EP4SGX360NF45C4 - Stratix IV GX FPGA, 353K LE, 1932-FCBGA | Intel
부품 번호: EP4SGX360NF45C4 ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $3200 | $3,200.00 |
| 10 | $3050 | $30,500.00 |
| 100 | $2875 | $287,500.00 |
| 500 | $2725 | $1,362,500.00 |
| 1,000 | $2600 | $2,600,000.00 |
EP4SGX360NF45C4 개요
A Field-Programmable Gate Array (FPGA) is a reconfigurable semiconductor whose logic fabric, routing, and I/O can be customized by the user after manufacture. FPGAs sit between fixed-function ASICs and software-programmable processors in the design hierarchy: programmable logic -> reconfigurable logic -> FPGA -> programmable logic device (PLD) -> standard logic IC. The Stratix IV family specifically combines general-purpose fabric with embedded transceivers, hard memory blocks (M20K), and DSP blocks optimized for high-bandwidth signal chains.
Key features of the EP4SGX360NF45C4 include 8.9 Mbits of distributed RAM, 8 transceivers supporting multi-gigabit serial links, dedicated DSP blocks for fixed- and floating-point arithmetic, and SelectRAM+ memory architecture. The 'C4' speed grade indicates a commercial-temperature operating range, while the NF45 package designation identifies the 45 mm body 1932-ball FC-FBGA. Designers typically pair this device with DDR3/DDR2 memory controllers, multi-lane PCI Express hard IP, and SERDES reference clock networks.
Typical applications include high-end test and measurement instrumentation, radar and electronic-warfare baseband processing, high-definition video broadcasting equipment, high-speed packet inspection, and 40G/100G line-card prototyping. Its high logic density makes it suitable for designs that would otherwise require multiple smaller FPGAs, simplifying board layout and BOM. When designing with this part, ensure a 12-layer or thicker PCB with controlled-impedance routing for SERDES lanes; also verify thermal dissipation since a 1932-ball FCBGA package concentrates significant heat flux and benefits from a heatsink or high-airflow chassis.
드롭인 대체품: EP4SGX360NF45C4 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP4SGX360NF45C4 (동일 폼 팩터 및 풋프린트) — 차이점: Speed Grade, Operating Temperature, Package, Transceivers, Process Technology.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP4SGX360NF45C3N
✅ 드롭인✓ 재고 있음
$3300 / 개
데이터시트 보기 →EP4SGX360NF45C3
✅ 드롭인✓ 재고 있음
$3750 / 개
데이터시트 보기 →EP4SGX360NF45C2N
✅ 드롭인✓ 재고 있음
$11800 / 개
데이터시트 보기 →EP4SGX360NF45C2
✅ 드롭인✓ 재고 있음
$2050 / 개
데이터시트 보기 →EP4SGX290NF45I4N
✅ 드롭인✓ 재고 있음
$2095 / 개
데이터시트 보기 →EP4SGX360NF45C4 최대 정격 & 전기적 특성
| Family | Stratix IV GX |
| Logic Elements | 353,600 |
| Adaptive Logic Modules (LABs) | 14,144 |
| User I/Os | 920 |
| Total Embedded Memory (bits) | 23,105,536 |
| Distributed RAM (Mbits) | 8.9 |
| Process Technology | 40 nm |
| Core Voltage | 0.9 V |
| 패키지 | 1932-ball FC-FBGA (NF45) |
| 동작 온도 | Commercial (0C to +85C) |
| Speed Grade | C4 |
| 실장 유형 | Surface Mount |
| Lead Free / RoHS | Compliant |
| AEC-Q100 | Not applicable (commercial grade) |
EP4SGX360NF45C4 1932-ball fc-fbga (nf45) 핀 구성 가이드
EP4SGX360NF45C4(1932-ball fc-fbga (nf45) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP4SGX360NF45C4.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP4SGX360NF45C4 적합 용도: 6 애플리케이션s: High-Bandwidth Wired Communications Line Card, Radar and Electronic Warfare Baseband Processing, Test and Measurement Instrumentation, High-Definition Video Broadcasting Equipment, Network Packet Inspection and DPI, Medical Imaging Back-End Processing.
High-Bandwidth Wired Communications Line Card
The EP4SGX360NF45C4's integrated multi-gigabit transceivers and 353,600 logic elements make it well suited for 10G/40G Ethernet line cards. Its 8 transceivers aggregate backplane lanes, while the 920 user I/Os provide parallel interconnect to external DDR3 and QSFP cages. The 0.9V core voltage and 40nm process deliver a power-efficient fabric for sustained packet-processing workloads. Designers typically pair this FPGA with Intel's hard PCIe Gen2 IP and external PHY for switch-fabric prototyping. Compared to mid-density alternatives, the 360 NF45 variant absorbs full L2/L3 forwarding tables and queueing logic without external memory, simplifying the BOM.
추천
Radar and Electronic Warfare Baseband Processing
For radar and EW baseband designs, the EP4SGX360NF45C4 provides the DSP block density and external memory bandwidth required for pulse compression, FFT processing, and beamforming. Its 14,144 LABs and embedded 23 Mbit memory array support real-time sample-rate conversion. The NF45 package's 1932 balls deliver wide external memory interfaces to DDR3, essential for capturing high-bandwidth ADC data streams. Designers use the device's hard transceivers to fan out raw IF data to downstream DSP clusters. Compared to ASIC implementations, the Stratix IV GX offers design flexibility for evolving EW algorithms while still meeting latency targets.
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Test and Measurement Instrumentation
The EP4SGX360NF45C4 fits high-end oscilloscope and protocol analyzer designs because its high logic count enables deep capture memory, complex trigger engines, and protocol decoding on-chip. The 920 user I/Os support direct parallel interfaces to high-speed ADCs and DACs, while the embedded 23 Mbit memory block enables long real-time waveform captures. The 40nm process keeps channel-count scaling manageable for multi-channel digitizers. Designers choose this part for its combination of logic density, transceiver capability, and the mature Quartus toolchain that accelerates verification. The C4 commercial speed grade provides deterministic timing margins needed for measurement accuracy.
추천
High-Definition Video Broadcasting Equipment
In HD/4K video broadcast gear, the EP4SGX360NF45C4 handles multi-stream SDI encoding/decoding, color-space conversion, and on-screen graphics overlay. Its 920 user I/Os interface to HDMI, SDI, and DisplayPort PHYs, while the high logic count supports multiple parallel video pipelines without frame drops. The embedded transceivers route SDI signals with low jitter, critical for broadcast compliance. The 0.9V core and 40nm process balance performance and power for rack-mounted broadcast chassis. Designers favor this FPGA for its ability to consolidate what would otherwise require multiple FPGAs into a single device, reducing PCB complexity.
추천
Network Packet Inspection and DPI
Deep packet inspection platforms benefit from the EP4SGX360NF45C4's 353K logic elements and multi-gigabit transceivers for line-rate pattern matching. The device's on-chip memory (23 Mbits) buffers regex state machines and rule tables, while the 920 I/Os connect to TCAMs and DDR3 for lookup. Its transceiver-based fabric supports 10G/40G aggregation without external PHYs. The NF45 package's high ball count enables wide memory buses, critical for sustained packet throughput. Designers appreciate that Stratix IV GX retains long-term Intel support, making it viable for carrier-grade networking products with multi-year lifecycles.
추천
Medical Imaging Back-End Processing
The EP4SGX360NF45C4's logic density suits CT, MRI, and ultrasound back-end image reconstruction pipelines where large matrix operations must execute in real time. Its DSP blocks accelerate convolution and back-projection kernels, while the 920 user I/Os connect to multi-channel analog front ends. The C4 commercial speed grade provides the deterministic timing necessary for medical safety certifications. Designers leverage the embedded memory for line buffers and tile caching, avoiding external memory bottlenecks. Compared to GPU-based systems, the FPGA delivers lower latency and deterministic throughput required for clinical imaging workloads.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP4SGX360NF45C4 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP4SGX360NF45C3N | EP4SGX360NF45C3 | EP4SGX360NF45C2N | EP4SGX360NF45C2 | EP4SGX290NF45I4N |
|---|---|---|---|---|---|---|
| Package | 1932-ball FC-FBGA (NF45) | 1932-ball FC-FBGA (NF45) - same | 1932-ball FC-FBGA (NF45) - same | 1932-ball FC-FBGA (NF45) - same | 1932-ball FC-FBGA (NF45) - same | 1932-ball FC-FBGA (NF45) - same |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 353,600 | 353,600 | 353,600 | 353,600 | 353,600 | 290,000 |
| Speed Grade | C4 (fastest commercial) | C3 | C3 | C2 | C2 | I4 |
| User I/Os | 920 | 920 | 920 | 920 | 920 | 920 |
| Operating Temperature | Commercial (0C to +85C) | Commercial | Commercial | Commercial | Commercial | Industrial (-40C to +100C) |
| Process / Core Voltage | 40 nm / 0.9 V | 40 nm / 0.9 V | 40 nm / 0.9 V | 40 nm / 0.9 V | 40 nm / 0.9 V | 40 nm / 0.9 V |
주요 차별점
- Highest available speed grade in this die/package (vs EP4SGX360NF45C3N)
- Full logic density maintained across speed grades (vs EP4SGX290NF45I4N)
- Integrated multi-gigabit transceivers eliminate external PHY (vs EP4SGX230KF40C4N)
설계 노트
Estimated: A 40nm Stratix IV GX device at full utilization in the 1932-ball FC-FBGA package typically dissipates 10-15 W. Without a heatsink or sufficient airflow, junction temperatures can exceed the 85C commercial limit during sustained DSP operation. Recommend a heatsink with thermal interface material plus 200 LFM minimum airflow in chassis-level designs. Use the Quartus Prime PowerPlay analyzer to model expected dissipation before finalizing the thermal solution.
Designers must use a 12-layer or thicker PCB with controlled-impedance routing for transceiver lanes (100-ohm differential). Reference Intel's Stratix IV GX board design guidelines for stack-up recommendations. Decoupling requires low-ESL ceramic capacitors placed as close as possible to power balls. Use microvia technology to escape the dense BGA; full through-via fanout is impractical with a 1932-ball 1.0 mm pitch package.
Transceiver reference clock routing requires strict length matching (typically +/- 25 mil) and isolation from noisy signals. Keep SERDES lanes away from switching power supply edges; place guard ground vias alongside high-speed differential pairs. Use Intel's pin-out file editor to optimize bank assignments and minimize routing congestion. Pin 1 orientation and the thermal pad footprint must match the package land pattern exactly to avoid solder joint failures.
Do not assume all 920 user I/Os are simultaneously available; many balls are dedicated to power, ground, configuration, and SERDES channels, leaving fewer general-purpose I/Os than the headline count. Verify I/O bank voltage compatibility when interfacing with DDR3 (1.5V) and LVDS (2.5V) peripherals - banks cannot mix voltages freely. Confirm MSL handling per JEDEC J-STD-033 before reflow to avoid package cracking.
규정 준수 정보
RoHS compliant per Intel product page. AEC-Q100 not applicable (commercial grade C4). For industrial applications choose I-grade variants such as EP4SGX360NF45I4N. Halogen-free status not explicitly confirmed in retrieved data - set to unknown.
