EP4SGX360NF45C2 - Stratix IV GX FPGA, 353.6K LEs, 1932-FCBGA | Intel
부품 번호: EP4SGX360NF45C2 ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $2850 | $2,850.00 |
| 10 | $2695 | $26,950.00 |
| 100 | $2450 | $245,000.00 |
| 500 | $2240 | $1,120,000.00 |
| 1,000 | $2050 | $2,050,000.00 |
EP4SGX360NF45C2 개요
An FPGA (Field-Programmable Gate Array) is a programmable logic device that allows engineers to implement custom digital circuits through configurable logic blocks (CLBs/LABs), routing resources, and hard IP blocks such as transceivers, DSP blocks, and memory controllers. FPGAs sit in the system hierarchy between ASICs and programmable logic controllers, offering higher integration than discrete logic while avoiding the NRE cost of ASICs.
Key features of the EP4SGX360NF45C2 include 920 user I/Os, 23,105,536 bits of embedded RAM, embedded DSP blocks for high-throughput signal processing, hard PCI Express Gen1/Gen2 IP cores, and support for external memory interfaces including DDR3, DDR2, and QDRII+. The device operates from a 0.9 V core supply with separate transceiver and auxiliary rails, and the C2 speed grade indicates a commercial temperature range of 0 °C to +85 °C.
The Stratix IV GX architecture combines an Adaptive Logic Module (ALM) fabric with up to 8.5 Gbps embedded transceivers, allowing the part to bridge parallel digital logic and high-speed serial links in a single device. Transceiver-rich FPGAs such as this one are commonly used to implement custom protocol bridges, high-speed data acquisition front-ends, and digital signal processing pipelines.
Typical applications include high-speed serial protocol bridging (PCIe, Serial RapidIO, XAUI, SFI), wireless baseband processing, test and measurement instrumentation, broadcast video processing, and defense/aerospace signal processing systems. The wide 920-I/O pin count and 1932-ball FCBGA package suit dense, multi-rail PCB designs where transceiver performance and logic density are both required.
When designing with this part, allocate dedicated 100 Ω differential transceiver reference clock routing, follow Intel power-on and configuration sequencing guidelines, and provide sufficient decoupling for the 0.9 V core. The 1932-ball FCBGA requires an advanced multi-layer PCB with controlled-impedance stackup, and high-speed transceiver channels need careful channel-length matching for jitter compliance.
This page synthesizes distributor pricing, Stratix IV GX family alternatives, and practical design notes not found in the manufacturer datasheet alone.
드롭인 대체품: EP4SGX360NF45C2 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP4SGX360NF45C2 (동일 폼 팩터 및 풋프린트) — 차이점: Speed Grade, Operating Temperature, Package, Transceivers, Process Technology.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP4SGX360NF45I4
✅ 드롭인✓ 재고 있음
$2350 / 개
데이터시트 보기 →EP4SGX360NF45I4N
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$3120 / 개
데이터시트 보기 →EP4SGX360NF45I3N
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$3925 / 개
데이터시트 보기 →EP4SGX360NF45C2 최대 정격 & 전기적 특성
| Family | Stratix IV GX |
| Logic Elements | 353,600 |
| Logic Array Blocks (LABs) | 14,144 |
| Maximum User I/Os | 920 |
| Embedded Memory (bits) | 23,105,536 |
| Number of Transceivers | Up to 24 |
| Maximum Transceiver Data Rate | 8.5 Gbps |
| Process Technology | 40 nm |
| Core Voltage | 0.9 V |
| 패키지 | 1932-ball FCBGA (NF45) |
| Speed Grade | C2 (commercial) |
| 동작 온도 | 0 °C to +85 °C |
| 실장 유형 | Surface Mount |
| RoHS 상태 | Compliant |
| Configuration Interface | FPGA configuration via JTAG / passive / active serial |
EP4SGX360NF45C2 1932-ball fcbga (nf45) 핀 구성 가이드
EP4SGX360NF45C2(1932-ball fcbga (nf45) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP4SGX360NF45C2.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP4SGX360NF45C2 적합 용도: 6 애플리케이션s: PCI Express Gen2 Endpoint / Root Complex, High-Speed Serial Protocol Bridging, Wireless Baseband Processing, Test & Measurement Instrumentation, Broadcast Video Processing, Defense & Aerospace Signal Processing.
PCI Express Gen2 Endpoint / Root Complex
The EP4SGX360NF45C2 is well-suited for PCI Express Gen2 applications because it integrates up to 24 hard transceivers capable of 8.5 Gbps, the data rate required for PCIe Gen2 x1/x4/x8 lanes. The hard PCIe Gen1/Gen2 IP cores within the Stratix IV GX architecture eliminate the need to implement the protocol in soft logic, freeing the 353,600 logic elements and DSP blocks for endpoint or root-complex functionality. The 23,105,536-bit embedded memory serves as large on-chip DMA buffers, while 920 user I/Os provide ample parallel side-band signaling.
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High-Speed Serial Protocol Bridging
The EP4SGX360NF45C2 enables bridging between high-speed serial standards such as Serial RapidIO, XAUI, SFI, and proprietary 8 Gbps links thanks to its 24 embedded transceivers. Each transceiver channel supports 8.5 Gbps, allowing multiple independent links to run concurrently from a single device. The 40 nm Stratix IV GX fabric implements PCS/PMA adaptation in hardware IP, while the 353,600 LEs handle packet buffering, queue management, and protocol translation. The 1932-ball NF45 FCBGA exposes the maximum I/O and transceiver complement.
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Wireless Baseband Processing
The EP4SGX360NF45C2 supports wireless baseband signal chains by combining DSP-rich fabric, embedded memory, and high-speed serial I/O. The 40 nm Stratix IV GX DSP blocks implement FFT/iFFT, channel estimation, and MIMO detection at sample rates exceeding 300 MHz per block. The 23 Mb embedded memory accommodates symbol-rate buffers and channel-state tables without external SRAM, while the 24 transceivers provide CPRI/OBSAI fronthaul links to remote radio heads. The 1932-ball FCBGA suits compact 6U/VPX baseband cards.
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Test & Measurement Instrumentation
The EP4SGX360NF45C2 is used in high-end test and measurement instruments where simultaneous high-speed serial acquisition, deep on-chip memory, and parallel DSP are required. The 8.5 Gbps transceivers capture multi-Gsps ADC data streams, the 23 Mb embedded RAM acts as a deep capture buffer, and the 353,600 LEs implement real-time FFT, decimation, and triggering logic. The 920 user I/Os provide trigger, GPIO, and parallel data interfaces to host processors or display controllers.
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Broadcast Video Processing
The EP4SGX360NF45C2 handles broadcast video processing pipelines including SDI de/embedding, format conversion, and multi-stream multiplexing. The 24 transceivers aggregate 3G-SDI/HD-SDI inputs at up to 8.5 Gbps, while 920 user I/Os connect to DDR3 frame buffers and HDMI/DVI output bridges. The Stratix IV GX fabric implements scaling, color-space conversion, and overlay logic. The 1932-ball FCBGA package meets the multi-rail power and high-I/O demands of broadcast router and processing cards.
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Defense & Aerospace Signal Processing
The EP4SGX360NF45C2 supports defense and aerospace signal processing subsystems such as radar front-ends, electronic warfare receivers, and secure communications. The 24 transceivers handle wideband RF digitizer data links, the 23 Mb embedded memory captures pulse bursts and beamforming weights, and the 353,600 LEs implement FFT, beam steering, and protocol stacks. The 1932-ball FCBGA meets ruggedized PCB requirements; for harsh-temperature deployments, choose the I-grade variant EP4SGX360NF45I4.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP4SGX360NF45C2 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP4SGX360NF45I4 | EP4SGX360NF45I4N | EP4SGX360NF45I3N | EP4SGX360KF43C2 |
|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel |
| Package | 1932-ball FCBGA (NF45) | 1932-ball FCBGA (NF45) - same | 1932-ball FCBGA (NF45) - same | 1932-ball FCBGA (NF45) - same | 1760-ball FCBGA (KF43) - different |
| Logic Elements | 353,600 | 353,600 | 353,600 | 353,600 | 353,600 |
| Transceivers | 24 @ 8.5 Gbps | 24 @ 8.5 Gbps | 24 @ 8.5 Gbps | 24 @ 8.5 Gbps | |
| Embedded Memory | 23,105,536 bits | 23,105,536 bits | 23,105,536 bits | 23,105,536 bits | |
| Speed Grade | C2 (commercial) | I4 (industrial) | I4 (industrial) | I3 (industrial) | C2 (commercial) |
| Operating Temperature | 0 °C to +85 °C | -40 °C to +100 °C | -40 °C to +100 °C | 0 °C to +85 °C |
주요 차별점
- Maximum-density Stratix IV GX configuration in the 1932-ball NF45 FCBGA package (vs EP4SGX360KF43C2)
- Transceiver-rich 8.5 Gbps SERDES count (vs EP4CGX150DF31I7 (Cyclone IV GX))
- Pin-compatible commercial/industrial flexibility via drop-in I-grade variant (vs EP4SGX360NF45I4)
설계 노트
The EP4SGX360NF45C2 requires multiple power rails: 0.9 V core, 1.1 V PLL analog, 1.5 V/1.8 V/2.5 V/3.0 V I/O banks, and dedicated transceiver supply rails (VCCR, VCCT, VCCA, VCCH). Decoupling follows Intel Stratix IV GX guidelines with high-frequency ceramics placed adjacent to each rail pin and bulk capacitors distributed across the PCB. Power-on sequencing is critical: the core must ramp before I/O or transceiver rails to avoid back-powering. Estimated: at full fabric utilization with all 24 transceivers active, total board power can exceed 20 W - verify with the Intel PowerPlay early power estimator before layout.
The 1932-ball NF45 FCBGA requires an advanced HDI PCB stackup, typically 12+ layers with 0.4 mm or 0.5 mm pitch BGA breakout. Use microvia-in-pad or staggered microvia construction to fan out the dense ball grid; signal layers should use 50 Ω controlled impedance for single-ended and 100 Ω differential for transceiver pairs. Transceiver channels demand matched-length routing, length-matched to within 25 mils for Gen2 SERDES jitter compliance. Place AC-coupling capacitors as close to the transmitter pins as possible per Intel SERDES guidelines.
Each of the 24 transceivers supports up to 8.5 Gbps and requires strict SI discipline: reference clock lines must be 100 Ω differential with length-matched to within 5 mils, and AC-coupling must be placed on transmit paths at the FPGA pin side. Cross-talk from adjacent channels is the dominant jitter contributor; route transceiver pairs with at least 3W spacing and guard traces. Use IBIS-AMI simulations during layout sign-off to validate eye mask margin for PCIe Gen2 and 8G FC protocols.
Common design pitfalls include omitting JTAG chain provisioning for configuration debugging, neglecting CONFIG_DATA and MSEL pin pull-ups, and using single-ended reference clocks instead of the LVDS/HCSL differential clock required for transceiver operation. Additionally, the 1932-ball FCBGA requires precise reflow profile control to avoid BGA voiding - follow J-STD-020 moisture sensitivity level (MSL) handling and Intel-recommended reflow profiles. Estimated: typical Stratix IV GX programming time over JTAG is 10-30 seconds for full configuration; do not assume instant boot in boot-loader firmware design.
규정 준수 정보
RoHS compliant per Intel Altera product page. Not AEC-Q100 qualified (industrial-grade AEC-Q100 variants exist separately in Intel FPGA families). Halogen-free status not explicitly confirmed in the verified data - marked unknown.
