EP4SGX530KF43I3N - Stratix IV GX 531K LE FPGA, 880 I/O | Intel
부품 번호: EP4SGX530KF43I3N ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $8500 | $8,500.00 |
| 10 | $8150 | $81,500.00 |
| 100 | $7700 | $770,000.00 |
| 250 | $7400 | $1,850,000.00 |
| 500 | $7100 | $3,550,000.00 |
EP4SGX530KF43I3N 개요
A Field Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnects, and dedicated hard IP blocks such as transceivers, memory controllers, and DSP slices. Stratix IV GX sits in the high-performance tier of Intel's FPGA portfolio, hierarchically: FPGA -> programmable logic -> ASIC-class silicon. Unlike fixed-function ASICs, FPGAs allow full in-system reprogrammability, enabling hardware iteration after PCB fabrication. The 'GX' suffix denotes integrated multi-gigabit transceivers, a key differentiator from non-transceiver Stratix IV E variants.
Key features include 21,248 Logic Array Blocks (LABs), dedicated on-chip memory, embedded multiplier blocks for DSP, and up to 24 full-duphiplex multi-gigabit transceivers (per the Stratix IV GX family). The 1760-pin FCBGA package exposes 880 user I/O, supporting dense parallel interfaces such as DDR3 memory controllers, LVDS signaling, and high-speed serial links. The 'I3' speed grade balances timing margin and power, while the 'N' suffix indicates a lead-free industrial-temperature range suitable for ruggedized environments.
Architecturally, the EP4SGX530 uses partial reconfiguration and adaptive logic modules (ALMs) that implement either combinational or registered logic with fine-grained carry chains. Hard PCIe Gen2 controllers and multi-gigabit transceivers simplify high-speed serial designs without consuming soft logic resources. The 40 nm process also introduces programmable power technology, allowing unused logic to enter a low-power state without losing state contents.
Typical applications include high-end test and measurement equipment, telecom line cards, military/aerospace signal processing, ASIC prototyping, and high-speed data acquisition systems. The large logic density supports entire subsystems on a single device, including on-chip CPU cores via soft processors, reducing board complexity.
Designers should carefully plan power sequencing for the 0.9 V core and 1.1/1.5/2.5 V transceiver rails, and use Stratix IV power-calculator spreadsheets early in the design cycle. Thermal management is critical: the FCBGA package benefits from a heatsink or forced airflow at high toggle rates.
This page synthesizes distributor pricing, drop-in alternatives from the Stratix IV GX family, and practical design notes not found in a single manufacturer document.
드롭인 대체품: EP4SGX530KF43I3N — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP4SGX530KF43I3N (동일 폼 팩터 및 풋프린트) — 차이점: Package, Operating Temperature, Process Technology, Speed Grade, Transceivers.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP4SGX530KF43I4N
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$2240 / 개
데이터시트 보기 →EP4SGX530KF43I3
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$4890 / 개
데이터시트 보기 →EP4SGX530KF43C4N
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$3500 / 개
데이터시트 보기 →EP4SGX530KF43C3N
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$3425 / 개
데이터시트 보기 →EP4SGX530KF43C2N
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$3450 / 개
데이터시트 보기 →EP4SGX530KF43I3N 최대 정격 & 전기적 특성
| Family | Stratix IV GX |
| Series | EP4SGX530 |
| Logic Elements (LE) | 531,200 |
| Logic Array Blocks (LABs) | 21,248 |
| Embedded Memory Bits | 28,033,024 |
| Maximum User I/O | 880 |
| Process Technology | 40 nm |
| Core Supply Voltage | 0.9 V |
| 패키지 | 1760-ball FC-FBGA (KF43) |
| Pin/Ball Count | 1760 |
| Speed Grade | I3 (industrial) |
| 동작 온도 | -40C to +100C (industrial) |
| 실장 유형 | Surface Mount (BGA) |
| RoHS 상태 | Compliant (lead-free) |
| Sub-Family Type | FPGA with embedded transceivers (GX) |
EP4SGX530KF43I3N 1760-ball fc-fbga (kf43) 핀 구성 가이드
EP4SGX530KF43I3N(1760-ball fc-fbga (kf43) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP4SGX530KF43I3N.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP4SGX530KF43I3N 적합 용도: 6 애플리케이션s: ASIC Prototyping and Emulation, High-Speed Telecom Line Cards, Military and Aerospace Signal Processing, Medical Imaging and Diagnostics, Test and Measurement Instrumentation, High-Performance Computing Acceleration.
ASIC Prototyping and Emulation
The EP4SGX530KF43I3N's 531,200 logic elements and 28 Mbits of embedded memory allow multi-million-gate ASIC designs to be partitioned onto one or two FPGAs for pre-silicon validation. Compared to mid-density FPGAs, the 530K-LE fabric removes the need for time-consuming multi-FPGAs partitioning and shortens bring-up cycles. The integrated transceivers support high-speed ASIC interfaces including PCIe and Serial RapidIO with minimal glue logic, while the 1760-ball FC-FBGA exposes 880 user I/O for parallel ASIC pin emulation. Estimated: at typical prototype clock rates the fabric utilization stays below 80% to leave headroom for debug instrumentation.
추천
High-Speed Telecom Line Cards
Telecom line cards require multi-gigabit serial links, packet-processing buffers, and backplane interfaces, all of which the EP4SGX530KF43I3N provides through integrated multi-gigabit transceivers and ample block memory. The 880 user I/O comfortably accommodate 10G/40G framer-mapper interfaces plus parallel SGMII ports to PHY devices. Industrial temperature grade (-40C to +100C) suits outdoor-pedestal and central-office environments. Power estimation with the Quartus PowerPlay tool is recommended early in the design cycle to size rails and cooling.
추천
Military and Aerospace Signal Processing
With its industrial temperature range and Stratix IV GX heritage, the EP4SGX530KF43I3N is widely deployed in ruggedized defense signal-processing subsystems such as radar pre-processors, electronic-warfare receivers, and secure-communication modems. The 531K-LE fabric plus on-chip DSP blocks execute multi-channel FFT and pulse-compression algorithms in real time, while integrated transceivers link to RF data converters and high-speed ADCs/DACs. The flip-chip BGA provides the mechanical robustness and thermal performance required for vibration and thermal-shock profiles per MIL-STD-810.
추천
Medical Imaging and Diagnostics
Imaging modalities such as ultrasound, CT, and MRI front-ends benefit from the EP4SGX530KF43I3N's combination of high logic density and parallel I/O for beamforming, image reconstruction, and DICOM processing. The 28 Mbits of embedded memory buffer raw scan-line data before compression, reducing external memory accesses and latency. Industrial temperature and lead-free compliance suit hospital and field-deployable imaging carts. Compact form factors are enabled by integrating PHY, processing, and glue logic onto a single FPGA.
추천
Test and Measurement Instrumentation
Logic analyzers, protocol exercisers, and high-bandwidth oscilloscopes leverage the EP4SGX530KF43I3N's 880 user I/O to aggregate LVDS channels and its 28 Mbits of memory for deep trace capture. Integrated transceivers handle PCIe Gen2 backhaul and external trigger links. The industrial temperature range supports bench, lab-rack, and field-test deployments. Compared to ASIC-based instruments, an FPGA-driven architecture lets vendors roll out new protocol decoders via firmware updates rather than hardware respins.
추천
High-Performance Computing Acceleration
Compute-acceleration cards in HPC clusters use the EP4SGX530KF43I3N as a co-processor for financial analytics, genomics, and scientific workloads. The high LE count, on-chip DSP, and 28 Mbits of memory implement custom datapaths that outperform CPUs per watt for parallel kernels. Multi-gigabit transceivers support QDR/RLDRAM and external memory interfaces at 10+ Gbps. Industrial temperature and lead-free compliance match datacenter and edge-compute chassis requirements.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP4SGX530KF43I3N — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP4SGX530KF43I4N | EP4SGX530KF43I3 | EP4SGX530KF43C4N | EP4SGX530KF43C3N | EP4SGX530KF43C2N |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 1760-ball FC-FBGA (KF43) | 1760-ball FC-FBGA (KF43) - same | 1760-ball FC-FBGA (KF43) - same | 1760-ball FC-FBGA (KF43) - same | 1760-ball FC-FBGA (KF43) - same | 1760-ball FC-FBGA (KF43) - same |
| Logic Elements | 531,200 | 531,200 | 531,200 | 531,200 | 531,200 | 531,200 |
| Speed Grade | I3 (industrial) | I4 (faster industrial) | I3 (industrial) | C4 (commercial) | C3 (commercial) | C2 (slower commercial) |
| Temperature Grade | -40C to +100C (industrial) | -40C to +100C (industrial) | -40C to +100C (industrial) | 0C to +85C (commercial) | 0C to +85C (commercial) | 0C to +85C (commercial) |
| Logic Array Blocks (LABs) | 21,248 | 21,248 | 21,248 | 21,248 | 21,248 | 21,248 |
| Embedded Memory Bits | 28,033,024 | 28,033,024 | 28,033,024 | 28,033,024 | 28,033,024 | 28,033,024 |
| Process Technology | 40 nm | 40 nm | 40 nm | 40 nm | 40 nm | 40 nm |
| RoHS / Lead-Free | Yes (N suffix) | Yes (N suffix) | Yes (typical Intel marking) | Yes (N suffix) | Yes (N suffix) | Yes (N suffix) |
주요 차별점
- Largest Stratix IV GX logic capacity in the 1760-ball KF43 family (vs EP4SGX360KF43I3N)
- Industrial temperature grade with full transceiver support (vs EP4SGX530KF43C3N)
- Integrated multi-gigabit transceivers on-die (vs Stratix IV E (non-GX) devices)
설계 노트
Estimated: the Stratix IV GX 530K device draws 15-25 W at full toggle rate and 1.0 V VCCINT. Sequence rails in this order: VCC, VCCPD, VCCPT, and transceiver supplies. Use the Quartus Prime PowerPlay early-power estimator before schematic freeze to size decoupling and rails. Hold VCC below 1.05 V until PLLs lock; failure to sequence can permanently damage transceivers.
Estimated: with a flip-chip FC-FBGA, junction-to-ambient thermal resistance is approximately 6-8 C/W when mounted on a 1 oz PCB with a properly attached heatsink and 200 LFM airflow. Without a heatsink, junction temperature can exceed 100 C at 20 W; verify with on-die diode measurements and derate if the design is sealed or has limited airflow. Use thermal vias under the package thermal pad for best heat extraction.
The 1760-ball KF43 FC-FBGA requires a multilayer PCB with 1.0 mm ball pitch. Stack-up should have dedicated GND and PWR planes directly under the device. Use 0.5 oz copper on outer layers with 1 oz on inner planes; high-speed transceivers benefit from stripline routing between GND/PWR planes. Follow the Altera KF43 package layout guidelines for via-in-pad and microvia recommendations.
Configuration mode (AS, PS, JTAG, FPP) must be selected via MSEL pins before power-up; mismatched MSEL straps are a common cause of first-board bring-up failures. JTAG chain order matters when multiple devices share TCK/TMS - insert series termination near the FPGA. Confirm transceiver reference-clock jitter meets the protocol requirement (PCIe requires a clean 100 MHz HCSL reference).
규정 준수 정보
RoHS and lead-free compliance indicated by N suffix and Intel/Altera product documentation. AEC-Q100 not applicable for FPGAs. Halogen-free status not explicitly listed in snippet data; refer to Intel material declaration for confirmation.
