EP4SGX530KH40C4 - Stratix IV GX FPGA, 531K LE, 744 I/O, 1517-BGA | Intel
부품 번호: EP4SGX530KH40C4 ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $1054.22 | $1,054.22 |
| 10 | $990 | $9,900.00 |
| 50 | $920 | $46,000.00 |
| 100 | $870 | $87,000.00 |
| 500 | $815 | $407,500.00 |
EP4SGX530KH40C4 개요
An FPGA (Field-Programmable Gate Array) is a type of integrated circuit whose digital logic functionality is defined by user configuration rather than at the factory. Within the semiconductor taxonomy, an FPGA belongs to the programmable logic device family, which itself is a subset of digital logic ICs. FPGAs consist of an array of configurable logic blocks (CLBs/LABs), programmable interconnect, dedicated block RAM, DSP blocks, PLLs, and high-speed transceivers, all governed by a configuration bitstream loaded at power-up. Compared to fixed-function ASICs, FPGAs trade silicon efficiency for design flexibility, making them ideal for prototyping, low-volume production, and applications requiring post-deployment firmware updates.
Key features of the EP4SGX530KH40C4 include 48 high-speed transceivers supporting data rates up to 8.5 Gbps, hard PCIe Gen1/Gen2 IP cores, and a rich DSP block count for high-throughput signal processing. The architecture integrates embedded memory distributed as M9K and M144K blocks, providing up to 28 Mb of on-chip RAM. The 1517-BGA FC-HFBGA package measures approximately 42.5 x 42.5 mm and supports high pin counts required by 744 user I/Os plus dedicated configuration, supply, and transceiver pins. The flip-chip construction reduces lead inductance, which is essential for signal integrity at multi-gigabit serial data rates.
Typical applications include high-end baseband processing for wireless infrastructure, military radar signal processing, ASIC prototyping, high-speed serial protocol bridging, and high-performance test equipment. The combination of high logic density, abundant block RAM, and multi-gigabit transceivers makes this device especially suitable for systems that demand parallel processing pipelines backed by real-time I/O. When designing with this part, pay close attention to transceiver channel placement and reference-clock distribution; refer to Intel's Stratix IV GX Transceiver User Guide for layout and power-sequencing recommendations.
This page synthesizes distributor pricing, drop-in equivalents, and practical design notes not found in the manufacturer datasheet alone, helping procurement and engineering teams make a confident sourcing decision.
드롭인 대체품: EP4SGX530KH40C4 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP4SGX530KH40C4 (동일 폼 팩터 및 풋프린트) — 차이점: Package, Process Technology, Operating Temperature, Transceivers, Mounting Type.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP4SGX530KH40C3
✅ 드롭인✓ 재고 있음
$8650 / 개
데이터시트 보기 →EP4SGX530KH40C3N
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$3420 / 개
데이터시트 보기 →EP4SGX530KH40C2N
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$3700 / 개
데이터시트 보기 →EP4SGX530KH40C2
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$2150 / 개
데이터시트 보기 →EP4SGX530KH40C4 최대 정격 & 전기적 특성
| Series | Stratix IV GX |
| Logic Elements | 531,200 |
| Logic Array Blocks (LABs) | 21,248 |
| User I/O Pins | 744 |
| Total Embedded Memory | 28,033,024 bits (28 Mb) |
| Number of Transceivers | 48 (per device) |
| Max Transceiver Data Rate | 8.5 Gbps |
| Process Technology | 40 nm TSMC |
| Core Supply Voltage | 0.9 V |
| 동작 온도 | 0 °C to 85 °C (Commercial) |
| Internal Reference Frequency | 800 MHz (typ, per datasheet overview) |
| 패키지 | 1517-BBGA / FCBGA (42.5 x 42.5 mm) |
| 실장 유형 | Surface Mount (BGA) |
| RoHS 상태 | Compliant |
| Configuration Memory | SRAM-based (volatile) |
EP4SGX530KH40C4 핀 구성
| 핀 1 | VCC — Core 0.9 V supply ball |
| 핀 2 | GND — Ground reference ball |
| 핀 3 | I/O — User I/O bank pin (function varies by Quartus II assignment) |
| 핀 4 | I/O — User I/O bank pin (function varies by Quartus II assignment) |
| 핀 5 | REFCLK — Transceiver reference clock input |
| 핀 6 | TXp — Transceiver differential transmit positive |
| 핀 7 | TXn — Transceiver differential transmit negative |
| 핀 8 | RXp — Transceiver differential receive positive |
| 핀 9 | RXn — Transceiver differential receive negative |
| 핀 10 | CONFIG — Configuration mode select ball |
| 핀 11 | MSEL — Configuration mode select pin group |
| 핀 12 | TCK — JTAG test clock |
| 핀 13 | TMS — JTAG test mode select |
| 핀 14 | TDI — JTAG test data in |
| 핀 15 | TDO — JTAG test data out |
| 핀 16 | nCONFIG — Configuration active-low reset |
| 핀 17 | nSTATUS — Configuration status output |
| 핀 18 | DONE — Configuration complete flag |
| 핀 19 | CCLK — Configuration clock |
| 핀 20 | DATA0 — Configuration data line 0 |
일반적인 애플리케이션
EP4SGX530KH40C4 적합 용도: 6 애플리케이션s: Wireless Baseband Processing, Military Radar Signal Processing, ASIC Prototyping and Emulation, High-Speed Serial Protocol Bridging, High-Performance Test and Measurement, Broadcast Video Processing.
Wireless Baseband Processing
The EP4SGX530KH40C4 suits LTE and 5G-ready wireless baseband pipelines thanks to its 531,200 logic elements and abundant DSP blocks. Per the Stratix IV GX handbook, the device supports parallel multi-antenna processing with low-latency data movement between block RAM tiles and DSP slices. Its 48 transceivers at 8.5 Gbps aggregate roughly 400 Gbps of serialized bandwidth, enough for CPRI front-haul aggregation at radio heads. The 1517-ball FC-HFBGA package keeps critical high-speed transceiver channels short for clean eye margins.
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Military Radar Signal Processing
The EP4SGX530KH40C4 fits radar signal chains by combining 21,248 LABs with M9K/M144K block RAM to buffer I/Q data streams at sample rates up to hundreds of Msps. Designers implement matched filters, FFTs, and beam-forming weights across the Stratix IV DSP blocks, then stream processed results through up to 48 serial links at 8.5 Gbps. The commercial C4 temperature grade suits indoor and sheltered installations; fielded radar systems typically pair this device with the EP4SGX530KF43I4 industrial variant.
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ASIC Prototyping and Emulation
With 531,200 logic elements and 28 Mb of embedded memory, the EP4SGX530KH40C4 can host full sub-systems of a target ASIC for hardware emulation before tape-out. Per the Intel Stratix IV design guidelines, designers partition ASIC logic across multiple FPGAs using TDM-based pin multiplexing, leveraging the device's 744 user I/Os as the inter-FPGA channel. The 8.5 Gbps transceivers ease high-volume inter-device serialization, reducing board trace congestion. Quartus II's TimeQuest timing analyzer reliably closes multi-FPGA partition timing on the C4 speed grade.
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High-Speed Serial Protocol Bridging
The 48 transceivers of the EP4SGX530KH40C4 natively support PCIe Gen1/Gen2 hard IP blocks, XAUI, Serial RapidIO, and CPRI, making the device a versatile protocol bridge for storage, networking, and broadcast gear. Designers can simultaneously run multiple upstream interfaces (for example 4x PCIe Gen2 + 8x Serial RapidIO) while presenting downstream custom logic to the FPGA fabric. The 744 user I/Os expose abundant side-band GPIO for protocol status LEDs and management interfaces.
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High-Performance Test and Measurement
Automated test equipment and protocol analyzers benefit from the EP4SGX530KH40C4's combination of fast fabric and high-speed I/O. The device captures multi-channel high-speed serial data into 28 Mb of block RAM, then post-processes it in real time using its DSP and logic resources. The C4 speed grade closes timing margins for high-Fmax state machines and pattern generators, and the 1517-ball FC-HFBGA package supports controlled-impedance PCB layers needed for 8.5 Gbps capture cards.
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Broadcast Video Processing
The EP4SGX530KH40C4 is well matched to uncompressed 4K/UHD video pipelines where multi-gigabit transceivers ingest SDI streams (e.g., 6G/12G-SDI over coax) and the FPGA fabric performs color-space conversion, scaling, and overlay. The 744 user I/Os provide dedicated parallel interfaces for HDMI, DisplayPort, and SDI serializers, while the 21,248 LABs handle multi-layer compositing. Designers in broadcast workflows rely on Quartus II's video and image processing IP cores to shorten integration cycles on the Stratix IV GX family.
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추천 제품 요약
엔지니어링 참조 데이터: EP4SGX530KH40C4 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP4SGX530KH40C3 | EP4SGX530KH40C3N | EP4SGX530KH40C2N | EP4SGX530KH40C2 | EP4SGX530KF43C4 |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 1517-BBGA FC-HFBGA | 1517-BBGA FC-HFBGA - same | 1517-BBGA FC-HFBGA - same | 1517-BBGA FC-HFBGA - same | 1517-BBGA FC-HFBGA - same | 1760-BBGA FC-FBGA - different |
| Logic Elements | 531,200 | 531,200 | 531,200 | 531,200 | 531,200 | 531,200 |
| Speed Grade | C4 | C3 | C3 | C2 | C2 | C4 |
| Temperature Grade | Commercial (0 to 85 °C) | Commercial (0 to 85 °C) | Commercial (0 to 85 °C) | Commercial (0 to 85 °C) | Commercial (0 to 85 °C) | Commercial (0 to 85 °C) |
| Embedded Memory (Mb) | 28 | 28 | 28 | 28 | 28 | 28 |
주요 차별점
- Highest density 1517-ball FC-HFBGA member of the Stratix IV GX family (vs EP4SGX530HH35C4)
- C4 speed grade offers the highest performance in the KH40 package (vs EP4SGX530KH40C3)
- Largest embedded memory footprint in the Stratix IV GX family (vs EP4SGX360KF40C4)
설계 노트
Estimated: The 1517-ball FC-HFBGA package requires a 1.0 mm ball pitch PCB land pattern with non-solder-mask-defined (NSMD) pads for consistent BGA joint formation. Decoupling strategy from the Stratix IV GX pin connection guidelines recommends placing 0.1 µF X7R capacitors at every four transceiver balls plus bulk 22 µF tantalums at each VCC/GND pair. Transceiver channel reference clocks must be routed with 100 Ω differential impedance and length-matched within ±25 ps for proper duty-cycle distortion compliance at 8.5 Gbps.
Estimated: Core power at full utilization of 531,200 LEs plus 48 transceivers at 8.5 Gbps can approach 18 W; design with a multi-rail supply producing 0.9 V core, 1.1 V transceiver PLL, 1.5 V/1.8 V/2.5 V/3.0 V I/O banks. Use a 6-layer minimum stack-up with two solid ground planes to provide return paths for high-speed transceiver currents. The Quartus II Early Power Estimator (EPE) spreadsheet should be run with realistic toggle rates before committing to the BOM and thermal solution.
Configuration bitstream for the EP4SGX530KH40C4 can exceed 60 Mbit; ensure the EPCS64 or compatible configuration flash is sized appropriately. The CONF_DONE pin must be pulled high with a 10 kΩ resistor per the Stratix IV device handbook, and the JTAG chain should include a buffer when multiple Intel/Altera devices share the bus. Programming failures from the Quartus Programmer are commonly traced to MSEL pin settings - consult the configuration chapter to confirm passive vs fast mode resistor selection.
Estimated: At 8.5 Gbps the channel loss budget for the EP4SGX530KH40C4's transceivers is approximately 12 dB at the Nyquist frequency. With FR-4 stack-ups this requires pre-emphasis and equalization coefficients from the Stratix IV GX transceiver toolkit. Simulate each high-speed serial channel with the Quartus II IBIS-AMI model before committing to the PCB stack-up and via geometry. Length matching between TX and RX pairs should target ±0.127 mm (5 mil) intra-pair and ±1.27 mm (50 mil) inter-pair.
규정 준수 정보
Stratix IV GX devices are RoHS compliant per the manufacturer ordering information. The 'N' suffix in EP4SGX530KH40C3N / C2N indicates lead-free Pb-free assembly. AEC-Q100 automotive qualification does not apply; for AEC-Q100 designs use Cyclone IV or Cyclone V automotive variants. Conflict-minerals compliance per Intel Conflict Minerals Reporting.
