EP4SGX530HH35C4N - 531K LE Stratix IV GX FPGA | Intel | 1152-FCBGA
부품 번호: EP4SGX530HH35C4N ⚠ 최종 구매| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $4850 | $4,850.00 |
| 10 | $4520 | $45,200.00 |
| 100 | $4180 | $418,000.00 |
| 500 | $3850 | $1,925,000.00 |
| 1,000 | $3490 | $3,490,000.00 |
EP4SGX530HH35C4N 개요
What is an FPGA? A Field-Programmable Gate Array is a semiconductor device containing configurable logic blocks (CLBs/LABs), programmable interconnect, and dedicated hard IP such as transceivers, multipliers, and memory blocks. FPGAs occupy a tier between general-purpose microcontrollers and fixed-function ASICs: they offer hardware-level parallelism for data-path acceleration while remaining re-programmable in the field, making them ideal for prototyping, low-volume production, and workloads where time-to-market outweighs per-unit silicon cost.
Key features of the EP4SGX530HH35C4N include a deep logic fabric (531K LEs) for parallel datapath implementation, abundant embedded RAM (28 Mb) for packet buffering and DSP coefficient storage, 24x 8.5 Gbps transceivers typical of Stratix IV GX, and dedicated DSP blocks for high-throughput fixed- and floating-point arithmetic. The 1152-ball FCBGA package exposes 564 user I/Os and provides the signal-integrity margin needed for DDR3 memory interfaces and multi-lane serial links running at full transceiver line rate.
Architecturally, the Stratix IV GX family uses adaptive logic modules (ALMs) paired with MLAB memory, 9-Kbit M9K blocks and larger M144K blocks, hardened PCI Express and serial RapidIO cores, and up to 36 transceiver channels per device. Compared with Stratix III, the IV generation refined the routing architecture, lowered static power, and increased the maximum transceiver data rate, while preserving Quartus II compatibility for design reuse.
Typical applications include high-end wired telecommunications line cards, 40G/100G Ethernet aggregation, military radar and signal-intelligence platforms, ASIC prototyping for compute accelerators, medical imaging pipelines such as CT and MRI reconstruction, and broadcast video processing. The combination of high logic density, abundant transceivers, and large embedded memory makes the EP4SGX530HH35C4N well-suited to throughput-bound designs where a CPU/GPU alone is insufficient.
Design consideration: the 1152-ball FCBGA requires a multi-layer PCB with controlled-impedance routing for the transceiver lanes, matched-length skew management for memory interfaces, and a substantial thermal solution. Engineers should plan for at least 8 PCB layers, high-decoupling-count power distribution, and a heatsink rated for the device's thermal-design-power envelope before committing to the package.
This page synthesizes Stratix IV GX die and package specifications, current distributor availability, drop-in and pin-compatible Stratix IV family alternatives, and practical PCB/thermal design guidance not aggregated on a single manufacturer page.
드롭인 대체품: EP4SGX530HH35C4N — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP4SGX530HH35C4N (동일 폼 팩터 및 풋프린트) — 차이점: Package, Operating Temperature, Transceivers, Speed Grade, Mounting Type.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP4SGX530HH35C4
✅ 드롭인✓ 재고 있음
$3120 / 개
데이터시트 보기 →EP4SGX530HH35C3N
✅ 드롭인✓ 재고 있음
$13200 / 개
데이터시트 보기 →EP4SGX530HH35C3
✅ 드롭인✓ 재고 있음
$2398 / 개
데이터시트 보기 →EP4SGX530HH35C2NES
✅ 드롭인✓ 재고 있음
$3750 / 개
데이터시트 보기 →EP4SGX530HH35C2N
✅ 드롭인✓ 재고 있음
$3500 / 개
데이터시트 보기 →EP4SGX530HH35C2
✅ 드롭인✓ 재고 있음
$4500 / 개
데이터시트 보기 →EP4SGX530HH35C4N 최대 정격 & 전기적 특성
| Family | Stratix IV GX |
| Logic Elements | 531,200 |
| Logic Array Blocks (LABs) | 21,248 |
| Total RAM Bits | 28,033,024 (approximately 28 Mb) |
| User I/O Pins | 564 |
| Process Technology | 40 nm CMOS |
| Core Voltage (typical) | 0.9 V |
| Speed Grade | C4 |
| Temperature Grade | Commercial |
| 패키지 | 1152-ball FCBGA (Flip-Chip BGA) |
| Transceivers | Up to 24 channels at up to 8.5 Gbps (family maximum) |
| 실장 유형 | Surface Mount (BGA) |
| Lead-Free / RoHS | Yes (RoHS compliant per N designator) |
| 수명 주기 상태 | Last Time Buy (mature device, recommended for new designs migrating to Stratix 10 or Agilex) |
EP4SGX530HH35C4N 1152-ball fcbga (flip-chip bga) 핀 구성 가이드
EP4SGX530HH35C4N(1152-ball fcbga (flip-chip bga) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP4SGX530HH35C4N.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP4SGX530HH35C4N 적합 용도: 7 애플리케이션s: 40G/100G Ethernet Line Card Aggregation, Military Radar and SIGINT Signal Processing, ASIC Prototyping for Compute Accelerators, Medical Imaging (CT / MRI Reconstruction), Broadcast Video Processing and Conversion, High-Performance DSP Test and Instrumentation, Storage Acceleration (SSD Controllers / NVMe-oF).
40G/100G Ethernet Line Card Aggregation
The EP4SGX530HH35C4N's 531,200 logic elements and 28 Mb embedded RAM let it aggregate multiple 10G/40G Ethernet links into a single 100G uplink while sustaining line rate. The 24 transceivers at up to 8.5 Gbps (CAUI-4 / 4x10G or direct 10G lanes) feed soft MAC IP and traffic-management blocks. Compared with a CPU/DPU-based implementation, this FPGA approach delivers deterministic latency below 1 microsecond and parallel lookup throughput that a sequential processor cannot match. The 564 user I/Os expose parallel DDR3/QSFP interfaces and CPU-side control planes.
추천
Military Radar and SIGINT Signal Processing
The EP4SGX530HH35C4N is well-suited to wideband radar and signal-intelligence platforms thanks to its 28 Mb embedded RAM (ample for windowed FFT coefficient storage), 18x18-bit multipliers in DSP blocks, and 564 user I/Os for ADC/DAC interfaces such as JESD204B. Its 24 transceivers connect directly to RF front-end ADCs and inter-card serial backplanes. The 40 nm Stratix IV process tolerates the sustained high toggle rates of beamforming and direction-finding pipelines, where a microcontroller-class DSP would be vastly underpowered.
추천
ASIC Prototyping for Compute Accelerators
With 531,200 logic elements, the EP4SGX530HH35C4N can prototype near-full ASIC workloads and validate RTL on real hardware months before tape-out. Multiple Stratix IV FPGAs can be bridged via their 8.5 Gbps transceivers to emulate multi-die SoCs, with the abundant embedded RAM acting as shared cache. Quartus II's incremental compile flow and multi-FPGA partitioning tools target this application directly. The 1152-ball FCBGA and high I/O count expose all prototype signals to validation probes and external logic analyzers.
추천
Medical Imaging (CT / MRI Reconstruction)
The EP4SGX530HH35C4N accelerates back-projection, FBP, and iterative-reconstruction pipelines in CT and MRI scanners where deterministic latency and parallel arithmetic are critical. Its DSP blocks process 18x18 multiplications at hundreds of MHz per slice, while the 28 Mb embedded RAM holds intermediate projection data without round-tripping to external memory. The 564 user I/Os accept parallel ADC inputs from detector arrays and push processed slices to display controllers via LVDS or embedded DisplayPort.
추천
Broadcast Video Processing and Conversion
The EP4SGX530HH35C4N performs format conversion, color-space transformation, and multi-stream upscaling/downscaling for broadcast studios. Its 24 transceivers accept SDI inputs at 3G/6G/12G rates, while the 564 user I/Os drive HDMI/DisplayPort outputs and SDRAM frame buffers. Compared with a GPU-based broadcast pipeline, the FPGA approach offers deterministic frame latency and stable jitter for live production environments where frame drops are unacceptable.
추천
High-Performance DSP Test and Instrumentation
The EP4SGX530HH35C4N is a strong fit for arbitrary-waveform generators, real-time spectrum analyzers, and protocol testers that demand parallel DSP at multi-GSPS rates. Its transceivers capture and emit digitized waveforms to ADCs and DACs running at the FPGA's full I/O rate, while the embedded RAM accumulates deep capture records for FFT processing. Designers benefit from Quartus II's DSP Builder toolchain, which translates MATLAB/Simulink DSP models directly into FPGA fabric.
추천
Storage Acceleration (SSD Controllers / NVMe-oF)
The EP4SGX530HH35C4N accelerates NVMe-over-Fabrics and high-endurance SSD controllers by parallelizing RAID parity, deduplication, and encryption across many NAND channels simultaneously. Its 564 user I/Os expose ONFI/Toggle NAND buses, while transceivers carry PCIe Gen2/Gen3 and 10/25/40 GbE uplinks. Embedded RAM buffers FTL lookups and write coalescing, dramatically reducing host-facing latency compared with a CPU-driven controller at the same throughput.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP4SGX530HH35C4N — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP4SGX530HH35C4 | EP4SGX530HH35C3N | EP4SGX530HH35C3 | EP4SGX530HH35C2NES | EP4SGX530HH35C2N | EP4SGX530HH35C2 |
|---|---|---|---|---|---|---|---|
| Package | 1152-ball FCBGA (HH35) | 1152-ball FCBGA - same | 1152-ball FCBGA - same | 1152-ball FCBGA - same | 1152-ball FCBGA - same | 1152-ball FCBGA - same | 1152-ball FCBGA - same |
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel | Intel |
| Speed Grade | C4 (slower mid-bin) | C4 (same) | C3 (faster) | C3 (faster) | C2 (slowest, ES) | C2 (slowest) | C2 (slowest) |
| Logic Elements | 531,200 | 531,200 - same | 531,200 - same | 531,200 - same | 531,200 - same | 531,200 - same | 531,200 - same |
| User I/Os | 564 | 564 - same | 564 - same | 564 - same | 564 - same | 564 - same | 564 - same |
| Embedded RAM | 28,033,024 bits (~28 Mb) | 28 Mb - same | 28 Mb - same | 28 Mb - same | 28 Mb - same | 28 Mb - same | 28 Mb - same |
| Process / Family | 40 nm Stratix IV GX | 40 nm Stratix IV GX - same | 40 nm Stratix IV GX - same | 40 nm Stratix IV GX - same | 40 nm Stratix IV GX - same | 40 nm Stratix IV GX - same | 40 nm Stratix IV GX - same |
| RoHS / Lead-Free | Yes (N designator) | Yes (lead-free) | Yes (N designator) | Yes (lead-free) | Yes (N designator, ES) | Yes (N designator) | Yes (lead-free) |
주요 차별점
- C4 speed grade offers balanced cost-to-timing-margin for non-critical-path designs (vs EP4SGX530HH35C3N)
- Highest logic density in the Stratix IV GX family (vs EP4SGX290NF45I4N)
- 24 transceivers at up to 8.5 Gbps support modern serial interfaces (vs EP4SE530H35C4N (Stratix IV E))
설계 노트
Estimated: at 0.9 V core, ~22 W core power with 6 W transceiver power yields approximately 28 W total dissipation. With a typical FCBGA theta_JA of 8-10 C/W (still air), the junction temperature would exceed the 100 C commercial limit. A passive heatsink plus 200 LFM airflow, or a cold-plate for industrial use, is mandatory. Apply thermal interface material rated for BGA packages; avoid thermal pads exceeding 0.15 mm thickness.
Use a minimum 8-layer PCB stack-up with two solid ground planes adjacent to the BGA break-out layer. The 1152-ball FCBGA at 1.0 mm pitch requires laser-drilled micro-vias for inner-row escape routing. Matched-length skew tuning is mandatory for transceiver lanes (target within 5 ps) and DDR3 byte lanes (target within 25 ps). Follow Intel/Altera's Stratix IV GX High-Speed Design Guidelines for stack-up and de-coupling recommendations.
Do not use the EP4SGX530HH35C2N (slower C2 grade) as a drop-in for a C4 design without re-running timing closure - Quartus II will report negative slack on critical paths. Conversely, migrating up from C4 to C3 is usually a transparent timing-margin improvement. Always verify transceiver pre-emphasis and VOD settings after PCBA rework; reflow profile must stay within JEDEC J-STD-020 MSL3 or better, depending on storage history.
Place the configuration flash (EPCS64 or compatible) within 2 inches of the FPGA's MSEL/ASDATA0 pins with a short, impedance-controlled trace. Keep the JTAG chain off the high-speed serial lanes to avoid crosstalk. Decoupling strategy: at least 40 low-ESL 0402 capacitors around the BGA perimeter (0.1 uF and 1 uF mix), plus four 220 uF bulk capacitors on the 0.9 V and 1.1 V planes close to the VRM inductors.
규정 준수 정보
RoHS compliance indicated by N designator in MPN. REACH compliance inferred from Intel/Altera's standard declarations for Stratix IV family. Not AEC-Q100 qualified (commercial/industrial temperature grade only). Last-time-buy lifecycle status; new automotive designs should consider Cyclone IV or Cyclone V automotive variants.
