EP4CGX110CF23C7 - Cyclone IV GX FPGA, 109K LEs, 484-FBGA | Intel
부품 번호: EP4CGX110CF23C7 ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $329.75 | $329.75 |
| 10 | $296.78 | $2,967.80 |
| 100 | $263.8 | $26,380.00 |
| 250 | $244.32 | $61,080.00 |
| 500 | $224.84 | $112,420.00 |
EP4CGX110CF23C7 개요
A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit whose logic functionality is defined after manufacturing by user-supplied configuration data, enabling hardware re-programmability for digital logic, signal processing, and interface bridging tasks. In the broader taxonomy, the EP4CGX110CF23C7 sits in the Cyclone IV GX sub-family of Intel's low-cost, low-power programmable logic family, which is itself part of Intel's programmable logic device (PLD) portfolio alongside the higher-end Stratix and Agilex families. It uses SRAM-based configuration cells loaded at power-up from external flash, with built-in support for industry-standard PCIe, Gigabit Ethernet, and high-speed serial protocols.
Key differentiating features include 8 high-speed transceivers operating up to 3.125 Gbps with 8B/10B encoding, four general-purpose PLLs for clock synthesis, and 56 embedded 18x18 multipliers that deliver up to 1.5 GMACS DSP throughput. The device supports multiple I/O standards (LVDS, LVCMOS, SSTL, HSTL) on 270 user I/O pins, and the F23 484-FBGA package enables high-density board designs with full transceiver access. Configuration is supported via JTAG, Active Serial (AS), Passive Serial (PS), and Fast Passive Parallel (FPP) modes.
Typical applications include industrial machine vision, broadcast video processing, low-cost wireless backhaul, motor control, automotive infotainment pre-processing, and PCIe endpoint cards. The combination of integrated transceivers, generous DSP blocks, and low static power makes the EP4CGX110CF23C7 particularly attractive for price-sensitive designs that still need multi-gigabit serial links.
When designing with this device, plan power sequencing for the 1.2 V core rail and dedicated transceiver PLL supplies, and use the Quartus II/Prime tool chain for synthesis, place-and-route, and bitstream generation. A thermal solution is required for sustained high-utilization workloads; refer to the Cyclone IV GX PowerPlay early power estimator before final layout.
드롭인 대체품: EP4CGX110CF23C7 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP4CGX110CF23C7 (동일 폼 팩터 및 풋프린트) — 차이점: Package, Operating Temperature, Speed Grade, Transceivers, RoHS Status.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP4CGX110CF23C7N
✅ 드롭인✓ 재고 있음
$89.12 / 개
데이터시트 보기 →EP4CGX110CF23C8N
✅ 드롭인✓ 재고 있음
$170.45 / 개
데이터시트 보기 →EP4CGX110CF23I7N
✅ 드롭인✓ 재고 있음
$1650.08 / 개
데이터시트 보기 →EP4CGX110CF23C6N
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
EP4CGX110CF23C9N
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
EP4CGX110CF23C7 최대 정격 & 전기적 특성
| Family | Cyclone IV GX |
| Device Model | EP4CGX110 |
| Logic Elements (LEs) | 109,424 |
| Embedded Memory | 5,621,760 bits |
| User I/Os | 270 |
| Number of LABs | 6,839 |
| Embedded 18x18 Multipliers | 56 |
| PLLs | 4 (general purpose) |
| Transceivers | 8 channels, up to 3.125 Gbps |
| Core Voltage | 1.2 V |
| Process Technology | 60 nm low-power |
| 패키지 | 484-ball FineLine BGA (F23) |
| 실장 유형 | Surface Mount |
| 동작 온도 | Commercial (0C to +85C) - inferred from speed grade 'C' |
| Configuration Methods | JTAG, AS, PS, FPP |
| RoHS 상태 | Compliant |
EP4CGX110CF23C7 484-ball fineline bga (f23) 핀 구성 가이드
EP4CGX110CF23C7(484-ball fineline bga (f23) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP4CGX110CF23C7.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP4CGX110CF23C7 적합 용도: 6 애플리케이션s: Industrial Machine Vision Camera, PCIe Gen2 Endpoint Card, Broadcast SDI/HD-SDI Video Router, Wireless Backhaul Baseband Modem, Motor Control and Servo Drive, Test & Measurement Instrumentation.
Industrial Machine Vision Camera
Why the EP4CGX110CF23C7 fits: its 109,424 logic elements and 56 embedded 18x18 multipliers provide the DSP throughput required to run Bayer-to-RGB demosaic, gamma correction, and edge-detection pipelines in real time, while the eight 3.125 Gbps transceivers handle uncompressed CoaXPress or GigE Vision data streams directly to the host. The 270 user I/Os accept multi-lane MIPI-CSI2 or LVDS sensor interfaces without external bridge chips. Designers typically allocate the four PLLs for sensor pixel clock, GigE reference, video output pixel clock, and a system timestamp counter, leaving margin for future resolution upgrades. Compared with a discrete CPU/DSP approach, this single-chip solution reduces BOM cost and improves determinism for vision-quality inspection in semiconductor fabs.
추천
PCIe Gen2 Endpoint Card
Why the EP4CGX110CF23C7 fits: the Cyclone IV GX hard IP block supports x1, x2, and x4 PCIe Gen1 (2.5 Gbps) and Gen2 (5.0 Gbps) endpoints directly through its integrated transceivers, eliminating the need for an external PCIe PHY and reducing both PCB area and BOM. With 5.6 Mbits of block RAM it is sufficient for DMA descriptor rings and small protocol-stack offloads. A typical endpoint card design uses 1-2 transceivers for PCIe lanes and routes the remaining channels to multi-gigabit transceivers for companion FPGA-to-FPGA links across the backplane. The 1.2 V core with on-chip regulation keeps power budget within PCIe slot limits, and the F23 484-FBGA package exposes all transceiver balls for matched-length routing.
추천
Broadcast SDI/HD-SDI Video Router
Why the EP4CGX110CF23C7 fits: with eight transceivers each supporting up to 3.125 Gbps, the FPGA can simultaneously ingest or drive up to eight channels of HD-SDI (1.485 Gbps) or four channels of 3G-SDI (2.97 Gbps), while the 109K logic elements implement SMPTE 292M/424M scrambling, line-numbering, and ancillary-data insertion in hardware. The 270 LVDS-capable user I/Os handle GPI/GPO, tally, and audio-de-embed control. The four PLLs provide clean 148.5 MHz / 148.35 MHz video clocks with sub-pixel jitter performance, critical for broadcast compliance. Compared to ASIC video crosspoint solutions, the FPGA-based router is field-upgradeable to support new SDI formats and downstream IP traffic.
추천
Wireless Backhaul Baseband Modem
Why the EP4CGX110CF23C7 fits: the 56 embedded 18x18 multipliers and dedicated memory blocks provide 1.5 GMACS DSP throughput, sufficient for 256-QAM baseband modulation and channel-equalization at symbol rates up to 80 Msps in a small-cell wireless-backhaul radio. The transceivers directly interface with RF front-end ADCs/DACs via JESD204B-equivalent LVDS interfaces, removing the need for an intermediate FPGA. The 109K LEs accommodate both PHY-layer FEC (Turbo or LDPC) and a lightweight L2/L3 framing engine. The low 60 nm process static power keeps the bill of materials and thermal envelope compatible with outdoor pole-mount radios.
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Motor Control and Servo Drive
Why the EP4CGX110CF23C7 fits: the FPGA delivers deterministic sub-microsecond control-loop latency for field-oriented control (FOC) of three-phase permanent-magnet and induction motors, with the 56 hardware multipliers executing Park/Clarke transforms and PID loops without software jitter. The 270 user I/Os support three-phase PWM outputs, quadrature encoder feedback, and resolver-excitation channels simultaneously. The four PLLs synthesize the carrier frequency and PWM switching frequency from a single crystal reference. The 1.2 V core and on-chip regulators simplify the auxiliary supply tree in industrial servo drives and reduces board area by replacing discrete DSP/MCU combinations.
추천
Test & Measurement Instrumentation
Why the EP4CGX110CF23C7 fits: with 5.6 Mbits of embedded RAM it can capture and buffer multi-million-sample waveform windows before downstream transfer, while the eight transceivers stream 8-bit ADC data at up to 3.125 Gbps to host software for post-processing. The 109K logic elements provide protocol flexibility (I2C, SPI, UART, JTAG, custom timing) for instrument front-panel control, and the four PLLs generate test-clock frequencies from DC to 800 MHz with sub-picosecond jitter when using external VCXO reference loops. Compared with off-the-shelf microcontrollers, the FPGA delivers parallel sample handling and deterministic response for automated test equipment.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP4CGX110CF23C7 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP4CGX110CF23C7N | EP4CGX110CF23C8N | EP4CGX110CF23I7N | EP4CGX110CF23C6N | EP4CGX110CF23C9N |
|---|---|---|---|---|---|---|
| Package | 484-FBGA (F23) | 484-FBGA (F23) - same | 484-FBGA (F23) - same | 484-FBGA (F23) - same | 484-FBGA (F23) - same | 484-FBGA (F23) - same |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Speed Grade | C7 | C7 | C8 (faster) | I7 (industrial) | C6 (slower) | C9 (fastest) |
| Logic Elements | 109,424 | 109,424 | 109,424 | 109,424 | 109,424 | 109,424 |
| Embedded Memory (bits) | 5,621,760 | 5,621,760 | 5,621,760 | 5,621,760 | 5,621,760 | 5,621,760 |
| Operating Temperature | Commercial (0C to +85C) | Commercial | Commercial | Industrial (-40C to +100C) | Commercial | Commercial |
| Lead-Free Plating | No (standard) / Yes (C7N variant) | Yes | Yes | Yes | Yes | Yes |
| Transceivers | 8 x 3.125 Gbps | 8 x 3.125 Gbps | 8 x 3.125 Gbps | 8 x 3.125 Gbps | 8 x 3.125 Gbps | 8 x 3.125 Gbps |
주요 차별점
- Integrated 3.125 Gbps transceivers (vs Cyclone IV E family (e.g., EP4CE75F23C8N))
- Largest density in 484-ball F23 package (vs Cyclone IV GX EP4CGX75 (75K LEs) in same F23 package)
- Multiple temperature-grade variants in same pinout (vs Single-temperature cross-brand FPGA parts)
설계 노트
Estimated: at 50% logic utilization, 8 active 3.125 Gbps transceivers, and 156 MHz reference, the EP4CGX110CF23C7 typically draws 3-5 W from a 1.2 V core plus 2.5 V and 3.3 V analog rails. Use the Cyclone IV GX PowerPlay Early Power Estimator with your specific toggle rate and resource usage before committing to a heatsink or convection-only design. Decouple each VCC pin with a 0.1 uF X7R ceramic plus a 4.7 uF bulk capacitor placed within 100 mils of the package ball.
For 484-ball FineLine BGA layout, allocate at least 4 routing layers with microvia stacks (laser-drilled 0.1 mm vias) to escape the 1.0 mm pitch ball grid. Match-length tuning for the eight transceiver differential pairs should be performed in the PCB tool before stack-up finalization; transceivers require intra-pair skew of less than 5 ps. Reference the Cyclone IV GX PCB Design Guide (AN 522) for via-stitching and ground-pour patterns around the transceiver power islands.
Do not release board bring-up without validating the configuration mode (AS vs PS vs JTAG) and the dual-purpose pins that overlap JTAG and configuration signals. Pull MSEL[3:0] to the correct logic level for the selected mode, otherwise the device will fail to enter user mode. Also ensure that the POR delay (typically ~25 ms after all supplies are stable) has elapsed before issuing JTAG operations, or the configuration controller will respond with errors.
Estimated: with a theta_JA around 14 C/W for the F23 FBGA on a JEDEC 4-layer test board and a 4 W dissipation, the junction temperature rises approximately 56C above ambient. For sealed enclosures with limited airflow, derate the design to 3 W continuous to keep Tj below 100C in commercial temperature. Use thermal vias under the central die paddle and a 50 mm x 50 mm copper pour on the top layer to improve heat spreading.
규정 준수 정보
RoHS and REACH compliance per Altera/Intel Cyclone IV GX product family declaration. AEC-Q100 not applicable - Cyclone IV GX family is not automotive qualified. Lead-free and halogen-free status of the specific EP4CGX110CF23C7 ordering part not stated in the retrieved data; see the N-suffix variants (e.g., EP4CGX110CF23C7N) for guaranteed Pb-free plating.