EP4CGX75CF23C7N - Cyclone IV GX FPGA, 75K LE, 484-BGA | Intel
부품 번호: EP4CGX75CF23C7N ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $122 | $122.00 |
| 10 | $110.5 | $1,105.00 |
| 100 | $95 | $9,500.00 |
| 500 | $82.4 | $41,200.00 |
| 1,000 | $71.2 | $71,200.00 |
EP4CGX75CF23C7N 개요
An FPGA (Field-Programmable Gate Array) is a semiconductor device built from an array of configurable logic blocks (CLBs), programmable interconnect, embedded memory (block RAM), and dedicated hard IP such as transceivers, PLLs, and DSP blocks. FPGAs sit in the broader taxonomy: programmable logic -> logic IC -> integrated circuit -> semiconductor. Unlike an ASIC, an FPGA's function is defined at power-up by a configuration bitstream loaded from external flash, enabling rapid prototyping, in-field upgrades, and hardware revision without respin. Within Intel's portfolio, Cyclone IV GX is the low-power mid-range tier that adds high-speed serial transceivers for protocols like PCI Express Gen1, Gigabit Ethernet, and Serial RapidIO.
Key features of the EP4CGX75CF23C7N include 73,920 logic elements, approximately 4.4 Mbits of embedded RAM (M9K blocks), 290 user I/O pins, up to 8 transceiver channels at data rates up to 3.125 Gbps, 4 PLLs, and 2 hard memory controllers. The device operates from a core supply of 1.16 V to 1.24 V (nominal 1.2 V) with I/O banks supporting multiple I/O standards (LVDS, LVTTL, LVCMOS, SSTL, HSTL). It supports commercial temperature grade (0 °C to 85 °C) per the C7N suffix and offers JTAG-based configuration via Active Serial (AS), Passive Serial (PS), or Fast Passive Parallel (FPP) modes.
The Cyclone IV GX architecture pairs a sea-of-LAB fabric with column-based M9K memory blocks and row-based embedded transceivers. Hard IP includes transceiver channels with embedded PCS (physical coding sublayer) for PCIe and GbE, dedicated PLL blocks for clock synthesis, and DSP blocks (18x18 multipliers) for arithmetic. Compared with Cyclone III, the Cyclone IV GX achieves lower static power through a 60 nm process and adds hardened transceivers, while sharing the same Quartus II design flow that engineers already know.
Typical applications for the EP4CGX75CF23C7N include industrial video surveillance with on-board image processing, low-cost PCI Express Gen1 endpoint cards, gigabit Ethernet bridge/mux designs, motor control and factory automation, broadcast video processing, software-defined radio front-ends (digital baseband), and portable medical imaging. The integrated 3.125 Gbps transceivers enable designers to add a small-form-factor PCIe or GbE interface without external PHY chips, reducing BOM cost and PCB area.
When designing with this device, plan power sequencing for core (1.2 V), PLL analog (2.5 V), and transceiver supplies (1.2 V / 2.5 V / 3.3 V) per the pin connection guidelines, and provide a proper decoupling network. The 484-BGA F23 package requires careful PCB stack-up and microvia technology for reliable assembly, especially on the transceiver balls that carry multi-GHz signals.
This page synthesizes the official Intel Cyclone IV GX device handbook, current distributor pricing, drop-in device-tree alternatives, and PCB design notes not aggregated elsewhere, giving procurement and design engineers a single-source reference for EP4CGX75CF23C7N selection.
드롭인 대체품: EP4CGX75CF23C7N — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP4CGX75CF23C7N (동일 폼 팩터 및 풋프린트) — 차이점: Package, Operating Temperature, RoHS Status, Speed Grade, Process Technology.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP4CGX75CF23C7
✅ 드롭인✓ 재고 있음
$60.5 / 개
데이터시트 보기 →EP4CGX75CF23C6N
✅ 드롭인✓ 재고 있음
$99 / 개
데이터시트 보기 →EP4CGX75CF23C6
✅ 드롭인✓ 재고 있음
$62.95 / 개
데이터시트 보기 →EP4CGX50CF23C7N
✅ 드롭인✓ 재고 있음
$110.5 / 개
데이터시트 보기 →EP4CGX150CF23C7N
✅ 드롭인✓ 재고 있음
$138.95 / 개
데이터시트 보기 →EP4CGX75CF23C7N 최대 정격 & 전기적 특성
| Series | Cyclone IV GX |
| Logic Elements | 73,920 |
| Embedded Memory (bits) | 4,257,792 |
| Maximum User I/O Pins | 290 |
| Number of Logic Array Blocks (LABs) | 4,500 |
| Total Transceiver Channels | 8 (up to 3.125 Gbps) |
| Number of PLLs | 4 |
| Hard Memory Controllers | 2 |
| Core Supply Voltage | 1.16 V to 1.24 V (nominal 1.2 V) |
| 동작 온도 | 0 °C to 85 °C (commercial) |
| 패키지 | 484-ball BGA (F23, 23 x 23 mm) |
| 실장 유형 | Surface Mount |
| Process Technology | 60 nm low-power CMOS |
| Configuration Modes | AS, PS, FPP, JTAG |
| RoHS 상태 | Compliant |
EP4CGX75CF23C7N 484-ball bga (f23, 23 x 23 mm) 핀 구성 가이드
EP4CGX75CF23C7N(484-ball bga (f23, 23 x 23 mm) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP4CGX75CF23C7N.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP4CGX75CF23C7N 적합 용도: 6 애플리케이션s: Industrial Video Surveillance, PCI Express Gen1 Endpoint Cards, Motor Control and Factory Automation, Broadcast Video Processing, Software-Defined Radio Digital Baseband, Portable Medical Imaging.
Industrial Video Surveillance
The EP4CGX75CF23C7N fits industrial video surveillance because its 73,920 logic elements and embedded DSP blocks can compress and process HD video streams in real time. The eight 3.125 Gbps transceivers let the device drive multiple gigabit Ethernet cameras or aggregate multiple sensor streams into a single PCIe uplink. Industrial temperature variant (I7N suffix) supports factory environments. Compared with ASSP video processors, the FPGA allows field upgrades as new codecs emerge, extending product life without hardware changes.
추천
PCI Express Gen1 Endpoint Cards
The EP4CGX75CF23C7N's 73,920 logic elements plus hardened PCIe Gen1 IP cores enable low-cost PCIe endpoint cards for industrial and embedded applications. The 3.125 Gbps transceivers handle the PCIe Gen1 physical layer natively, eliminating external PHY chips. 290 user I/O pins expose ample sideband GPIO for sensor aggregation. Compared with PCIe ASSP bridge chips, the Cyclone IV GX implementation lets designers add custom logic alongside the PCIe interface, such as proprietary protocol engines or data pre-processing.
추천
Motor Control and Factory Automation
The EP4CGX75CF23C7N serves motor control and factory automation designs because its 4 PLLs generate the precise multi-axis PWM clocks and its DSP blocks execute field-oriented control (FOC) algorithms at high sample rates. The 290 I/O pins support many encoder interfaces (QEP, Hall, SSI, resolver) and the 60 nm process keeps static power low. Industrial temperature grade (I7N) operates reliably in factory cabinets up to 100 C. Designers benefit from in-system programmability to update control firmware on deployed units.
추천
Broadcast Video Processing
Broadcast video processing benefits from the EP4CGX75CF23C7N's 73,920 logic elements and DSP bandwidth, which handle SD/HD video scaling, deinterlacing, and format conversion in real time. The high I/O count supports multiple parallel video ports (BT.1120, DVI, HDMI bridge) and the 3.125 Gbps transceivers can drive SDI links. Compared with fixed-function broadcast ASICs, the FPGA implementation adapts to evolving codecs (AVC, HEVC bridging) via firmware update, prolonging equipment service life.
추천
Software-Defined Radio Digital Baseband
The EP4CGX75CF23C7N targets software-defined radio digital baseband designs where 73,920 logic elements and DSP blocks implement digital downconversion, channelization, and modulation/demodulation. The 3.125 Gbps transceivers digitize IF or directly sample RF front-ends, while 290 user I/O connect DAC/ADC interfaces. Compared with discrete DSP+ASIC SDR platforms, the FPGA implementation consolidates PHY and baseband in one device, lowering BOM and PCB complexity. Industrial temperature variant supports outdoor deployment.
추천
Portable Medical Imaging
The EP4CGX75CF23C7N fits portable medical imaging because its 60 nm low-power process keeps static power low while 73,920 logic elements implement ultrasound beamforming, image reconstruction, and on-the-fly preprocessing. The 8 transceivers aggregate multiple transducer array data streams and the 290 user I/O connect to ADC front-ends. Compared with DSP-only ultrasound solutions, the FPGA implementation reduces latency by 3-5x, enabling real-time imaging in portable cart or handheld form factors. Commercial temperature (0-85 C) suits clinical environments.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP4CGX75CF23C7N — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP4CGX75CF23C7 | EP4CGX75CF23C6N | EP4CGX75CF23C6 | EP4CGX50CF23C7N | EP4CGX150CF23C7N |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 484-BGA (F23) | 484-BGA (F23) - same | 484-BGA (F23) - same | 484-BGA (F23) - same | 484-BGA (F23) - same | 484-BGA (F23) - same |
| Logic Elements | 73,920 | 73,920 (same) | 73,920 (same) | 73,920 (same) | 49,888 (-32%) | 149,760 (+103%) |
| Embedded Memory (bits) | 4,257,792 | 4,257,792 (same) | 4,257,792 (same) | 4,257,792 (same) | 2,764,800 (-35%) | 6,635,520 (+56%) |
| Max User I/O | 290 | 290 (same) | 290 (same) | 290 (same) | 290 (same) | 290 (same) |
| Speed Grade | C7 (fastest) | C7 (same) | C6 (slower) | C6 (slower) | C7 (same) | C7 (same) |
| Transceivers (3.125 Gbps) | 8 | 8 (same) | 8 (same) | 8 (same) | 8 (same) | 8 (same) |
| Operating Temperature | 0 to 85 C (commercial) | 0 to 85 C (same) | 0 to 85 C (same) | 0 to 85 C (same) | 0 to 85 C (same) | 0 to 85 C (same) |
| Unit Price (qty-1) | USD 122.00 | USD 118.00 | USD 105.00 | USD 100.00 | USD 75.00 | USD 220.00 |
주요 차별점
- Highest transceiver count at the 75K LE density tier (vs EP4CGX50CF23C7N)
- Fastest speed grade available in the F23 footprint (vs EP4CGX75CF23C6N)
- Lead-free RoHS-compliant terminal finish (vs EP4CGX75CF23C7 (no N))
설계 노트
Plan power sequencing for VCCINT (1.2 V), VCCA (2.5 V PLL analog), and VCCD_PLL (1.2 V) with VCCIO banks at 1.2/1.5/1.8/2.5/3.3 V per bank. The transceiver channels also require VCCHIP (1.2 V/2.5 V) and VCCE (1.2 V) rails. Use the Intel pin connection guidelines to determine minimum rail groupings and ramp-order requirements. Estimated: total static power for the EP4CGX75CF23C7N with 8 transceivers idle is approximately 1.5-2 W at commercial temperature.
The 484-BGA F23 package has 1.0 mm ball pitch, requiring a PCB stack-up with microvia (laser-drilled) technology. Use a 6-8 layer stack-up with dedicated ground and power planes adjacent to the BGA breakout layer. Matched-length routing is mandatory for the transceiver balls; route as 100 ohm differential pairs with length matching within 5 mils (0.127 mm). Use the Intel Cyclone IV GX PCB design guidelines document for via-in-pad recommendations.
Do not exceed the absolute maximum junction temperature of 125 C; commercial-grade devices have a maximum ambient of 85 C, which corresponds to a derated junction temperature with adequate airflow. Leave at least 5 mm of clearance around the BGA for via breakout. Confirm the configuration mode (AS/PS/FPP/JTAG) is consistent with the chosen EPCS or EPCQ flash device. Verify the bitstream compression setting matches the Quartus II project options. Estimated: with no airflow, the F23 package dissipates approximately 2-3 W before thermal shutdown risk.
Place decoupling capacitors as close to each power pin as possible, with 0.1 uF X7R ceramics for high-frequency noise and 10 uF bulk capacitors per power rail. Place transceiver channel reference resistors and AC-coupling capacitors within 5 mm of the corresponding balls. Use a continuous ground pour on layer 2 beneath the FPGA to provide a low-impedance return path for high-speed transceivers.
규정 준수 정보
RoHS and lead-free status confirmed by N suffix per Altera/Intel part numbering convention. AEC-Q100 not applicable for FPGAs as these are commercial/industrial-grade components.
