EPF10K100GC503-3 - FLEX 10K 100K Gates FPGA 503-Pin CPGA | Intel (Altera)
부품 번호: EPF10K100GC503-3 ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $265 | $2,650.00 |
| 100 | $235 | $23,500.00 |
| 500 | $198 | $99,000.00 |
| 1,000 | $175 | $175,000.00 |
EPF10K100GC503-3 개요
What is a FLEX 10K FPGA? The FLEX 10K family is a PLD (Programmable Logic Device) family that pioneered embedded programmable logic - embedding dedicated array blocks alongside the generic logic fabric to implement efficient memory, arithmetic, and specialized logic functions without consuming logic elements. Positioned in the FPGA taxonomy, FLEX 10K sits between classic CPLDs (deterministic, glue-logic) and modern SRAM-based FPGAs (high-density, register-rich). Its hierarchy: FPGA -> programmable logic device -> digital logic IC -> semiconductor.
Key features include 4,992 logic elements (cells), 4992 logic cells, 125 MHz internal operation, 0.42 um process technology, and 5V tolerant I/O. The device supports JTAG-based in-system programmability via the IEEE 1149.1 boundary-scan interface, allowing configuration via the passive serial, passive parallel synchronous, passive parallel asynchronous, and active serial modes. Embedded array blocks (EABs) provide dedicated memory blocks for FIFO, dual-port RAM, ROM, and CAM implementations.
The FLEX 10K architecture embeds up to twelve EABs per row of logic array blocks, each EAB providing 2,048 bits of memory that can be configured as 256x8, 512x4, 1024x2, or 2048x1. Logic array blocks (LABs) each contain eight logic elements (LEs), and each LE contains a 4-input look-up table (LUT), a programmable register, and carry-chain logic for arithmetic operations.
Typical applications include telecommunications infrastructure, industrial control systems, test and measurement instrumentation, and legacy embedded designs requiring drop-in replacement of obsolete FLEX 10K silicon. The wide I/O count (over 400 user I/Os) and embedded memory make it suitable for data-path bridging, protocol conversion, and bus-interface consolidation.
When designing with this device, allocate sufficient decoupling capacitance near each power pin and use multiple ground returns. The CPGA package provides excellent thermal dissipation but requires a socket or careful PCB footprint for through-hole assembly. Configuration data is volatile - external configuration memory (EPC1 or EPC2) is required at every power-up.
This page synthesizes distributor stock indicators, drop-in alternatives within the FLEX 10K family, and practical design notes not consolidated in the original Altera datasheet, helping engineers managing legacy FLEX 10K designs make informed replacement decisions.
드롭인 대체품: EPF10K100GC503-3 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EPF10K100GC503-3 (동일 폼 팩터 및 풋프린트) — 차이점: Configuration Method, Operating Temperature, Package, Process Technology, Family.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EPF10K100GC503-3N
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
EPF10K100GC503-3DX
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
EPF10K100EQC240-3
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$55.5 / 개
데이터시트 보기 →EPF10K100EFC484-3
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$65 / 개
데이터시트 보기 →EPF10K100BFC256-3
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$58.2 / 개
데이터시트 보기 →EPF10K100GC503-3 최대 정격 & 전기적 특성
| Family | FLEX 10K |
| Series | FLEX 10KA |
| Typical Gate Count | 100,000 gates |
| Logic Cells / Logic Elements | 4,992 cells |
| Maximum Operating Frequency | 125 MHz |
| Process Technology | 0.42 um CMOS |
| Core Supply Voltage | 3.3 V |
| I/O Supply Voltage | 5 V tolerant |
| Package Type | 503-pin CPGA (Ceramic Pin Grid Array) |
| Embedded Array Blocks (EABs) | 12 EABs per row |
| EAB Memory Size | 2,048 bits per EAB |
| Logic Array Blocks (LABs) | 16 LEs per LAB |
| Configuration Method | Passive Serial / Passive Parallel / Active Serial, JTAG IEEE 1149.1 |
| 동작 온도 | -40C to +85C (industrial) |
| RoHS 상태 | Non-Compliant (CPGA, military/legacy) |
| Speed Grade | -3 |
EPF10K100GC503-3 503-pin cpga (ceramic pin grid array) 핀 구성 가이드
EPF10K100GC503-3(503-pin cpga (ceramic pin grid array) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EPF10K100GC503-3.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EPF10K100GC503-3 적합 용도: 6 애플리케이션s: Legacy Telecommunications Infrastructure, Industrial Control and Factory Automation, Military and Aerospace Avionics, Test and Measurement Instrumentation, Legacy Bus Interface Bridging, Data Path Processing and DSP Front-End.
Legacy Telecommunications Infrastructure
The EPF10K100GC503-3's 100K gate integration and 503-pin CPGA package suit telecom line-card backplane designs where FLEX 10K designs are qualified and cannot be re-qualified. The 125 MHz performance and embedded array blocks support protocol conversion (E1/T1 framing, HDLC, ATM cell processing) and bus-interface consolidation. The CPGA hermetic package withstands the operating temperature range of telecom central offices, and the IEEE 1149.1 JTAG interface supports in-system boundary-scan diagnostics for field maintenance.
추천
Industrial Control and Factory Automation
The EPF10K100GC503-3's wide I/O count, embedded array blocks, and 0.42 um CMOS architecture support real-time control logic in factory automation. Designers use the 4,992 logic cells to implement motor-control state machines, encoder decoding, multi-axis motion sequencing, and interlock logic for safety circuits. The CPGA package provides mechanical robustness on through-hole industrial backplanes. Embedded EABs implement fast lookup tables for PID loop coefficients and trajectory profiles.
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Military and Aerospace Avionics
The 503-pin CPGA package of the EPF10K100GC503-3 is hermetic and qualified for military and aerospace environments where plastic packages fail. Avionics bus interfaces (MIL-STD-1553, ARINC 429), radar signal preprocessing, and flight-control logic often use this part for its established reliability heritage. The wide operating temperature range, radiation-tolerance screening options (when ordered through MIL-PRF-38535 sources), and 5V-tolerant I/O compatibility with legacy bus transceivers make this part suitable for line-replaceable unit (LRU) designs.
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Test and Measurement Instrumentation
The EPF10K100GC503-3's embedded array blocks and 125 MHz performance suit digital test instruments - logic analyzers, protocol analyzers, and ATE pattern generators. Designers implement deep FIFO buffers in EABs to capture high-speed bus traffic, and use logic cells to generate stimulus patterns. The 5V-tolerant I/O directly interfaces legacy test fixtures, while the JTAG boundary-scan interface supports interconnect testing on loaded boards. The CPGA package suits benchtop instruments where through-hole soldering simplifies repair.
추천
Legacy Bus Interface Bridging
The EPF10K100GC503-3 bridges between legacy peripheral buses (ISA, VME, PCI) and modern high-speed serial links in industrial and embedded systems. Its 4,992 cells accommodate bus-state machines, FIFO buffers in EABs, and parallel-serial converters. Many VMEbus SBC designs use this part to maintain backward compatibility while adding newer interfaces, leveraging its wide I/O count for simultaneous legacy and modern bus pinout.
추천
Data Path Processing and DSP Front-End
The EPF10K100GC503-3's EAB-based memory and 125 MHz clock rate support DSP front-end tasks such as FIR filtering, FFT preprocessing, and digital downconversion in software-defined radio. Embedded array blocks implement coefficient ROM and delay-line memory, while logic cells perform arithmetic operations. The wide I/O count accommodates parallel ADC interfaces, and the JTAG interface simplifies in-system firmware updates during algorithm development.
추천
추천 제품 요약
엔지니어링 참조 데이터: EPF10K100GC503-3 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EPF10K100GC503-3N | EPF10K100GC503-3DX | EPF10K100EQC240-3 | EPF10K100EFC484-3 | EPF10K100BFC256-3 |
|---|---|---|---|---|---|---|
| Package | 503-pin CPGA | 503-pin CPGA - same | 503-pin CPGA - same | 240-pin PQFP - different | 484-pin BGA - different | 256-pin BGA - different |
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Family | FLEX 10K | FLEX 10K - same | FLEX 10K - same | FLEX 10KE | FLEX 10KE | FLEX 10KB |
| Logic Cells | 4,992 | 4,992 | 4,992 | 4,992 | 4,992 | 4,992 |
| Core Voltage | 3.3 V | 3.3 V | 3.3 V | 2.5 V or 3.3 V selectable | 1.8/2.5/3.3 V selectable | 3.3 V |
| Maximum Frequency | 125 MHz | 125 MHz | 125 MHz | 125 MHz | 125 MHz | 100 MHz |
| RoHS Status | Non-Compliant (CPGA) | Compliant (lead-free finish) | Non-Compliant | Compliant | Compliant | Compliant |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
| Configuration Memory | EPC1 / EPC2 | EPC1 / EPC2 - same | EPC1 / EPC2 - same | EPC1 / EPC2 / EPC4 | EPC1 / EPC2 / EPC4 | EPC1 / EPC2 |
주요 차별점
- Hermetic 503-pin CPGA package for military/aerospace reliability (vs EPF10K100EFC484-3)
- Same-package lead-free variant available for RoHS migration (vs EPF10K100GC503-3N)
- Pin-compatible dry-pack variant for long-term storage (vs EPF10K100GC503-3DX)
- 100K gates with embedded array blocks for memory-intensive functions (vs EPF10K100BFC256-3 (256-pin BGA))
설계 노트
The EPF10K100GC503-3 requires multiple supply rails: VCCINT (3.3V core) supplies the logic fabric and EABs, while VCCIO (3.3V or 5V) powers the I/O banks. Decouple each VCCINT/VCCIO pin with a 0.1 uF ceramic capacitor placed within 5 mm of the pin, and add a 10 uF bulk tantalum per supply rail. Estimated: total VCCINT current at 125 MHz with 80% utilization reaches approximately 250-400 mA; verify with the FLEX 10K power calculator in Quartus. Add a 1 kohm pull-up to VCC on nCONFIG and a 10 kohm pull-up on MSEL0/MSEL1 to ensure deterministic configuration mode at power-up.
The 503-pin CPGA package provides a thermal resistance (theta_JA) of approximately 15 C/W with still air, which is favorable for high-dissipation designs. Estimated: at full 100K-gate utilization and 125 MHz, internal dissipation reaches 1.5-2.0 W, yielding a junction temperature rise of 25-30 C above ambient. For continuous operation above 70C ambient, add forced-air cooling or heat-sink attachment to the package lid. Verify the ceramic package thermal impedance in the FLEX 10K package thermal characteristics document.
The CPGA-503 package uses a 2.54 mm pin pitch with pins on a 0.10 inch grid; PCB through-hole pads should be 1.0 mm drill with 1.7 mm annular ring plated to 25-50 um copper. Use a socket (e.g., PGA socket) if field replacement is anticipated - the CPGA's ceramic body is brittle and direct soldering risks pin cracking under thermal stress. Route high-speed signals on inner layers with controlled impedance; place 4-6 ground vias within 5 mm of the package perimeter to minimize ground bounce.
Do not confuse the EPF10K100GC503-3 with the FLEX 10KE variant (EPF10K100E...) - the KE family requires a different configuration bitstream and may operate from 2.5V core, which is incompatible at the PCB level. Always verify configuration memory compatibility: EPC1 supports up to 1 Mbit, EPC2 supports 2 Mbit; the EPF10K100 may exceed EPC1 capacity, requiring EPC2. Ensure JTAG chain ordering matches the BSDL file order, otherwise boundary-scan diagnostics will fail. The CPGA package is non-RoHS by default - specify -3N suffix if lead-free compliance is required.
규정 준수 정보
CPGA package is non-RoHS by default. Choose -3N suffix variant for lead-free terminal finish. Military/aerospace usage exempt from RoHS under Directive 2011/65/EU Annex III. Not applicable for AEC-Q100 (FPGA is not an automotive-grade part in this legacy family).
