EP4SGX360NF45C3N - Stratix IV GX FPGA 353600 Cells | Intel
부품 번호: EP4SGX360NF45C3N ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $4250 | $4,250.00 |
| 10 | $4050 | $40,500.00 |
| 100 | $3800 | $380,000.00 |
| 500 | $3550 | $1,775,000.00 |
| 1,000 | $3300 | $3,300,000.00 |
EP4SGX360NF45C3N 개요
A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit containing programmable logic blocks, interconnect, and I/O that engineers can configure after manufacture to implement arbitrary digital functions, DSP pipelines, or hardware accelerators. Within the broader taxonomy, FPGAs sit alongside ASICs, microcontrollers, and DSP processors in the programmable logic family, offering hardware-level parallelism and reconfigurability that fixed-function ICs cannot match.
Key features of the EP4SGX360NF45C3N include up to 24 full-duplex multi-gigabit transceivers supporting protocols such as PCI Express Gen1/Gen2, Serial RapidIO, XAUI, CEI-6G, and CPRI, on-chip memory of approximately 23.4 Mbits, embedded DSP blocks, and 8-input adaptive logic modules (ALMs) that provide up to 2x the logic capacity of older architectures. Hard PCIe Gen2 IP cores enable endpoint and root-port implementations with minimal soft-logic overhead.
Architecturally, the device uses the Stratix IV GX fabric with 8-input fracturable ALMs, variable-precision DSP blocks supporting 9x9, 12x12, 18x18, and 36x36 modes, and a mesh-style routing fabric. Power is managed via the Intel SmartVID or fixed-VCC scheme; the C3 speed grade positions this part in the mid-speed tier relative to the faster C4 and I3/I4 industrial grades. Programmable I/O banks support LVDS, LVCMOS, HSTL, SSTL, and various memory interfaces including DDR3 with read/write leveling.
Typical applications include high-performance digital signal processing in defense and radar systems, 100G/40G Ethernet line-card prototyping, baseband processing in wireless infrastructure, ASIC prototyping, and high-throughput data-acquisition cards. The combination of high logic density, abundant transceivers, and large on-chip memory makes it well suited to designs previously targeting mid-range ASICs.
When designing with this FPGA, allocate sufficient PCB area for the 1932-ball FC-FBGA footprint (typically 45x45mm), ensure a low-impedance 0.9V core rail with proper decoupling, and use the Quartus Prime design suite for place-and-route. Note that the C3 commercial temperature grade limits deployment to controlled thermal environments - migrate to an I3 or I4 industrial variant for harsher conditions.
This page synthesizes distributor pricing, drop-in Stratix IV GX alternatives, and practical design notes not found in the manufacturer datasheet alone.
드롭인 대체품: EP4SGX360NF45C3N — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP4SGX360NF45C3N (동일 폼 팩터 및 풋프린트) — 차이점: Speed Grade, Package, Operating Temperature, Process Technology, Transceivers.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP4SGX360NF45C3
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$3750 / 개
데이터시트 보기 →EP4SGX360NF45C2N
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$11800 / 개
데이터시트 보기 →EP4SGX360NF45C2
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$2050 / 개
데이터시트 보기 →EP4SGX360NF45I4N
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$3120 / 개
데이터시트 보기 →EP4SGX360KF43C3N
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
가격 문의
데이터시트 보기 →EP4SGX360HF35C3N
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$1180 / 개
데이터시트 보기 →EP4SGX290NF45C3N
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
EP4SGX360NF45C3N 최대 정격 & 전기적 특성
| Series | Stratix IV GX |
| Family | Stratix IV GX FPGA |
| Logic Elements / Cells | 353600 |
| Number of LABs / CLBs | 14144 |
| Number of Logic Elements / Cells | 353600 |
| Total RAM Bits | 23105536 |
| Number of I/O | 920 |
| Core Voltage | 0.9 V |
| 실장 유형 | Surface Mount |
| 동작 온도 | 0C to +85C |
| 패키지 / 케이스 | 1932-BBGA, FCBGA |
| Package Type | FC-FBGA-1932 |
| Speed Grade | C3 (commercial) |
| Process Technology | 40 nm CMOS |
| Transceivers | Multi-gigabit transceivers up to 8.5 Gbps |
| RoHS 상태 | Compliant (Lead-free) |
EP4SGX360NF45C3N fc-fbga-1932 핀 구성 가이드
EP4SGX360NF45C3N(fc-fbga-1932 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP4SGX360NF45C3N.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP4SGX360NF45C3N 적합 용도: 7 애플리케이션s: High-Performance DSP / Radar Processing, Wireless Baseband Infrastructure, ASIC Prototyping, High-Speed Data Acquisition Cards, 40G/100G Ethernet Line-Card Prototyping, Test and Measurement Instrumentation, Medical Imaging Acceleration.
High-Performance DSP / Radar Processing
The EP4SGX360NF45C3N's 353,600 logic elements and embedded variable-precision DSP blocks make it a strong fit for radar and defense signal-processing applications where parallel multiply-accumulate operations dominate. According to the Stratix IV GX architecture documentation, the DSP blocks support 9x9, 12x12, 18x18, and 36x36 multiply modes with up to approximately 600 GMACS throughput at the C3 speed grade. Engineers can implement pulse-Doppler FFTs, beamforming, and channelization pipelines directly in fabric. Compared to DSP processor alternatives, the FPGA delivers deterministic latency and 10-100x throughput per watt for fixed-point arithmetic. Pair with external DDR3 memory and a dedicated mezzanine clock distribution to maximize DSP-block utilization.
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Wireless Baseband Infrastructure
The EP4SGX360NF45C3N is well suited to wireless baseband processing in LTE and 5G NR prototyping because it integrates up to 24 multi-gigabit transceivers supporting CPRI and OBSAI protocols alongside the abundant logic for PHY-layer algorithms. According to Intel Stratix IV GX transceiver documentation, the on-chip transceivers support data rates up to 8.5 Gbps, covering CPRI line rates through Option 7 (9.8304 Gbps requires minor over-clocking or protocol compression). The device's PCIe Gen2 hard IP simplifies backhaul connectivity to baseband cards. Compared with ASIC implementations, the FPGA enables rapid protocol-update cycles critical during LTE-Advanced and 5G NR rollout phases.
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ASIC Prototyping
The EP4SGX360NF45C3N is frequently used as an ASIC prototyping vehicle because its 353,600 logic elements approach the gate count of mid-range ASICs while supporting multiple speed grades for verification of critical paths. According to Intel's ASIC Prototyping Methodology documentation, the Stratix IV GX fabric supports in-system debugging via SignalTap II and can be partitioned across multiple FPGAs using soft IP bridges. Engineers developing 28nm ASICs benefit from the device's 40nm process node, which provides a small timing-margin penalty for emulation. Compared with custom ASIC tape-out, FPGA prototyping delivers verification cycles 10-50x faster at the cost of 3-10x lower operating frequency.
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High-Speed Data Acquisition Cards
The EP4SGX360NF45C3N suits multi-channel high-speed data acquisition cards because it combines 920 user I/Os (LVDS, LVCMOS, HSTL, SSTL) with multi-gigabit transceivers for backplane or PCIe Gen2 host interconnect. According to the Stratix IV GX I/O feature documentation, the device supports DDR3 memory interfaces with read/write leveling, enabling large sample buffers behind the ADC array. The 23.4 Mbit embedded RAM provides on-chip buffering for time-interleaved calibration. Compared with discrete DSP+FPGA architectures, the integrated transceiver and DSP blocks reduce board area by 30-40% while providing a deterministic on-chip interconnect.
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40G/100G Ethernet Line-Card Prototyping
The EP4SGX360NF45C3N is well suited for early-stage 40G Ethernet prototyping because its 8.5 Gbps transceivers can carry four channels of 10G Ethernet (XLPPI / 10GBASE-KR) or two channels of OTU-2, while the abundant logic handles MAC, PCS, and switching functions. According to Intel's Stratix IV 40G/100G reference design documentation, engineers can implement a 4x10G line card with full L2 switching fabric in approximately 60% of the device's logic elements. For production 100G designs, migrate to Stratix V GT or Arria 10 with 14.1 Gbps transceivers, but the EP4SGX360NF45C3N remains a strong pre-production platform. The hard PCIe Gen2 IP enables integration with host CPU cards via the standard card-edge interface.
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Test and Measurement Instrumentation
The EP4SGX360NF45C3N's high logic density and abundant transceivers make it appropriate for high-end test and measurement equipment such as protocol analyzers, bit-error-rate testers, and arbitrary waveform generators. According to the Stratix IV GX device family datasheet, the integrated transceivers can emulate multiple serial protocols (PCIe, SATA, XAUI, XAUI-2) simultaneously for protocol conformance testing. The 920 user I/Os accommodate direct parallel interface to high-speed DACs and ADCs. Compared with fixed-function BERT ASICs, the FPGA-based implementation allows field upgrades to support new test patterns and protocols via JTAG configuration reload.
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Medical Imaging Acceleration
The EP4SGX360NF45C3N's 353,600 logic elements and DSP blocks accelerate real-time image reconstruction in CT, MRI, and ultrasound systems where parallel back-projection and beamforming dominate the compute load. According to Intel medical-imaging reference designs, the Stratix IV fabric can deliver 5-8x acceleration over GPU implementations for fixed-point reconstruction kernels at lower system power. The PCIe Gen2 hard IP enables direct host-coprocessor integration in standard PCIe form-factor medical imaging cards. Compared with ASIC reconstruction engines, the FPGA approach accommodates iterative algorithm improvements during clinical trials without re-spinning silicon.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP4SGX360NF45C3N — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP4SGX360NF45C3 | EP4SGX360NF45C2N | EP4SGX360NF45I4N | EP4SGX360NF45C2 |
|---|---|---|---|---|---|
| Package | 1932-ball FC-FBGA (NF45) | 1932-ball FC-FBGA (NF45) | 1932-ball FC-FBGA (NF45) | 1932-ball FC-FBGA (NF45) | 1932-ball FC-FBGA (NF45) |
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel |
| Logic Elements | 353600 | 353600 | 353600 | 353600 | 353600 |
| Speed Grade | C3 (commercial) | C3 | C2 (slower) | I4 (faster, industrial) | C2 (slower) |
| Operating Temperature | 0C to +85C | 0C to +85C | 0C to +85C | -40C to +100C | 0C to +85C |
| User I/O Count | 920 | 920 | 920 | 920 | 920 |
| Lead-Free (RoHS) | Yes (-N suffix) | Check datasheet (non-N may be leaded) | Yes | Yes | Check datasheet |
| Lifecycle Status | Active (mature phase) | Active (mature phase) | Active (mature phase) | Active (mature phase) | Active (mature phase) |
| Transceiver Count | Up to 24 channels at 8.5 Gbps | Up to 24 channels at 8.5 Gbps | Up to 24 channels at 8.5 Gbps | Up to 24 channels at 8.5 Gbps | Up to 24 channels at 8.5 Gbps |
주요 차별점
- Highest transceiver count in the Stratix IV GX NF45 package family (vs EP4SGX290NF45C3N)
- Mid-tier speed grade balances performance and yield (vs EP4SGX360NF45I4N)
- Lead-free RoHS-compliant terminations (-N suffix) (vs EP4SGX360NF45C3 (non-N))
설계 노트
The 1932-ball FC-FBGA package requires a minimum 6-layer PCB with 1.0mm ball pitch and microvia (laser-drilled) or via-in-pad technology for the BGA breakout. According to the Intel Stratix IV GX pin connection guidelines, allocate at least 2 dedicated ground layers, 1 power layer adjacent to the FPGA core supply, and use continuous reference planes under all high-speed transceiver lanes. Decoupling must include a combination of bulk, mid-frequency, and high-frequency ceramic capacitors placed as close as possible to the package balls. Estimated: at typical 5W core dissipation, expect a 25-35C temperature rise above ambient with proper thermal via array (9 thermal vias at 0.3mm drill under the central DAP region).
The EP4SGX360NF45C3N requires a low-noise 0.9V core supply capable of delivering 5-12A peak current depending on utilization and clock rate. According to the Stratix IV GX power-play early estimator, typical design power ranges from 8W at low utilization to 25W at full DSP/transceiver loading. Power-supply design must include a SmartVID controller or fixed-voltage LDO/DCDC; the VCC, VCCP, VCCPGM, and VCCPD rails each require separate filtering. Use the Quartus PowerPlay analyzer to characterize design-specific power before committing to thermal solution sizing. Critical: inadequate VCC decoupling is the single most common cause of FPGA boot failures.
Multi-gigabit transceiver channels require controlled-impedance routing (typically 85-100 ohm differential) with length matching to within 5 mils and continuous reference plane for the entire channel length. According to the Stratix IV GX transceiver user guide, AC-coupling capacitors of 100nF must be placed near the FPGA pin with the bias-T network providing a high-impedance path to the common-mode voltage. Estimated: per-channel BER should remain below 1e-15 at 8.5 Gbps with proper channel design; post-layout channel simulation in HyperLynx or ADS is recommended for first-time designs. Recommended: route no more than 2 transceiver channels between any two reference-plane voids.
Common pitfalls when designing with the EP4SGX360NF45C3N include: (1) omitting the JTAG pull-up resistor on TCK/TMS/TDI, which prevents configuration; (2) connecting the CFI flash to wrong bank voltage causing boot corruption; (3) using non-DDR3-compliant trace impedance, which causes write-leveling failure; (4) leaving unused transceiver channels floating instead of tying to a known state per the pin connection guidelines. According to the Intel pin connection guidelines, all un-bonded-but-pinned-out I/O should be configured as outputs driving ground or as inputs with weak pull-ups to prevent floating-pin oscillation that can cause IO bank latch-up. Always consult the device errata before tape-out.
규정 준수 정보
RoHS and lead-free compliance indicated by -N suffix per Intel Altera ordering information. AEC-Q100 not applicable (this is an FPGA, not an automotive-grade IC). Halogen-free status not specified in the verified web data.