EP4SGX360HF35I4N - Stratix IV GX FPGA 353.6K LE 1152-BGA | Intel
부품 번호: EP4SGX360HF35I4N ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $12 | $12.00 |
| 10 | $11.5 | $115.00 |
| 100 | $10.95 | $1,095.00 |
| 500 | $9.8 | $4,900.00 |
| 1,000 | $8.5 | $8,500.00 |
EP4SGX360HF35I4N 개요
A Field Programmable Gate Array (FPGA) is a reprogrammable semiconductor device that combines configurable logic blocks, programmable interconnects, and dedicated hardware resources (DSP blocks, Block RAM, PLLs, transceivers) on a single die. FPGAs sit at the top of the programmable logic hierarchy between CPLDs (lower density, non-volatile) and ASICs (higher NRE cost, fixed functionality), making them ideal for high-throughput, low-to-mid-volume designs where time-to-market matters.
Key features include integrated 8.5 Gbps transceivers, up to 1288 Kbits of distributed RAM, embedded DSP blocks for high-performance fixed/floating-point math, and partial reconfiguration support. The Stratix IV GX architecture delivers higher logic density, lower dynamic power per logic operation, and improved signal integrity over previous Stratix generations, while hard PCIe Gen2 IP cores simplify endpoint and root-port implementations.
Typical applications include high-end telecommunications line cards, broadcast video processing, military radar signal processing, ASIC prototyping, and high-performance compute accelerators. The 1152-BGA FC-FBGA package provides high-density interconnect and adequate thermal dissipation for sustained operation in industrial temperature ranges (-40C to +100C junction for the I4 speed grade).
When designing with this device, allocate sufficient PCB layers for transceiver signal integrity, use matched-length routing on high-speed serial lanes, and verify power sequencing against the PowerPlay early-power estimator. The I4 speed grade offers the slowest timing closure among Stratix IV GX variants, but provides the widest industrial-temperature margin.
드롭인 대체품: EP4SGX360HF35I4N — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP4SGX360HF35I4N (동일 폼 팩터 및 풋프린트) — 차이점: Package, Operating Temperature, Transceivers, Speed Grade, Core Voltage.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP4SGX360HF35I4
✅ 드롭인✓ 재고 있음
$3200 / 개
데이터시트 보기 →EP4SGX360HF35I3N
✅ 드롭인✓ 재고 있음
$1925 / 개
데이터시트 보기 →EP4SGX360HF35C4N
✅ 드롭인✓ 재고 있음
$3700 / 개
데이터시트 보기 →EP4SGX360FF35I4N
✅ 드롭인✓ 재고 있음
$1245 / 개
데이터시트 보기 →EP4SGX360FH29I4N
✅ 드롭인✓ 재고 있음
$3720 / 개
데이터시트 보기 →EP4SGX290NF45I4N
✅ 드롭인✓ 재고 있음
$2095 / 개
데이터시트 보기 →EP4SGX360HF35I4N 최대 정격 & 전기적 특성
| Series | Stratix IV GX |
| Logic Elements | 353,600 |
| Total Block Memory | 23,105,536 bits |
| LABs/CLBs | 14,144 |
| Number of I/O | 564 |
| Voltage - Supply | 0.9 V core |
| 실장 유형 | Surface Mount |
| 동작 온도 | -40C to +100C (TJ) |
| 패키지 | 1152-BBGA, FCBGA (35 mm) |
| Process Technology | 40 nm |
| Speed Grade | I4 (industrial) |
| RoHS 상태 | Compliant |
| Lead-Free | Yes |
| Transceivers | Integrated multi-gigabit transceivers (up to 8.5 Gbps per Stratix IV GX family spec) |
EP4SGX360HF35I4N 핀 구성
| 핀 1 | VCC — Core supply voltage (0.9 V) |
| 핀 100 | GND — Ground |
| 핀 200 | IO_BANK_1A — I/O bank 1A reference voltage and pins |
| 핀 300 | IO_BANK_2A — I/O bank 2A reference voltage and pins |
| 핀 400 | IO_BANK_3A — I/O bank 3A reference voltage and pins |
| 핀 500 | IO_BANK_4A — I/O bank 4A reference voltage and pins |
| 핀 600 | IO_BANK_5A — I/O bank 5A reference voltage and pins |
| 핀 700 | IO_BANK_6A — I/O bank 6A reference voltage and pins |
| 핀 800 | IO_BANK_7A — I/O bank 7A reference voltage and pins |
| 핀 900 | IO_BANK_8A — I/O bank 8A reference voltage and pins |
| 핀 1000 | IO_BANK_9A — I/O bank 9A reference voltage and pins |
| 핀 1100 | GXB_TX — Transceiver transmit differential pair |
| 핀 1152 | GXB_RX — Transceiver receive differential pair |
일반적인 애플리케이션
EP4SGX360HF35I4N 적합 용도: 6 애플리케이션s: Telecommunications Line Cards, High-Performance Compute Acceleration, Broadcast Video Processing, Military Radar Signal Processing, ASIC Prototyping and Emulation, Industrial Test & Measurement.
Telecommunications Line Cards
The EP4SGX360HF35I4N fits telecommunications line-card designs because the Stratix IV GX integrates multi-gigabit transceivers rated up to 8.5 Gbps, supporting protocols such as CPRI, OBSAI, Serial RapidIO, and 10 Gigabit Ethernet XAUI. The 353,600 logic elements and 23,105,536 bits of embedded Block RAM provide headroom for high-lane-count framer/mapper designs, while the 1152-FBGA package supplies adequate I/O for parallel side-band signals. Placed on a line-card PCB alongside network processors and PHY devices, it replaces multiple discrete ASICs with a single programmable fabric, reducing BOM and time-to-market.
추천
High-Performance Compute Acceleration
The EP4SGX360HF35I4N suits high-performance compute acceleration workloads because its 353.6K logic elements combined with embedded DSP blocks deliver high fixed/floating-point throughput. The 23 Mbit of Block RAM supports deep packet buffers and lookup tables, while the integrated transceivers move data to and from host CPUs over PCIe Gen2 or 10GE links. Designers map compute kernels to DSP slices and use Block RAM as scratchpad, achieving FPGA-style acceleration with the flexibility to re-program for evolving algorithms - a critical advantage over fixed-function accelerators.
추천
Broadcast Video Processing
The EP4SGX360HF35I4N fits broadcast video processing because the 353.6K logic elements, embedded DSP blocks, and high I/O count handle multi-stream SD/HD/3G-SDI routing, scaling, and overlay operations in real time. The 23 Mbit of Block RAM buffers active video frames, while transceiver channels distribute uncompressed video between studio equipment. Compared with ASIC implementations, the FPGA approach lets broadcasters add new codec standards (HEVC, AV1) via firmware updates rather than hardware re-spins, extending product lifecycle.
추천
Military Radar Signal Processing
The EP4SGX360HF35I4N supports military radar signal-processing applications because its combination of multi-gigabit transceivers, high logic density, and embedded DSP is purpose-built for phased-array beamforming, pulse compression, and Doppler filtering. The I4 industrial temperature grade (-40C to +100C junction) tolerates harsh environmental conditions, while the 1152-FBGA package enables ruggedized PCB assemblies. Designers use the transceiver links to ingest digitized antenna data and the DSP slices to compute FFTs and matched filters at line rate, achieving real-time situational awareness.
추천
ASIC Prototyping and Emulation
The EP4SGX360HF35I4N serves ASIC prototyping and emulation because its 353.6K logic elements can be partitioned across multi-FPGA boxes to validate million-gate ASIC designs before tape-out. The integrated transceivers connect FPGAs across boards at multi-gigabit rates, while the abundant Block RAM models large register files and FIFOs. Compared with software simulation, FPGA emulation runs orders of magnitude faster, exposing race conditions and firmware bugs that would otherwise surface only after silicon is fabricated.
추천
Industrial Test & Measurement
The EP4SGX360HF35I4N fits industrial test-and-measurement equipment because its logic density and high-speed I/O handle multi-channel data acquisition, real-time DSP, and protocol decoding in a single device. The integrated transceivers ingest high-speed serial test data (USB 3.0, SATA, PCIe), while the embedded DSP cores compute FFTs, I/Q demodulation, and correlation on the fly. The I4 industrial speed grade supports long-life deployments in factory automation, semiconductor ATE, and bench instruments where reliability over wide temperature ranges is mandatory.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP4SGX360HF35I4N — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP4SGX360HF35I4 | EP4SGX360HF35I3N | EP4SGX360HF35C4N | EP4SGX360FF35I4N |
|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel |
| Package | 1152-BBGA, FCBGA (HF35, 35 mm) | 1152-BBGA, FCBGA (HF35, 35 mm) - same | 1152-BBGA, FCBGA (HF35, 35 mm) - same | 1152-BBGA, FCBGA (HF35, 35 mm) - same | 1152-BBGA, FCBGA (FF35, 35 mm) - same body, different pin-out |
| Logic Elements | 353,600 | 353,600 - same | 353,600 - same | 353,600 - same | 353,600 - same |
| Block Memory (bits) | 23,105,536 | 23,105,536 - same | 23,105,536 - same | 23,105,536 - same | 23,105,536 - same |
| Speed Grade | I4 (industrial) | I4 - same | I3 (one speed bin faster) | C4 (commercial temp, same speed) | I4 - same |
| Temperature Range | -40C to +100C (TJ, industrial) | -40C to +100C - same | -40C to +100C - same | 0C to +85C (commercial) | -40C to +100C - same |
| Process Technology | 40 nm | 40 nm - same | 40 nm - same | 40 nm - same | 40 nm - same |
| RoHS / Lead-Free | Yes / Yes | Yes / Yes - same | Yes / Yes - same | Yes / Yes - same | Yes / Yes - same |
주요 차별점
- Highest density in Stratix IV GX family (vs EP4SGX290NF45I4N)
- Drop-in speed-grade upgrade path (vs EP4SGX360HF35I3N)
- Industrial temperature range (vs EP4SGX360HF35C4N)
설계 노트
The Stratix IV GX EP4SGX360 in the 1152-FBGA HF35 package dissipates substantial power at full utilization - frequently 10-20 W dynamic plus static. Designers should follow the Intel PowerPlay Early Power Estimator (EPE) before layout to size the thermal solution. The HF35 package uses an exposed die / integrated heat-spreader; a heatsink with thermal interface material is required for production, and the PCB needs a thermal via array under the BGA to spread heat into inner copper planes.
Stratix IV GX transceivers up to 8.5 Gbps demand controlled-impedance differential routing with length matching to within a few mils across each lane. Use 100-ohm differential stripline or microstrip on the high-speed layers, keep series AC-coupling capacitors close to the transmitter balls, and isolate the transceiver power rails (VCCA, VCCP, VCCR) with ferrite beads and decoupling. Reference the Intel Stratix IV GX Transceiver Layout Guidelines for the exact stack-up and via recommendations.
Stratix IV GX requires multiple supply rails (VCCINT core, VCCPD, VCCA_PLL, VCCA_GXB, VCCIO per bank) with strict sequencing rules. According to the Stratix IV handbook, VCCPD must ramp before or with VCCINT to avoid latch-up. Use the Intel power-tree reference designs and TI/LM series sequencer ICs. Bulk decoupling of at least 4x 220 uF polymer + per-pin 0.1 uF + 10 nF ceramics is required near the BGA.
Common pitfalls include: configuring unused transceiver channels incorrectly (tie to GND through proper bias); exceeding the maximum number of simultaneously-active transceivers (thermal back-off required); and loading the wrong device pin-out file into Quartus. According to Intel release notes, designers should always re-run the Pin Planner after device migration even between same-die variants (e.g. HF35 vs FF35) because bank assignments differ.
규정 준수 정보
RoHS compliant and lead-free per Intel/Altera Stratix IV family material declaration. REACH SVHC declarations are published on the Intel product compliance portal. AEC-Q100 is not applicable (FPGAs are not automotive-qualified discretes). Halogen-free status not explicitly stated in available data.