EP4CGX50DF23C8N - 49,888 Cells Cyclone IV GX FPGA, 484-FBGA | Intel
부품 번호: EP4CGX50DF23C8N ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $78.5 | $78.50 |
| 10 | $72.4 | $724.00 |
| 100 | $65.1 | $6,510.00 |
| 250 | $60.85 | $15,212.50 |
| 500 | $56.4 | $28,200.00 |
EP4CGX50DF23C8N 개요
An FPGA (Field Programmable Gate Array) is a reprogrammable semiconductor device whose logic function is defined by a configuration bitstream rather than hard-wired masks. FPGAs sit at the top of the programmable-logic hierarchy (PAL/CPLD -> FPGA -> SoC FPGA) and combine programmable logic blocks, routing, dedicated DSP blocks, block RAM, and hardened I/O serializers. The Cyclone IV GX family is Intel's (formerly Altera's) low-cost, low-power FPGA line targeting applications that need transceivers but do not require the largest device.
Key features include 49,888 logic elements, 3,118 Configurable Logic Blocks (CLBs), embedded multipliers, embedded block RAM, and up to eight 3.125 Gbps transceivers depending on package variant. The device supports common I/O standards (LVDS, LVTTL, LVCMOS, SSTL, HSTL), integrated PLLs for clock management, and a configuration interface compatible with JTAG, passive serial, and active serial modes. The 484-FBGA package uses a 1.0 mm ball pitch with a 2.40 mm seated height, suitable for high-density PCB designs.
Architecturally, Cyclone IV GX uses 8-input adaptive logic modules (ALMs) feeding a multi-tier routing network, with dedicated 18x18 multipliers, M9K block RAM blocks, and 8B/10B-encoded transceivers. Compared with the older Cyclone III generation, Cyclone IV GX adds transceiver capability at lower static power, enabling video-bridging, industrial imaging, and low-end wireless backhaul designs on a single chip.
Typical applications include industrial video bridge and image processing, low-end wireless backhaul, machine vision, motor control, PCIe endpoint bridging, and consumer display controllers. Transceiver capability makes it well suited for serial RapidIO, SDI video, and proprietary SERDES links up to 3.125 Gbps.
Design tip: provide a clean, decoupled 1.2 V core rail, separate 2.5 V/3.3 V analog PLLs and transceiver supplies, and follow Intel's recommended decoupling and PCB stack-up for BGA packages to maintain signal-integrity on multi-gigabit serial lanes.
This page consolidates distributor pricing, verified drop-in alternatives, and engineering design notes not present in the manufacturer datasheet, giving procurement and design engineers a single source for the EP4CGX50DF23C8N.
드롭인 대체품: EP4CGX50DF23C8N — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP4CGX50DF23C8N (동일 폼 팩터 및 풋프린트) — 차이점: Package, Transceivers, RoHS Status, Operating Temperature, Process Technology.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP4CGX50DF23C7N
✅ 드롭인✓ 재고 있음
$43.2 / 개
데이터시트 보기 →EP4CGX50DF23C6N
✅ 드롭인✓ 재고 있음
$52.3 / 개
데이터시트 보기 →EP4CGX50CF23C8N
✅ 드롭인✓ 재고 있음
$56.5 / 개
데이터시트 보기 →EP4CGX50CF27C8N
✅ 드롭인✓ 재고 있음
$125 / 개
데이터시트 보기 →EP4CGX30DF23C8N
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
EP4CGX30CF23C8N
✅ 드롭인✓ 재고 있음
$60.55 / 개
데이터시트 보기 →EP4CGX50DF23C8N 최대 정격 & 전기적 특성
| Family | Cyclone IV GX |
| Logic Elements | 49,888 |
| Configurable Logic Blocks (CLBs) | 3,118 |
| Process Technology | 60 nm |
| Core Supply Voltage | 1.2 V |
| Transceivers | Up to 8 channels, 3.125 Gbps |
| 패키지 | 484-ball FBGA (DF23) |
| Ball Pitch | 1.00 mm |
| Seated Height | 2.40 mm |
| Terminal Form | Ball |
| Operating Temperature Grade | Commercial (0C to +85C) |
| Configuration Modes | JTAG, Passive Serial, Active Serial |
| 실장 유형 | Surface Mount |
| MSL 레벨 | 3 (168 hours) |
| RoHS 상태 | Compliant |
EP4CGX50DF23C8N 484-ball fbga (df23) 핀 구성 가이드
EP4CGX50DF23C8N(484-ball fbga (df23) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP4CGX50DF23C8N.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP4CGX50DF23C8N 적합 용도: 7 애플리케이션s: Industrial Video Bridge and Image Processing, Low-End Wireless Backhaul Equipment, PCIe Endpoint Bridging, Motor Control and Industrial Automation, Consumer Display Controllers, Test and Measurement Instrumentation, Medical Imaging and Diagnostic Equipment.
Industrial Video Bridge and Image Processing
The EP4CGX50DF23C8N's 49,888 logic elements and 3.125 Gbps transceivers fit machine-vision and SDI video-bridge designs where parallel LVDS camera data must be serialized for backhaul over coax or fiber. The device's transceivers handle SDI at 270 Mbps to 1.485 Gbps with built-in 8B/10B framing, while parallel LVDS channels aggregate camera data into the fabric for image-processing pipelines.
추천
Low-End Wireless Backhaul Equipment
In small-cell and pico-cell backhaul designs the EP4CGX50DF23C8N provides CPRI/OBSAI framer logic plus protocol adaptation between the radio and the Ethernet backhaul. Its eight 3.125 Gbps transceivers support two CPRI links at 2.4576 Gbps with margin, while the 49,888 logic cells implement the framer, deframer, and Ethernet MAC glue. Static power is low enough for fanless outdoor enclosures at industrial temperature.
추천
PCIe Endpoint Bridging
The EP4CGX50DF23C8N implements a PCIe Gen1 x1 or x4 endpoint with its integrated transceivers, providing a low-cost bridge between PCIe and legacy parallel buses (PCI, Local Bus, DDR2). The Cyclone IV GX PCIe hard IP supports Gen1 at 2.5 Gbps per lane and x4 operation in the 484-FBGA package. Use this part for industrial PCIe cards, half-length embedded cards, and test equipment that needs a flexible front-end.
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Motor Control and Industrial Automation
Industrial servo and inverter designs use the EP4CGX50DF23C8N for multi-axis field-oriented control (FOC), encoder interface, and EtherCAT or SERCOS III communication via the transceivers. The 49,888 logic cells hold two or three FOC cores plus safety logic, while the transceivers carry real-time industrial Ethernet. The commercial 0C to +85C grade suits factory-floor cabinets.
추천
Consumer Display Controllers
DisplayWall, multi-screen signage, and projection systems use the EP4CGX50DF23C8N as a high-bandwidth video mixer. Its transceivers accept DisplayPort, HDMI, or SDI inputs at 2.97 Gbps, while parallel LVDS outputs drive multiple LCD panels at up to 1080p60. The Cyclone IV GX fabric is large enough to handle scaling, color conversion, and bezel compensation in real time.
추천
Test and Measurement Instrumentation
Bench-top instruments use the EP4CGX50DF23C8N for high-speed data acquisition, protocol decoding, and stimulus generation. Transceivers accept 3.125 Gbps SERDES data from ADC/DAC front-ends, while the fabric runs DSP, FFT, and triggering. The 484-FBGA package exposes enough LVDS pairs to drive DDR2/3 sample memory at 400 MHz. JTAG configuration simplifies lab updates.
추천
Medical Imaging and Diagnostic Equipment
Medical ultrasound carts, endoscopy processors, and patient-monitoring hubs use the EP4CGX50DF23C8N for beamforming, image reconstruction, and high-speed video pipelines. Transceivers accept multi-channel probe data at 1-2 Gbps per channel while the fabric runs the DSP. Commercial temperature grade is sufficient for controlled clinical environments; for portable field use, consider the industrial-grade option.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP4CGX50DF23C8N — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP4CGX50DF23C7N | EP4CGX50DF23C6N | EP4CGX50CF23C8N | EP4CGX30DF23C8N |
|---|---|---|---|---|---|
| Package | 484-ball FBGA (DF23) | 484-ball FBGA (DF23) - same | 484-ball FBGA (DF23) - same | 484-ball FBGA (F23) - same family, no transceivers | 484-ball FBGA (DF23) - same |
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel |
| Logic Elements | 49,888 | 49,888 | 49,888 | 49,888 | 29,440 |
| Transceivers | Up to 8 @ 3.125 Gbps | Up to 8 @ 3.125 Gbps | Up to 8 @ 3.125 Gbps | None | Up to 8 @ 3.125 Gbps |
| Speed Grade | C8 (-2 fastest) | C7 | C6 | C8 | C8 |
| Core Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
| Temperature Grade | Commercial (0C to +85C) | Commercial | Commercial | Commercial | Commercial |
| Process | 60 nm | 60 nm | 60 nm | 60 nm | 60 nm |
| Approx. Price @ 100 pcs (USD) | 65.10 | 55.20 | 48.30 | 58.40 | 54.20 |
주요 차별점
- Same package, different speed grade - true drop-in (vs EP4CGX50DF23C7N)
- Larger logic capacity at same speed grade (vs EP4CGX30DF23C8N)
- Transceivers included vs transceiver-less (vs EP4CGX50CF23C8N)
설계 노트
Estimated: at 100% utilization of 49,888 LEs, all eight 3.125 Gbps transceivers active, and 50% block RAM usage, total power for EP4CGX50DF23C8N is typically 1.5-2.0 W static + dynamic. Provide a 1.2 V core rail capable of at least 2.5 A with +/-3% regulation; add 100 nF X7R bypass on every VCCINT ball and 10 uF bulk per rail. VCCA (PLL analog) must be filtered through a ferrite bead and decoupled with 10 uF + 100 nF to keep PLL jitter within spec.
Estimated: the 484-ball FBGA at 1.0 mm pitch requires a 4- or 6-layer PCB with microvia stack-up if you want to escape all power and ground balls cleanly. Use Intel's reference symbol and footprint files from the Quartus II/Prime pin-out files. Differential transceiver pairs must be routed with 100 ohm +/-10% impedance and matched within 5 mils; keep length matching on TX and RX pairs to 0.127 mm (5 mils) for 3.125 Gbps operation.
Series coupling capacitors on transceiver TX pairs must be 0402-size 100 nF X7R with 0402 pads placed within 100 mils of the FPGA ball. AC-coupling capacitors must be rated for the protocol's DC bias voltage (typically 1.5-2.5 V DC blocked). Reference Intel Cyclone IV GX transceiver AN 581 for eye-diagram compliance and recommended PCB stack-up. Do not route any other signals across the transceiver region on inner layers; keep it as a clean reference plane transition.
Estimated: common pitfalls with the EP4CGX50DF23C8N include (1) powering VCCIO for the JTAG/configuration bank before VCCINT - this can trigger POR issues and prevent configuration; (2) leaving MSEL[2:0] pins floating - they must be strapped high or low to select the configuration mode; (3) using the CF23 pinout file with a DF23 design, which silently disables the transceivers. Always double-check pinout against the package-specific .qsf file from Intel's pin-out generator.
Estimated: at full load (2 W typical), the 484-FBGA junction-to-ambient thermal resistance is approximately 18-22 C/W on a 4-layer JEDEC test board. Add 4 thermal balls (or a thermal pad) to the PCB and connect them to an internal ground plane with thermal vias (0.3 mm drill, 1.2 mm pitch, 9 vias minimum). For chassis-mounted designs with restricted airflow, derate utilization to 70% to keep junction below 85C.
규정 준수 정보
RoHS compliant per Altera/Intel product page. Not AEC-Q100 qualified - this is a commercial-grade FPGA. For automotive applications use the EP4CGX50DF23I8N industrial-temperature variant.
