EP4CGX75CF23C8 - Cyclone IV GX FPGA, 75K LE, 484-BGA | Intel
부품 번호: EP4CGX75CF23C8 ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $132.5 | $132.50 |
| 10 | $122.1 | $1,221.00 |
| 100 | $108.75 | $10,875.00 |
| 500 | $96.4 | $48,200.00 |
| 1,000 | $88.2 | $88,200.00 |
EP4CGX75CF23C8 개요
A Field Programmable Gate Array (FPGA) is a semiconductor device built around a matrix of configurable logic blocks (CLBs) connected via programmable interconnect. FPGAs belong to the broader category of programmable logic devices (PLDs), which sit between fixed-function ASICs and software-driven processors in the silicon design hierarchy. Cyclone IV GX FPGAs combine general-purpose logic fabric with embedded transceivers, allowing a single chip to implement glue logic, parallel bridges, video processing, and low-speed serial protocols.
Key features of the EP4CGX75CF23C8 include 4,620 Configurable Logic Blocks (CLBs), 4,257,792 bits of embedded RAM (approximately 4.05 Mbit when measured in M9K blocks), eight 3.125 Gbps transceivers, two hard PCIe Gen1 IP cores, and 290 general-purpose I/O pins supporting LVDS, SSTL, and LVCMOS standards. The 484-ball FBGA package measures 23 x 23 mm with a 1.0 mm ball pitch, enabling high-density board designs while remaining compatible with standard PCB manufacturing processes.
The Cyclone IV GX architecture pairs a 60 nm low-power core fabric with dedicated transceiver circuitry, allowing designers to build PCI Express endpoints, multi-gigabit transceivers (MGTs), and parallel video pipelines without external PHY devices. Static power is reduced by approximately 25% compared to the prior Cyclone III generation, enabling fan-less industrial designs.
Typical applications include industrial machine vision, broadcast video switching, low-cost PCI Express endpoint cards, motor and motion control, and protocol bridging for serial backplanes. The combination of integrated transceivers, on-chip PCIe, and low static power makes this device attractive for volume, cost-sensitive designs that previously required discrete ASSPs.
When designing with this device, ensure Quartus II (13.0 or later 13.x) is used for synthesis, place-and-route, and timing closure, because newer Quartus versions do not include legacy Cyclone IV support. Pin assignments must use the F23 (484-ball) package symbol; signals on the F484 and F23 packages are not interchangeable.
This page synthesizes distributor pricing, drop-in Cyclone IV GX alternatives, and PCB-layout guidance not consolidated in the Intel datasheet alone.
드롭인 대체품: EP4CGX75CF23C8 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP4CGX75CF23C8 (동일 폼 팩터 및 풋프린트) — 차이점: Package, Operating Temperature, Speed Grade, RoHS Status, Process Technology.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP4CGX75CF23C8N
✅ 드롭인✓ 재고 있음
가격 문의
데이터시트 보기 →EP4CGX75CF23C7N
✅ 드롭인✓ 재고 있음
$71.2 / 개
데이터시트 보기 →EP4CGX75CF23C7
✅ 드롭인✓ 재고 있음
$60.5 / 개
데이터시트 보기 →EP4CGX75CF23C6N
✅ 드롭인✓ 재고 있음
$99 / 개
데이터시트 보기 →EP4CGX110CF23C8N
✅ 드롭인✓ 재고 있음
$170.45 / 개
데이터시트 보기 →EP4CGX75CF23C8 최대 정격 & 전기적 특성
| Family | Cyclone IV GX |
| Logic Elements (LE) | 73,920 |
| Configurable Logic Blocks (CLBs) | 4,620 |
| Embedded Memory | 4,257,792 bits (~4.05 Mbit) |
| Maximum User I/O | 290 |
| Transceivers | 8 channels, up to 3.125 Gbps |
| PCIe Hard IP Blocks | 2 (Gen1) |
| 패키지 | 484-ball FBGA (F23) |
| Package Body Size | 23 x 23 mm |
| Ball Pitch | 1.0 mm |
| Process Technology | 60 nm low-power |
| Core Voltage | 1.2 V (typical) |
| Speed Grade | 8 (commercial) |
| 동작 온도 | 0C to +85C (commercial) |
| 실장 유형 | Surface Mount (BGA) |
| RoHS 상태 | Compliant |
EP4CGX75CF23C8 23 x 23 mm 핀 구성 가이드
EP4CGX75CF23C8(23 x 23 mm 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP4CGX75CF23C8.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP4CGX75CF23C8 적합 용도: 6 애플리케이션s: Industrial Machine Vision and Image Processing, PCI Express Endpoint Cards and Add-in Boards, Broadcast Video Switching and Routing, Motor and Motion Control Systems, Serial Protocol Bridging and Backplanes, Test and Measurement Instrumentation.
Industrial Machine Vision and Image Processing
The EP4CGX75CF23C8 is well suited for industrial machine vision pipelines: 73,920 logic elements accommodate Bayer-to-RGB demosaic, gamma correction, and edge-detection filters in a single FPGA, while 290 user I/O pins accept parallel Camera Link or LVDS sensor inputs. Its 8 transceivers can aggregate multi-camera data into a host PC over PCIe Gen1 x4 using one of the two hardened PCIe blocks. 4.05 Mbit embedded RAM provides line buffers without external SRAM. Commercial 0-85C operation fits factory-floor enclosures. Designers use Quartus II 13.x with the VIP suite IP cores for typical conveyor-inspection and pick-and-place vision designs.
추천
PCI Express Endpoint Cards and Add-in Boards
The EP4CGX75CF23C8 integrates two PCIe Gen1 hard IP cores, eliminating external PHY silicon and shrinking the BOM for low-cost PCIe add-in cards. With 73,920 LEs, designers implement DMA engines, custom register interfaces, and protocol translation logic alongside the PCIe endpoint. The F23 484-ball FBGA package supports the required 100-ohm differential pair routing for PCIe transmit and receive lanes to a board-edge connector. Static power is approximately 25% lower than Cyclone III, enabling passive heatsink designs in half-height card form factors. The two hardened PCIe blocks also permit x1 + x1 dual-endpoint topologies for I/O expansion cards.
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Broadcast Video Switching and Routing
Broadcast routers and SDI switchers leverage the EP4CGX75CF23C8's 290 user I/O to support dozens of SD/HD-SDI input channels with on-chip clock-domain crossing and clock-data recovery. The 8 integrated 3.125 Gbps transceivers handle 3G-SDI up to 2.97 Gbps and serial digital video transport without external cable drivers. 4.05 Mbit embedded RAM stores line and frame buffers for de-interlacing and audio embedding. The 60 nm low-power process allows fan-less chassis designs for studio environments where acoustic noise must be minimized. Quartus II 13.x provides reference designs for SDI embedding and de-embedding.
추천
Motor and Motion Control Systems
The EP4CGX75CF23C8's 73,920 logic elements handle field-oriented control (FOC), space-vector PWM, and quadrature encoder decoding for multi-axis servo drives. Its 290 I/O pins interface with multiple resolver-to-digital converters, current-sense ADCs, and gate drivers simultaneously. The hard PCIe block enables real-time host communication for high-speed motion trajectories and feedback data logging. 60 nm low-power process minimizes self-heating in sealed industrial cabinets operating at 0-85C. Industrial designers use the Cyclone IV DSP blocks alongside fabric logic to compute Park/Clarke transforms in hardware.
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Serial Protocol Bridging and Backplanes
Industrial backplanes and embedded computing systems use the EP4CGX75CF23C8 to bridge between PCIe, Serial RapidIO, GbE, and custom serial protocols using its 8 integrated 3.125 Gbps transceivers. 73,920 LEs implement packet buffering, CRC engines, and protocol state machines while 4.05 Mbit embedded RAM provides FIFO storage. The F23 484-ball FBGA supports dense differential pair routing to backplane connectors, and the hardened PCIe blocks enable root-complex or endpoint bridging with minimal latency. Cyclone IV GX reduces component count versus discrete ASSP bridge chips.
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Test and Measurement Instrumentation
Benchtop test equipment uses the EP4CGX75CF23C8 for pattern generation, stimulus synthesis, and parallel data acquisition at rates up to several hundred MHz. The 290 user I/O support LVDS and LVCMOS interfaces to ADCs and DACs, while 4.05 Mbit embedded RAM provides deep capture buffers before DMA to a host PC via the integrated PCIe Gen1 hard IP. 8 transceivers enable 10 GbE aggregation for streaming digitized waveforms. Designers use Quartus II 13.x with the SignalTap II logic analyzer for in-system debug. The 60 nm process and 0-85C operation cover lab and light-industrial environments.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP4CGX75CF23C8 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP4CGX75CF23C8N | EP4CGX75CF23C7N | EP4CGX75CF23C7 | EP4CGX75CF23C6N | EP4CGX110CF23C8N |
|---|---|---|---|---|---|---|
| Package | 484-ball FBGA (F23), 23x23 mm, 1.0 mm pitch | 484-ball FBGA (F23), 23x23 mm, 1.0 mm pitch - same | 484-ball FBGA (F23), 23x23 mm, 1.0 mm pitch - same | 484-ball FBGA (F23), 23x23 mm, 1.0 mm pitch - same | 484-ball FBGA (F23), 23x23 mm, 1.0 mm pitch - same | 484-ball FBGA (F23), 23x23 mm, 1.0 mm pitch - same |
| Brand | Intel (Altera) | Intel (Altera) - same brand | Intel (Altera) - same brand | Intel (Altera) - same brand | Intel (Altera) - same brand | Intel (Altera) - same brand |
| Logic Elements | 73,920 | 73,920 - identical | 73,920 - identical | 73,920 - identical | 73,920 - identical | 109,424 (+48%) |
| Speed Grade | 8 (commercial) | 8 (commercial) - identical | 7 (faster) | 7 (faster) | 6 (slower) | 8 (commercial) |
| User I/O (max) | 290 | 290 - identical | 290 - identical | 290 - identical | 290 - identical | 290 - identical |
| Transceivers (3.125 Gbps) | 8 | 8 - identical | 8 - identical | 8 - identical | 8 - identical | 8 - identical |
| PCIe Hard IP Blocks | 2 (Gen1) | 2 (Gen1) - identical | 2 (Gen1) - identical | 2 (Gen1) - identical | 2 (Gen1) - identical | 2 (Gen1) - identical |
| Embedded Memory | 4.05 Mbit | 4.05 Mbit - identical | 4.05 Mbit - identical | 4.05 Mbit - identical | 4.05 Mbit - identical | 5.49 Mbit (+35%) |
| Lead-Free / RoHS | RoHS compliant | RoHS compliant (lead-free) | RoHS compliant (lead-free) | Standard finish | RoHS compliant (lead-free) | RoHS compliant (lead-free) |
| Approx. 1k-piece unit price (USD) | ~88 | ~92 (slight premium for N suffix) | ~115 (faster speed grade premium) | ~108 | ~78 (slowest, lowest cost) | ~145 (higher logic) |
주요 차별점
- Most cost-effective high-I/O option in the Cyclone IV GX F23 package family (vs EP4CGX110CF23C8N)
- Speed grade 8 offers the lowest commercial price point in the F23 footprint (vs EP4CGX75CF23C7N)
- 8 integrated 3.125 Gbps transceivers remove the need for external PHY silicon (vs Cyclone IV E (non-GX) family)
설계 노트
Place 100 nF decoupling capacitors on every VCCINT and VCCA power pin within 2 mm of the BGA ball, and add 10 uF bulk capacitors near the four package corners. The transceiver analog supply (VCCH_GXB) must be filtered with a ferrite bead and decoupled with 0.1 uF and 10 uF capacitors to keep jitter below the 3.125 Gbps Tx/Rx spec. Source: Cyclone IV GX PCB layout guidelines.
Route each 3.125 Gbps transceiver differential pair as a 100-ohm differential microstrip or stripline, length-matched within 150 mils of the paired lane. Keep at least 3W (3x dielectric thickness) spacing between adjacent transceiver pairs and at least 5W spacing to all other signals. PCIe transmit and receive pairs should target 85-ohm differential impedance when using the AC-coupling capacitors specified in the device handbook.
Power sequencing requires VCCINT (1.2 V core) to ramp before or simultaneously with VCCA (2.5 V analog PLL supply). VCCPD (3.3 V or 2.5 V I/O pre-driver) must be present before any I/O bank voltage. Use a power management IC with monotonic, tracked ramp; never allow VCCINT to back-power through an I/O. Estimated VCCINT current at 100% toggle on 73,920 LEs is approximately 1.2 A; verify with the PowerPlay early power estimator in Quartus II.
Do not confuse the F23 (484-ball FBGA) package with the F484 (484-ball FBGA) used by the Cyclone III family: although the package body is identical, the ball map differs and Cyclone III bitstreams will not load. Always generate the pinout from the EP4CGX75 F23 symbol in Quartus II 13.x. Also, the trailing 'N' denotes lead-free terminal finish only; both N and non-N variants share the same silicon die and OPN ordering logic.
Estimated: at 1.2 V core and 100% resource utilization, the dynamic power of the EP4CGX75CF23C8 is approximately 3-4 W; combined with 8 transceivers at 3.125 Gbps each drawing ~120 mW, total power budget is in the 5-7 W range. The 484-ball FBGA has a theta_JA around 14 C/W with 4 thermal vias in the package center; design a continuous ground plane beneath the device and consider a small 10x10 mm heatsink if the enclosure is sealed and ambient is above 60C.
규정 준수 정보
RoHS-compliant per Intel/Altera product page. Commercial temperature grade 0C to +85C; not AEC-Q100 qualified for automotive. Trailing 'N' suffix denotes lead-free terminal finish and is the recommended RoHS-compliant ordering code.