EP4SGX230KF40I3N - 230K LEs Stratix IV GX FPGA, 1517-BGA | Intel / Altera
부품 번호: EP4SGX230KF40I3N ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $4850 | $4,850.00 |
| 10 | $4525 | $45,250.00 |
| 100 | $4180 | $418,000.00 |
| 500 | $3850 | $1,925,000.00 |
| 1,000 | $3520 | $3,520,000.00 |
EP4SGX230KF40I3N 개요
What is a Stratix IV GX FPGA? The Stratix IV GX family belongs to Intel/Altera's high-end FPGA portfolio, which sits within the broader taxonomy: FPGA -> programmable logic device (PLD) -> logic IC -> integrated circuit. Stratix IV GX parts are specifically engineered for high-speed serial I/O and transceiver-based protocols, integrating multi-gigabit transceivers (MGTs) up to 8.5 Gbps alongside the general-purpose FPGA fabric. This makes them the preferred architecture for high-bandwidth telecommunications, broadcast video, and ASIC prototyping workloads where microprocessors and DSP ICs alone cannot meet throughput requirements.
Key specifications include 1,288 embedded 18x18 multipliers, 36 PLLs, and dedicated hard memory controllers. The device integrates 8 transceiver channels (configurable as PCIe Gen1/Gen2 hard IP, XAUI, Serial RapidIO, and CPRI), removing the need to instantiate transceivers in soft logic. Memory is structured with MLAB, M9K, and M144K block types for flexible on-chip storage.
From an architectural perspective, the EP4SGX230 leverages an adaptive logic module (ALM) structure with 8-input fracturable look-up tables (LUTs), delivering higher logic utilization per LE than older architectures. The transceiver tile pairs PCS and PMA blocks with dynamic reconfiguration, enabling protocol switching without external muxing.
Typical applications include 40G/100G Ethernet line cards, software-defined radio (SDR) baseband, ASIC prototyping, high-end test and measurement, and military radar signal processing. The wide transceiver count and high logic density also suit medical imaging (ultrasound beamforming) and broadcast video processing.
Designers must allocate sufficient PCB area for the 1517-ball 1.0 mm pitch FCBGA and follow Intel's Stratix IV GX pin connection guidelines for unused transceivers, reference clocks, and JTAG. Power estimation should use the Intel PowerPlay Early Power Estimator (EPE) before RTL freeze, because the high logic and transceiver count drives substantial core current.
This page synthesizes distributor pricing, same-package drop-in alternatives, and design considerations not found in the manufacturer datasheet alone, helping engineers evaluate the EP4SGX230KF40I3N for next-generation communications and signal-processing platforms.
드롭인 대체품: EP4SGX230KF40I3N — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP4SGX230KF40I3N (동일 폼 팩터 및 풋프린트) — 차이점: Package, Mounting Type, Adaptive Logic Modules (ALMs), Family, Logic Array Blocks (LABs).
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP4SGX230KF40I4N
✅ 드롭인✓ 재고 있음
$3725 / 개
데이터시트 보기 →EP4SGX230KF40C3N
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
EP4SGX230KF40C2N
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
EP4SGX230KF40I3G
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
EP4SGX230KF40C4N
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
EP4SGX180KF40I3N
✅ 드롭인✓ 재고 있음
$1380 / 개
데이터시트 보기 →EP4SGX230KF40I3N 최대 정격 & 전기적 특성
| Series | Stratix IV GX |
| Family | Stratix IV GX |
| Manufacturer | Intel (formerly Altera) |
| Logic Elements (LEs) | 228,000 |
| Embedded Memory | 17,544,192 bits |
| Adaptive Logic Modules (ALMs) | 91,200 (9120 LABs) |
| Logic Array Blocks (LABs) | 9,120 |
| Embedded 18x18 Multipliers | 1,288 |
| PLLs | 36 |
| Maximum User I/Os | 744 |
| Transceiver Channels | 8 (up to 8.5 Gbps) |
| PCIe Hard IP | Yes (Gen1/Gen2 x1/x2/x4) |
| 패키지 | 1517-ball FCBGA, 1.0 mm pitch |
| Speed Grade | I3 |
| 동작 온도 | -40C to +100C (Industrial) |
| Process Node | 40 nm TSMC |
| 실장 유형 | Surface Mount (BGA) |
EP4SGX230KF40I3N 핀 구성
| 핀 1 | VCC — Core supply voltage (per Stratix IV GX KF40 pin connection guidelines) |
| 핀 1517 | GND — Common ground (per package ball map) |
| 핀 A1 | JTAG_TCK — JTAG test clock (per Stratix IV GX KF40 pinout) |
| 핀 B1 | JTAG_TMS — JTAG test mode select (per Stratix IV GX KF40 pinout) |
일반적인 애플리케이션
EP4SGX230KF40I3N 적합 용도: 7 애플리케이션s: 40G/100G Ethernet Line Cards, Software-Defined Radio (SDR) Baseband, ASIC Prototyping and Emulation, High-End Test and Measurement, Military Radar Signal Processing, Medical Imaging (Ultrasound Beamforming), Broadcast Video Processing.
40G/100G Ethernet Line Cards
The EP4SGX230KF40I3N's eight 8.5 Gbps transceivers support multi-lane 10G Ethernet aggregation, and four bonded lanes deliver 40G line-rate processing when paired with external PHY/MAC. The 228K logic elements and 1,288 18x18 multipliers provide ample capacity for MAC-layer packet classification, traffic shaping, and queue management, while the integrated PCIe Gen2 hard IP simplifies the host CPU interface to the line card controller. The industrial temperature range also makes the part suitable for outdoor aggregation equipment, central-office deployments, and datacenter top-of-rack switches where reliable operation in less-controlled thermal conditions is mandatory.
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Software-Defined Radio (SDR) Baseband
In SDR baseband systems the EP4SGX230KF40I3N's combination of 1,288 DSP blocks, 17.5 Mbit embedded memory, and 36 PLLs accelerates wideband channelization, FFT/iFFT operations, and digital down/up-conversion pipelines. The transceivers accept RF ADC/DAC interfaces (JESD204B via external bridge or LVDS) while the fabric handles real-time digital signal processing for LTE, 5G NR, or military waveforms. The 744 user I/Os allow direct connections to RF front-ends, sample-rate converters, and host processors, making the device ideal for tactical radios, spectrum analyzers, and signal-intelligence platforms.
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ASIC Prototyping and Emulation
ASIC prototyping demands very high logic density, large on-chip memory, and abundant user I/Os - all of which the EP4SGX230KF40I3N delivers in a single package. The 228K logic elements can map roughly 15-20 million gates of synthesized ASIC netlist using density-optimized synthesis, while the 744 user I/Os expose full speed across prototype boards with multi-FPGA partitioning schemes. The Stratix IV GX transceivers emulate high-speed ASIC SerDes lanes (PCIe, USB 3.0, SATA) at line rate, and the industrial temperature range supports 24/7 burn-in chambers used in validation farms. Multi-board emulators stack these parts with high-speed board-to-board links for full-chip ASIC bring-up.
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High-End Test and Measurement
Test and measurement instruments require deterministic timing, fast real-time signal processing, and high-bandwidth data acquisition interfaces - all strengths of the EP4SGX230KF40I3N. Its 8 transceivers feed ADC samples directly into the FPGA at multi-Gsps rates, and the 1,288 DSP blocks enable real-time FFT-based spectrum analysis, channel equalization, and trigger detection on oscilloscopes and protocol analyzers. The 17.5 Mbit embedded memory buffers acquired waveforms on-chip, while the 744 user I/Os drive high-resolution displays and front-panel controls. Industrial temperature support also enables portable field-test gear used outside controlled labs.
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Military Radar Signal Processing
Phased-array and synthetic-aperture radar (SAR) systems depend on the EP4SGX230KF40I3N for high-throughput beamforming, pulse compression, and Doppler processing. The 1,288 18x18 multipliers and large ALM count support hundreds of parallel beamforming channels at real-time sample rates, while the transceivers digitize antenna-element data streams from RFICs across the array. The industrial temperature range and long-life-cycle availability make the part especially suitable for defense platforms with multi-decade service lifecycles, including airborne, naval, and ground-based radar systems requiring sustained reliability in harsh operating environments.
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Medical Imaging (Ultrasound Beamforming)
In ultrasound beamforming systems the EP4SGX230KF40I3N handles real-time delay-and-sum beamforming across 64-256 channels simultaneously. The 8 transceivers accept high-speed ADC inputs from the analog front-end, the 1,288 DSP blocks perform per-channel delay calculation, apodization, and envelope detection, and the embedded memory holds channel data and image frames. The high user-IO count simplifies connections to external image memory, displays, and host processors, while the deterministic timing and industrial temperature support enable clinical, portable, and point-of-care ultrasound platforms across a wide range of deployment scenarios.
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Broadcast Video Processing
Broadcast video routers, format converters, and contribution codecs benefit from the EP4SGX230KF40I3N's combination of high logic density, dedicated transceivers (3G-SDI, HDMI over coax), and parallel DSP resources. The fabric implements real-time up/down/cross-conversion between SDI standards (SD/HD/3G/12G via bonding), color space conversion, and compression preprocessing, while the transceivers drive SMPTE 2022, 2059, and 2110 IP-based video over 10G Ethernet. The industrial temperature rating and long-term availability also suit broadcast equipment vendors whose product lifecycles span 10+ years and require stable, supported silicon.
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추천 제품 요약
엔지니어링 참조 데이터: EP4SGX230KF40I3N — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP4SGX230KF40I4N | EP4SGX230KF40C3N | EP4SGX230KF40C2N | EP4SGX230KF40I3G | EP4SGX180KF40I3N |
|---|---|---|---|---|---|---|
| Package | 1517-ball FCBGA (KF40) | 1517-ball FCBGA (KF40) - same | 1517-ball FCBGA (KF40) - same | 1517-ball FCBGA (KF40) - same | 1517-ball FCBGA (KF40) - same | 1517-ball FCBGA (KF40) - same |
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Logic Elements | 228,000 | 228,000 | 228,000 | 228,000 | 228,000 | 180,000 |
| Temperature Grade | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) |
| Speed Grade | I3 | I4 (faster) | C3 (faster) | C2 | I3 | I3 |
| Transceiver Channels | 8 (up to 8.5 Gbps) | 8 (up to 8.5 Gbps) | 8 (up to 8.5 Gbps) | 8 (up to 8.5 Gbps) | 8 (up to 8.5 Gbps) | 8 (up to 8.5 Gbps) |
| Lifecycle / Lead-Free | Active / Pb-free suffix N | Active / Pb-free | Active / Pb-free | Active / Pb-free | Active / Green suffix G | Active / Pb-free |
주요 차별점
- Highest-density Stratix IV GX in KF40 1517-ball package (vs EP4SGX180KF40I3N)
- Industrial temperature grade (vs EP4SGX230KF40C2N)
- Faster I4 speed grade available in same package (vs EP4SGX230KF40I4N)
설계 노트
Estimated: a Stratix IV GX FPGA in the 1517-ball FCBGA package may dissipate 8-15 W typical and 20+ W peak when all 8 transceivers run at line rate. Use Intel's PowerPlay Early Power Estimator (EPE) before RTL freeze to derive junction temperature. The KF40 package has limited heat-slug access; provide at least 4 thermal vias in a 0.5 mm grid under the package and pair with a heatsink for industrial-temperature deployments where ambient exceeds 60C.
The 1.0 mm pitch FCBGA requires laser-drilled microvias or staggered via structures with 0.5/0.4 mm via pitch on a high-layer-count PCB (12+ layers recommended). Reference Intel's Stratix IV GX board design guidelines for decoupling capacitor selection: 0402-size 0.1 uF and 1 uF X7R caps placed within 100 mil of each power ball pair, plus bulk tantalum or polymer caps on each supply rail. Match length on all 8 transceiver differential pairs to within 5 mil and route over a continuous reference ground plane.
Transceiver channels require a continuous reference plane (ground for lower speeds; mixed ground/power for 6.25 Gbps+) directly beneath the traces, with no splits or voids. AC-coupling capacitors must be 0402 size with low-ESR ceramic (NPO/C0G dielectric preferred). For PCIe Gen2 implementations, follow Intel's PCIe Hard IP user guide to set transmitter pre-emphasis and receiver equalization coefficients in the Quartus Prime ALTGX megafunction.
Do not leave unused transceiver channels floating - tie the unused TX/RX pairs per Intel pin connection guidelines (TX to GND through bias, RX terminated). Failure to do so can increase power consumption and inject noise. Likewise, all configuration and JTAG pins (nCONFIG, nSTATUS, CONF_DONE, MSEL[3:0]) must be pulled to defined logic levels per the selected configuration scheme (AS, PS, JTAG, or FPP) before power-up.
규정 준수 정보
RoHS/REACH/lead-free status for the EP4SGX230KF40I3N was not present in the verified web data; check the Intel/Altera product declaration or distributor product page for the specific date code. AEC-Q100 not applicable - this is an industrial FPGA, not an automotive-grade part.
