly to mid-complexity RTL blocks, and its 274 multipliers emulate hardware accelerators. Designers chain multiple FPGAs through LVDS or SSTL inter-FPGA links using the 426 available I/O pins. Quartus Prime synthesis with the Cyclone IV E library supports incremental compilation and partition-based flows that mirror ASIC DFT patterns. Estimated: a typical ASIC block of 60K gates maps to roughly 25K Cyclone IV LE, leaving ~30K LE margin for debug instrumentation.
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Communications Line-Card Interface
Telecom line cards leverage the EP4CE75F29C8's LVDS and SSTL I/O support to bridge between high-speed serializers and backplane SERDES interfaces. The 4 PLLs synthesize independent clock domains for TDM buses, framer ICs, and timing references. With 245 M9K blocks, designers implement deep elastic buffers for packet re-timing. The 780-FBGA's 1.0 mm pitch keeps PCB area below 30x30 mm, valuable in dense central-office shelves. According to Intel's Cyclone IV E documentation, the device's 1.2 V core and banked VCCIO enable direct interfacing to legacy 3.3 V and 1.8 V ASICs without level shifters.
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Automotive Infotainment Prototyping
Pre-production automotive infotainment and ADAS prototypes use the EP4CE75F29C8 to validate display controllers, LVDS video paths, and CAN/LIN gateway logic before committing to an ASIC. The 426 user I/O accept multiple camera inputs and MIPI-Bridge adapters, while 75K LE allow concurrent rendering of Qt/HMI graphics and audio DSP pipelines. Designers appreciate that the 780-FBGA package is footprint-compatible with the broader 'F29' Cyclone IV E family, enabling rapid logic-density scaling across concept variants. Estimated: at 85C ambient and 70% utilization, junction temperature stays below 100C with the recommended 8-layer PCB thermal stack-up.
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추천 제품 요약
엔지니어링 참조 데이터: EP4CE75F29C8 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP4CE75F29C8N | EP4CE75F29C7N | EP4CE75F29C7 | EP4CE55F29C8 | EP4CE55F29C8N |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 780-ball FBGA (F29) | 780-ball FBGA (F29) - same | 780-ball FBGA (F29) - same | 780-ball FBGA (F29) - same | 780-ball FBGA (F29) - same | 780-ball FBGA (F29) - same |
| Logic Elements | 75,408 | 75,408 | 75,408 | 75,408 | 55,856 | 55,856 |
| Speed Grade | -8 | -8 | -7 | -7 | -8 | -8 |
| Embedded Multipliers (18x18) | 274 | 274 | 274 | 274 | 156 | 156 |
| Embedded Memory (bits) | 2,810,880 | 2,810,880 | 2,810,880 | 2,810,880 | 2,396,160 | 2,396,160 |
| User I/O | 426 | 426 | 426 | 426 | 374 | 374 |
| PLLs | 4 | 4 | 4 | 4 | 4 | 4 |
| Lead-Free (N suffix) | No | Yes | Yes | No | No | Yes |
주요 차별점
- Highest LE density in the F29 780-FBGA package family (vs EP4CE55F29C8)
- Faster -8 speed grade vs -7 alternatives (vs EP4CE75F29C7N)
- Higher multiplier count than smaller F29 variants (vs EP4CE55F29C8)
설계 노트
The 780-ball FineLine BGA uses 1.0 mm ball pitch. Use at least a 4-layer PCB stack-up with two internal ground/power planes; 6 or 8 layers are recommended for designs using DDR2 SDRAM interfaces. Per Intel's Cyclone IV Device Handbook PCB guidelines, fan-out micro-vias (0.1 mm laser-drilled) or via-in-pad are recommended for full BGA breakout. Place at least one 0.1 uF decoupling capacitor within 100 mil of every VCC and VCCIO pin, plus bulk 100 uF tantalum or ceramic capacitors on each supply rail.
Estimated: at 100 MHz core clock with 70% logic utilization and 50% toggle rate, dynamic power is approximately 1.2-1.5 W; add static and I/O power for a junction budget around 1.8 W. With the 780-FBGA's theta_JA around 15-20 C/W on a standard 4-layer JEDEC test board, junction-to-ambient rise is approximately 30C. For enclosed industrial enclosures without airflow, consider a small heatsink or thermal vias under the exposed pad (if available on the package variant). Use the Quartus Prime PowerPlay analyzer for design-specific power estimation before sign-off.
Do not confuse the F29 780-FBGA package with the F23 484-FBGA package used by EP4CE115F23C8N - they are NOT pin-compatible and require a different PCB layout. When migrating between speed grades (-7 vs -8), re-run timing analysis in Quartus Prime because the slower grade may not meet fMax targets. Configuration mode selection (AS vs PS vs JTAG) determines the required pull-up/pull-down on MSEL pins; refer to the Cyclone IV Device Handbook chapter on configuration before finalizing the schematic. Estimated: configuration time for a fully-utilized 75K-LE design via AS x1 mode is approximately 200 ms using an EPCS16 serial flash.
규정 준수 정보
EP4CE75F29C8 is RoHS compliant per Intel / Altera product page but does NOT carry the 'N' lead-free finish suffix; order EP4CE75F29C8N for full lead-free / Pb-free plating. Not AEC-Q100 qualified - not intended for automotive safety-critical applications.