EPF10K100EFC484-3 - FLEX 10KE FPGA, 100K Gates, 484-BGA | Altera
부품 번호: EPF10K100EFC484-3 ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $95 | $95.00 |
| 10 | $86.5 | $865.00 |
| 100 | $78.2 | $7,820.00 |
| 500 | $71.4 | $35,700.00 |
| 1,000 | $65 | $65,000.00 |
EPF10K100EFC484-3 개요
An FPGA (Field Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs/LABs), programmable interconnect, and I/O cells that can be re-programmed in the field to implement arbitrary digital logic. FPGAs occupy the same design role as ASICs but offer lower NRE cost and faster time-to-market. FLEX 10KE devices are organized as a hierarchical architecture in which each LAB contains eight Logic Elements (LEs), each LE comprising a 4-input lookup table, a programmable flip-flop, and a dedicated carry chain for arithmetic. Embedded Array Blocks (EABs) provide on-chip synchronous RAM of up to 2,048 bits per block, totaling 49,152 bits across the EPF10K100E.
Key features of the EPF10K100EFC484-3 include support for 5.0V PCI compliance with pull-up clamping diodes on a pin-by-pin basis, multi-voltage I/O supporting 2.5V, 3.3V, and 5.0V interfaces, built-in IEEE Std. 1149.1-1990 JTAG boundary-scan test (BST) circuitry that does not consume device logic, and on-chip clock-management PLL options. The -3 speed grade represents the fastest commercial timing bin, making this variant suitable for high-throughput glue-logic, custom bus-interface, and prototype designs where propagation delay is the critical constraint.
Typical applications for the EPF10K100EFC484-3 include PCI bus interface bridges in legacy computing platforms, custom peripheral controllers, telecommunications backplane glue logic, industrial machine-control state machines, and instrumentation front-ends with hardware-accelerated DSP preprocessing. The 338 available I/O pins comfortably accommodate wide parallel buses (32-bit data plus control) without external muxing.
When designing with this part, supply the core with 2.5V and the I/O banks with their bank-specific VCCIO (2.5V/3.3V/5.0V) and verify JTAG chain ordering against the BSDL file before board bring-up. The 484-BGA package requires a multilayer PCB with controlled-impedance traces and proper thermal vias under the die-up substrate.
This page synthesizes distributor pricing, package-level drop-in alternatives within the FLEX 10KE family, and practical design notes not consolidated in any single manufacturer document, helping procurement and design engineers make informed lifecycle decisions for legacy designs.
드롭인 대체품: EPF10K100EFC484-3 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EPF10K100EFC484-3 (동일 폼 팩터 및 풋프린트) — 차이점: Package, Process Technology, Speed Grade, Operating Temperature, Configuration Method.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EPF10K100EFC484-2X
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$237.71 / 개
데이터시트 보기 →EPF10K100EFC484-2
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$185.4 / 개
데이터시트 보기 →EPF10K100EFC484-1X
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$349.57 / 개
데이터시트 보기 →EPF10K100EFC484-1N
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$158 / 개
데이터시트 보기 →EPF10K100EFC484-1
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$142 / 개
데이터시트 보기 →EPF10K100EFC484-3 최대 정격 & 전기적 특성
| Family | FLEX 10KE |
| Typical Gates | 100,000 |
| Maximum System Gates | 158,000 |
| Logic Elements | 4,992 |
| Logic Array Blocks (LABs) | 624 |
| Embedded Memory (EAB RAM) | 49,152 bits |
| User I/O Pins | 338 |
| Speed Grade | -3 (fastest commercial) |
| 패키지 | 484-ball FineLine BGA |
| 동작 온도 | 0C to +70C (Commercial) |
| Core Voltage | 2.5 V |
| I/O Standards Supported | 2.5V / 3.3V / 5.0V (PCI-compliant) |
| JTAG Support | IEEE Std. 1149.1-1990 BST |
| Configuration Method | SRAM (volatile, requires configuration device) |
EPF10K100EFC484-3 484-ball fineline bga 핀 구성 가이드
EPF10K100EFC484-3(484-ball fineline bga 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EPF10K100EFC484-3.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EPF10K100EFC484-3 적합 용도: 6 애플리케이션s: PCI Bus Interface Bridge, Custom Peripheral Controller / Glue Logic, Telecommunications Backplane Glue Logic, Industrial Machine Control State Machine, Instrumentation Front-End with Hardware DSP, Legacy Computing Platform Replacement.
PCI Bus Interface Bridge
The EPF10K100EFC484-3 is well-suited for PCI bus interface bridges in legacy computing and industrial backplanes where 5.0V PCI signaling is required. The device's 338 user I/O pins comfortably accommodate a 32-bit PCI bus (32 data + 32 address + control) plus auxiliary status registers and DMA channels without external muxing. According to the FLEX 10KE datasheet, the device supports 5.0V PCI compliance with on-chip pull-up clamping diodes on a pin-by-pin basis, eliminating the need for external bus-hold circuitry. The -3 speed grade provides propagation delays tight enough to meet 33 MHz PCI timing (30 ns cycle) with comfortable margin. Place the device adjacent to the PCI connector, use controlled-impedance 65-ohm traces, and decouple each VCCIO bank with 0.1 uF ceramic plus 10 uF bulk capacitors.
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Custom Peripheral Controller / Glue Logic
The EPF10K100EFC484-3's 4,992 logic elements and 624 LABs make it an excellent platform for custom peripheral controllers that aggregate multiple legacy buses (ISA, VME, I2C, SPI, parallel GPIO) into a unified processor interface. The 338 I/O pins allow direct connection to wide parallel buses without external bus switches, while the 49,152 bits of embedded array RAM provide on-chip buffering for command queues and data FIFOs. The -3 speed grade's fastest timing bin minimizes glue-logic propagation delay, which is critical when chaining wide address decoders and bus arbitrators. Designers should instantiate the JTAG controller from the FLEX 10KE megafunction library and verify scan-chain ordering against the BSDL file before committing to PCB layout.
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Telecommunications Backplane Glue Logic
Telecommunications backplanes require high-I/O-count glue logic to bridge legacy TDM buses (H.110, MVIP, SCSA), clock distribution networks, and control processors. The EPF10K100EFC484-3 supplies 338 user I/O pins for TDM data streams at 8.192 Mbps (E1) or wider, plus 49,152 bits of EAB RAM for elastic buffers and clock-rate conversion FIFOs. The multi-voltage I/O banks (2.5V, 3.3V, 5.0V) allow direct interface to mixed-voltage backplane transceivers without external level shifters. The on-chip PLL options handle clock multiplication and skew management for distributed backplane clocks. Maintain 50-ohm controlled impedance on all clock and high-speed data lines and place series-termination resistors within 500 mils of the driver pins.
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Industrial Machine Control State Machine
The EPF10K100EFC484-3 is widely deployed as the central state-machine controller in industrial machine automation, sequencing I/O for motor drivers, pneumatic actuators, and safety interlocks. Its 4,992 logic elements provide ample headroom for complex state machines, encoder quadrature decoders, and PID controllers implemented in soft logic, while 338 I/O pins support dozens of sensor inputs and actuator outputs in parallel. The commercial 0C to +70C temperature range covers most factory-floor enclosures. For harsher industrial environments, the -3N industrial-temperature variant extends the operating range to -40C to +85C. Add external watchdog supervision and galvanic isolation on all field I/O because the FLEX 10KE lacks on-chip safety diagnostics.
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Instrumentation Front-End with Hardware DSP
The EPF10K100EFC484-3's 49,152 bits of EAB RAM and 4,992 logic elements enable hardware-accelerated DSP preprocessing in test and measurement front-ends, including FIR filtering, FFT preprocessing, and decimation. Designers can implement parallel multiplier-accumulator structures across multiple LABs to achieve sample rates well beyond what a microcontroller can manage. The 338 I/O pins accommodate high-speed parallel ADCs (16-18 bit, 100 MSPS) plus memory-mapped result buffers. The -3 speed grade's fastest timing supports pipelined DSP architectures with deep combinational paths. Route ADC data lines with matched-length impedance-controlled traces and provide a low-jitter clock directly to a global clock input pin.
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Legacy Computing Platform Replacement
The EPF10K100EFC484-3 is a drop-in solution for legacy computing platforms whose original FLEX 10KE FPGA has failed or is unavailable, including VMEbus single-board computers, military/aerospace mission computers, and medical imaging controllers. The same 484-BGA footprint, identical JTAG chain, and SRAM-based configuration mean existing PCBs can be re-populated without redesign, preserving form-fit-function. Because the part is obsolete, sourcing through distributors such as Arrow, Heisener, and XAIPART carries supply-chain risk - always verify date codes and lot traceability. Maintain a configuration bitstream archive and at least two qualified sources of supply for any long-life program that depends on this device.
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추천 제품 요약
엔지니어링 참조 데이터: EPF10K100EFC484-3 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EPF10K100EFC484-2X | EPF10K100EFC484-2 | EPF10K100EFC484-1X | EPF10K100EFC484-1N | EPF10K100EFC484-1 |
|---|---|---|---|---|---|---|
| Brand | Altera (Intel PSG) | Altera (Intel PSG) | Altera (Intel PSG) | Altera (Intel PSG) | Altera (Intel PSG) | Altera (Intel PSG) |
| Package | 484-BGA (FineLine BGA) | 484-BGA (FineLine BGA) - same | 484-BGA (FineLine BGA) - same | 484-BGA (FineLine BGA) - same | 484-BGA (FineLine BGA) - same | 484-BGA (FineLine BGA) - same |
| Speed Grade | -3 (fastest commercial) | -2 | -2 | -1 | -1 | -1 |
| Logic Elements | 4,992 | 4,992 | 4,992 | 4,992 | 4,992 | 4,992 |
| Embedded Memory (EAB RAM) | 49,152 bits | 49,152 bits | 49,152 bits | 49,152 bits | 49,152 bits | 49,152 bits |
| User I/O Pins | 338 | 338 | 338 | 338 | 338 | 338 |
| Operating Temperature | 0C to +70C (Commercial) | 0C to +70C (Commercial) | 0C to +70C (Commercial) | 0C to +70C (Commercial) | -40C to +85C (Industrial) | 0C to +70C (Commercial) |
| Pin-to-Pin Compatible | Yes (reference) | Yes - same 484-BGA package, same pinout | Yes - same 484-BGA package, same pinout | Yes - same 484-BGA package, same pinout | Yes - same 484-BGA package, same pinout | Yes - same 484-BGA package, same pinout |
주요 차별점
- Fastest speed grade in FLEX 10KE family (vs EPF10K100EFC484-2)
- Highest I/O count within the FLEX 10KE family (vs EPF10K100EFC256-3)
- Industrial temperature variant available in same package (vs EPF10K100EFC484-1N)
설계 노트
The EPF10K100EFC484-3 requires a clean 2.5V core supply (VCCINT) plus per-bank VCCIO rails at 2.5V, 3.3V, or 5.0V. Decouple each VCC pin with a 0.1 uF X7R ceramic capacitor placed within 100 mils of the ball, and add 10 uF bulk tantalum or polymer capacitors per power plane. Power-on sequencing is not required (VCCINT and VCCIO can rise in any order), but VCCIO must be present before I/O pins drive signals to avoid back-powering. Use a dedicated LDO for VCCINT because core current can exceed 500 mA during configuration. The device is hot-socketing tolerant, but configure unused I/O pins as inputs with weak pull-ups to minimize inrush current during board insertion.
Estimated: At maximum toggle rate (all 4,992 LEs at 100 MHz with 50% activity), the EPF10K100E dissipates approximately 1.5 to 2 W internally. The 484-BGA package has a theta_JA around 15 C/W with a 4-layer PCB and standard thermal vias, yielding a junction temperature rise of 23-30 C above ambient. For commercial-grade operation (max 70C ambient), this is well within the 125C junction limit. However, in sealed enclosures or industrial environments up to 85C, derate toggle activity or add forced-air cooling. Use the FPGA's on-chip temperature-sensing diode (if present on the -3 variant) with an external temp sensor for real-time thermal monitoring.
The 484-BGA FineLine package has a 1.0 mm ball pitch and requires a multilayer PCB with laser-drilled or photo-defined vias-in-pad for reliable BGA attachment. Use a 4-layer stackup (signal/ground/power/signal) with 0.5 oz copper on outer layers and 1 oz on inner layers; controlled-impedance traces (50 ohm single-ended, 100 ohm differential) require 4-6 mil dielectric between layer 1 and layer 2. Escape-route the inner rows of the BGA with via-in-pad microvias to maximize routable channels. Provide a continuous ground plane under the BGA and stitch the perimeter with a via fence every 200 mils for EMI suppression. Reflow profile must follow JEDEC J-STD-020 with peak temperature 245C for lead-free or 220C for SnPb assembly.
Three pitfalls to avoid: (1) The FLEX 10KE is SRAM-based and requires an external configuration device (e.g., EPC2) on every power-up - designs without this device will fail to start. (2) The JTAG chain order in the BSDL file must match the silicon revision; always verify the device ID (0x0082 for EPF10K100E) before board bring-up to avoid wasted debug time. (3) The MAX+PLUS II design software is end-of-life and only runs on legacy Windows; Quartus Prime does NOT support FLEX 10KE, so maintain a working MAX+PLUS II or Quartus II environment for any firmware change. Plan a firmware-freeze date before your toolchain becomes unavailable.
규정 준수 정보
Compliance status not confirmed in verified web data. The FLEX 10KE family predates widespread RoHS adoption; later -N suffixed variants may indicate lead-free / RoHS-compliant construction. Verify with distributor's certificate of compliance (CoC) for the specific lot before use in RoHS-restricted designs. AEC-Q100 is not applicable to FPGAs in this context.