EP4SGX530HH35C2NES - 531K LE Stratix IV GX FPGA, 1152-FCBGA
부품 번호: EP4SGX530HH35C2NES ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $4850 | $4,850.00 |
| 10 | $4620 | $46,200.00 |
| 100 | $4310 | $431,000.00 |
| 500 | $3995 | $1,997,500.00 |
| 1,000 | $3750 | $3,750,000.00 |
EP4SGX530HH35C2NES 개요
A Field-Programmable Gate Array (FPGA) is a semiconductor device whose digital logic, interconnect, and I/O behavior are defined by user-supplied configuration data after manufacture. FPGAs sit at the top of the programmable-logic hierarchy - below them are CPLDs (smaller, non-volatile, glue-logic oriented) and above them are ASICs (volume-optimized fixed-function ICs). The Stratix IV GX family specifically combines high logic density with up to 24 transceivers supporting multi-gigabit serial protocols, positioning the device between pure logic-centric FPGAs and dedicated SerDes ASSPs.
Key features of this part include 531,200 logic elements, 28,033,024 bits of embedded memory, dedicated DSP blocks for fixed- and floating-point arithmetic, 8.5 Gbps-capable transceivers on Stratix IV GX, and a configuration controller supporting passive, active, and JTAG programming modes. The 1152-ball FCBGA package exposes 564 user I/Os with mixed-voltage support through banked I/O structures, and the flip-chip thermal interface enables sustained operation in space-constrained line cards.
Architecturally, the EP4SGX530HH35C2NES uses Adaptive Logic Modules (ALMs) feeding a hierarchical routing fabric, with M20K and MLAB memory blocks distributed column-wise, and variable-precision DSP blocks adjacent to those columns. Compared with the preceding Stratix III family, Stratix IV adds 8.5 Gbps transceivers and improved power management through hard PCIe Gen1/Gen2 IP blocks; compared with the successor Stratix V, the device trades lower power and higher transceiver rate (up to 14.1 Gbps) for the lower cost per logic element that the mature 40 nm process enables.
Typical applications include high-performance digital signal processing in defense radar and electronic-warfare systems, ASIC prototyping for networking ASICs, multi-gigabit serial backplane aggregation in telecom line cards, video broadcast infrastructure with on-chip transceivers, and high-throughput PCIe Gen2 endpoint designs. The device's combination of logic density and integrated transceivers lets designers replace multiple smaller FPGAs or a discrete SerDes plus FPGA pair with a single component.
When designing with this device, ensure the PCB supports the FCBGA's 1.0 mm ball pitch with matched-length impedance control for transceiver lanes, and provide a multi-rail power solution (typically 0.9 V core, 1.1 V PLL, 2.5 V/3.3 V I/O banks) with proper sequencing. Thermal management must consider that the flip-chip BGA draws heat primarily through the balls and PCB copper; a heatsink or thermal interface material is required for sustained full-operation workloads.
This page synthesizes distributor pricing for the EP4SGX530HH35C2NES, same-package Stratix IV GX alternatives from the Site MPN list, and practical design notes that complement - rather than duplicate - the manufacturer datasheet.
드롭인 대체품: EP4SGX530HH35C2NES — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP4SGX530HH35C2NES (동일 폼 팩터 및 풋프린트) — 차이점: Package, Family, Speed Grade, Mounting Type, Operating Temperature.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP4SGX530HH35C2N
✅ 드롭인✓ 재고 있음
$3500 / 개
데이터시트 보기 →EP4SGX530HH35C2
✅ 드롭인✓ 재고 있음
$4500 / 개
데이터시트 보기 →EP4SGX360HF35C2N
✅ 드롭인✓ 재고 있음
$3295 / 개
데이터시트 보기 →EP4SGX360HF35C2
✅ 드롭인✓ 재고 있음
$9750 / 개
데이터시트 보기 →EP4SGX290NF45C2N
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
EP4SGX530HH35C2NES 최대 정격 & 전기적 특성
| Family | Stratix IV GX |
| Device Logic Elements | 531,200 |
| Logic Cells / Logic Blocks | 21248 (per FindIC summary) |
| Total Memory Bits | 28,033,024 |
| User I/O Count | 564 |
| Operating Voltage (Core) | 0.9 V |
| Process Technology | 40 nm |
| 패키지 | 1152-ball FC-HFBGA (Flip-Chip), 42.5 x 42.5 mm |
| 핀 수 | 1152 |
| Internal Frequency (max) | 800 MHz |
| 동작 온도 | 0 C to 85 C (commercial) |
| Configuration Method | Passive / Active / JTAG |
| 실장 유형 | Surface Mount (BGA) |
EP4SGX530HH35C2NES 1152-ball fc-hfbga (flip-chip), 42.5 x 42.5 mm 핀 구성 가이드
EP4SGX530HH35C2NES(1152-ball fc-hfbga (flip-chip), 42.5 x 42.5 mm 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP4SGX530HH35C2NES.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP4SGX530HH35C2NES 적합 용도: 6 애플리케이션s: Multi-Gigabit Serial Backplane Aggregation, ASIC Prototyping and Emulation, High-Throughput DSP for Radar and EW, PCIe Gen2 Endpoint and Bridge Designs, Broadcast Video Processing and Routing, Industrial High-Speed Test and Measurement.
Multi-Gigabit Serial Backplane Aggregation
The EP4SGX530HH35C2NES is well suited for multi-gigabit serial backplane aggregation in telecom line cards. With 8.5 Gbps-capable transceivers integrated alongside 531,200 logic elements, the device can terminate multiple SFP+/XFP links while running L2/L3 forwarding in fabric logic. The 0.9 V core and banked I/O structure simplify mixed-voltage PCB design where the backplane operates at 1.5 V or 1.8 V while control signals run at 2.5 V, and the 1152-ball FC-HFBGA provides the I/O count required to break out 24+ serial lanes plus parallel sideband signals.
추천
ASIC Prototyping and Emulation
With 531,200 logic elements and 28,033,024 memory bits, the EP4SGX530HH35C2NES emulates mid-complexity ASICs on a single device. The Stratix IV GX architecture preserves timing fidelity to 28 nm ASIC targets, and Quartus Prime supports industry-standard synthesis flows (Synopsys Design Compiler, Mentor Questa) for ASIC netlist bring-up. The 1152-ball FC-HFBGA exposes sufficient I/O to break out full-duplex buses between FPGA domains when multiple boards are stacked, which is critical for sub-system emulation at clock speeds approaching the production ASIC rate.
추천
High-Throughput DSP for Radar and EW
The EP4SGX530HH35C2NES delivers the DSP block count and memory bandwidth required for defense radar and electronic-warfare signal processing. Embedded variable-precision DSP blocks run fixed-point FFTs and pulse-Doppler processing at hundreds of MSPS, and M20K memory blocks stage coefficients and intermediate vectors at line rate. Operating over the commercial 0 C to 85 C range, the part suits ground-based and shipboard installations; for airborne platforms the I-grade variant would be required instead of the C2 commercial bin.
추천
PCIe Gen2 Endpoint and Bridge Designs
The Stratix IV GX hard PCIe Gen1/Gen2 IP blocks integrated into the EP4SGX530HH35C2NES simplify endpoint and bridge designs for storage controllers, frame grabbers, and high-speed data-acquisition cards. Combined with 564 user I/O for parallel sensor interfaces and 8.5 Gbps transceivers for external serial links, the device can simultaneously serve a PCIe x8 link and several SFP+ side channels. The flip-chip BGA delivers the thermal headroom needed for sustained x8 Gen2 traffic at 5 GTps in compact card form factors.
추천
Broadcast Video Processing and Routing
Broadcast video routers and frame synchronizers benefit from the EP4SGX530HH35C2NES's combination of high logic density, M20K memory for line buffers, and multi-gigabit transceivers for SDI over coax (3G-SDI / 6G-SDI / 12G-SDI) or 10GbE IP-based video. A single device can ingest, frame-sync, and re-route multiple 12G-SDI streams while leaving logic headroom for up/down/cross conversion. The 564 user I/O support HDMI/DisplayPort side-channel control planes in mixed-signal broadcast equipment without requiring an external bridge chip.
추천
Industrial High-Speed Test and Measurement
The EP4SGX530HH35C2NES is a strong fit for high-channel-count oscilloscopes, logic analyzers, and protocol exercisers where 564 user I/O enable wide parallel capture buses while the 8.5 Gbps transceivers handle serial protocol decode. The 28 Mb of embedded memory supports deep acquisition buffers, and the variable-precision DSP blocks accelerate on-FPGA FFT and eye-diagram analysis. The 1152-ball FC-HFBGA's thermal performance sustains continuous 100% utilization in fan-cooled benchtop instruments.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP4SGX530HH35C2NES — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP4SGX530HH35C2N | EP4SGX530HH35C2 | EP4SGX360HF35C2N | EP4SGX360HF35C2 | EP4SGX290NF45C2N |
|---|---|---|---|---|---|---|
| Package | 1152-ball FC-HFBGA (42.5 x 42.5 mm) | 1152-ball FC-HFBGA - same | 1152-ball FC-HFBGA - same | 1152-ball FC-HFBGA - same | 1152-ball FC-HFBGA - same | 1152-ball FC-HFBGA family - same |
| Brand | Altera | Altera | Altera | Altera | Altera | Altera |
| Logic Elements | 531,200 | 531,200 (100%) | 531,200 (100%) | 360,000 (-32%) | 360,000 (-32%) | 290,000 (-45%) |
| Core Voltage | 0.9 V | 0.9 V | 0.9 V | 0.9 V | 0.9 V | 0.9 V |
| Speed Grade | C2 (commercial) | C2 | C2 | C2 | C2 | C2 |
| Temperature Range | 0 C to 85 C (commercial) | 0 C to 85 C | 0 C to 85 C | 0 C to 85 C | 0 C to 85 C | 0 C to 85 C |
| Ordering Code Status | ES (engineering sample) | Production | Production | Production | Production | Production |
| Lifecycle Status | NRND | NRND | NRND | NRND | NRND | NRND |
주요 차별점
- Highest-density Stratix IV GX option in the same 1152-ball FC-HFBGA (vs EP4SGX360HF35C2N)
- Direct ordering-code upgrade path to factory-traced production (vs EP4SGX530HH35C2N)
- Integrated 8.5 Gbps transceivers reduce BOM cost (vs Cyclone IV GX EP4CGX75CF23C7)
설계 노트
Estimated: a Stratix IV GX device at 0.9 V core with 531,200 LEs and 8.5 Gbps transceivers running typical workloads draws approximately 8-15 W core current, peaking near 20 W during full-utilization benchmarks. Plan a 0.9 V regulator rated at least 25 A with 1.1 V PLL and 2.5 V/3.3 V bank rails that share a common sequencing controller to enforce Altera's recommended power-up order: VCC (0.9 V) first, then VCC_PLL, then VCCIO banks last. Failure to sequence properly risks latch-up at power-on.
The 1152-ball FC-HFBGA dissipates heat primarily through the ball grid and PCB copper, not through the top of the package. Estimated: at 15 W dissipation and a JEDEC JESD51-9 still-air board, junction-to-ambient thermal resistance is roughly 8-12 C/W, requiring at least 1 sq in of inner-plane copper per quadrant plus a thermal interface material and heatsink for sustained full-utilization operation. Without a heatsink, derate ambient or workload duty cycle to keep Tj below 100 C.
The 1.0 mm ball pitch on the 1152-ball FC-HFBGA requires laser-drilled or sequential-lamination microvia stackups. All transceiver lanes must use controlled-impedance differential routing (typically 100 ohm differential) with length matching within the budgets the Stratix IV GX handbook specifies per protocol (PCIe, XAUI, CEI-6G). Decoupling: place 0402/0201 ceramics as close to each power ball as possible, with a bulk capacitor bank at the voltage regulator output.
Do not power up the EP4SGX530HH35C2NES without confirming the MSEL configuration mode pins are set correctly; mis-set MSEL can put the device in an unsupported configuration state and prevent JTAG access. Also, the 8.5 Gbps transceivers require their own dedicated supply decoupling and a continuous reference clock; absence of a clean reference will prevent transceiver link-up regardless of logic design. Finally, prefer Quartus Prime Programmer over the legacy Quartus II Programmer for newer programming file formats on this part.
규정 준수 정보
Compliance data not present in the verified web data summaries. For RoHS/lead-free status, consult the Altera/Intel material-composition declaration (MCD) for the specific lot and date code.
