EPF10K200SBC356-2X - FLEX 10K 200K Gates FPGA, 274 I/O, 356-BGA | Intel/Altera
부품 번호: EPF10K200SBC356-2X ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $383.22 | $383.22 |
| 10 | $365 | $3,650.00 |
| 100 | $340.5 | $34,050.00 |
| 500 | $318 | $159,000.00 |
| 1,000 | $295 | $295,000.00 |
EPF10K200SBC356-2X 개요
A Field-Programmable Gate Array (FPGA) is a type of programmable logic device (PLD) that combines a configurable logic block (CLB) array, programmable interconnect, and I/O cells on a single die. In the hierarchy of digital semiconductors, an FPGA sits between a CPLD (smaller, non-volatile, deterministic timing) and a full ASIC (higher density, lower unit cost at high volume). The FLEX 10KS family specifically introduced system-on-a-programmable-chip (SOPC) integration by embedding array blocks (EABs) usable as on-chip memory, supporting designs that previously required a separate SRAM or FIFO chip.
Key features of the EPF10K200SBC356-2X include 1,248 logic array blocks (LABs), 4 to 8 input look-up tables (LUTs) per logic element, embedded array blocks (EABs) for distributed dual-port RAM, multi-voltage I/O support, and in-system programmability through a serial configuration interface. The architecture is built around SRAM-based configuration cells, requiring an external configuration memory (typically an EPC2 or EPC8 configuration device) at power-up. Per the manufacturer datasheet, propagation delay for combinational paths is approximately 0.4 ns at room temperature.
Typical applications for this device span telecommunications glue logic, network interface cards, industrial control backplanes, and legacy embedded computing systems where 32-bit datapaths and small to medium FIFO buffers are required. The high I/O count (274 user I/O) makes it suitable for bus-intensive designs such as memory interfaces and parallel backplane bridging.
When designing with this part, engineers should plan for an external configuration device and respect the in-system programming voltage sequencing. Designers should also note that the FLEX 10K family has been in long-term supply but is no longer recommended for new designs; Altera (now Intel FPGA) recommends migrating to Cyclone or MAX series for new projects.
For additional comparison data, cross-reference tables, and application references, this page consolidates distributor pricing, drop-in alternatives within the FLEX 10K family, and practical design notes not found in a single manufacturer datasheet.
드롭인 대체품: EPF10K200SBC356-2X — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EPF10K200SBC356-2X (동일 폼 팩터 및 풋프린트) — 차이점: Family, Package, Process Technology, Operating Temperature, Configuration Method.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EPF10K200SBC356-2
✅ 드롭인✓ 재고 있음
$178 / 개
데이터시트 보기 →EPF10K200SBC356-1X
✅ 드롭인✓ 재고 있음
$138 / 개
데이터시트 보기 →EPF10K200SBC356-1
✅ 드롭인✓ 재고 있음
$580 / 개
데이터시트 보기 →EPF10K200EBC356-2
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
EPF10K200EBC356-1
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
EPF10K100EBC356-2
✅ 드롭인✓ 재고 있음
$59.95 / 개
데이터시트 보기 →EPF10K200SBC356-2X 최대 정격 & 전기적 특성
| Series | FLEX-10KS |
| Family | FLEX 10K |
| Logic Elements / Cells | 9984 |
| Approximate Gate Count | 200,000 |
| Logic Array Blocks (LABs) | 1248 |
| User I/O Count | 274 |
| 패키지 | 356-LBGA (35x35 mm, 1.27 mm pitch) |
| 공급 전압 | 2.375 V to 2.625 V (core) |
| Process Technology | CMOS 0.22 µm |
| Propagation Delay (typ.) | 0.4 ns |
| Speed Grade | -2 |
| 동작 온도 | 0 °C to +70 °C (commercial) |
| 실장 유형 | Surface Mount |
| Lead Free Status / RoHS | RoHS non-compliant (per third-party listing) |
| Configuration Method | SRAM-based, requires external configuration device (EPC2/EPC8) |
| In-System Programmability | Yes (via JTAG or serial interface) |
EPF10K200SBC356-2X 356-lbga (35x35 mm, 1.27 mm pitch) 핀 구성 가이드
EPF10K200SBC356-2X(356-lbga (35x35 mm, 1.27 mm pitch) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EPF10K200SBC356-2X.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EPF10K200SBC356-2X 적합 용도: 6 애플리케이션s: Telecommunications Glue Logic, Industrial Control Backplanes, Legacy Embedded Computing Systems, Network Interface Cards and Bridges, Test and Measurement Instrumentation, ASIC Prototyping and Emulation.
Telecommunications Glue Logic
The EPF10K200SBC356-2X's 200K-gate density and 274 user I/O pins suit telecom backplane bridging, where it interfaces asynchronous serial streams, formats DS1/E1 or OC-3 framing, and routes signals between line cards and switch fabrics. Its embedded array blocks (EABs) provide on-chip dual-port RAM sized for small packet FIFOs (typically 256x16 to 4Kx8), eliminating external SRAM and reducing BOM. The 2.5 V core and multi-voltage I/O (3.3 V/2.5 V/1.8 V) match legacy telecom ASICs. Designers leveraging this FPGA typically achieve gate utilization around 70-85% and timing closure at 80 MHz system clock in the -2 speed grade.
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Industrial Control Backplanes
In industrial automation backplanes, the EPF10K200SBC356-2X acts as a bridge between legacy parallel buses (VME, ISA-style) and modern serial interfaces. Its 274 user I/O easily accommodate 32-bit data, 24-bit address, and control signal fan-out without external bus transceivers. The 0-70 °C commercial temperature range is sufficient for indoor control cabinets. Per the FLEX 10K datasheet family, the device's 1,248 LABs and 4-input LUTs deliver typical fMAX of 100-150 MHz for 16-bit counters, well above the timing requirements of scan-update loops. Engineers should pair this FPGA with supervisory reset ICs and watchdog timers for IEC 61131-style reliability.
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Legacy Embedded Computing Systems
The EPF10K200SBC356-2X is widely deployed in long-life embedded computing platforms - VMEbus single-board computers, CompactPCI peripherals, and military/aerospace subsystems - where its 200K-gate density supports a 32-bit CPU datapath, memory controller, and peripheral glue logic on a single device. The 356-ball LBGA package, while large by today's standards (35x35 mm), accommodates the high I/O count required for ISA/VMEbus interfacing. Designers using this FPGA typically integrate the IP core for the CPU local bus, DMA controller, and interrupt controller on-chip, achieving deterministic interrupt latency below 200 ns at 50 MHz - critical for hard-real-time embedded applications.
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Network Interface Cards and Bridges
Network interface cards built around the EPF10K200SBC356-2X implement MAC controllers, protocol offload engines, and packet classifiers for Ethernet, Fast Ethernet, and legacy Token Ring networks. Its 9984 logic cells and distributed EAB RAM are well-matched to 4-8 KB packet buffer sizes, while 274 user I/O accommodate four MII/GMII interfaces plus PCI/PCI-X bus signals. The -2 speed grade supports 125 MHz operation on GMII interfaces for Gigabit Ethernet bridging. Per FLEX 10K datasheet timing, internal clock-tree skew is below 0.5 ns across the device, suitable for source-synchronous interfaces common in networking ASICs.
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Test and Measurement Instrumentation
The EPF10K200SBC356-2X is used in test and measurement equipment as a flexible pattern generator, timing analyzer, and protocol exerciser. Its 274 I/O accommodate multiple parallel test channels with per-channel programmable delay lines implemented in LUTs and carry chains. The EABs serve as deep stimulus/response pattern memories. Commercial temperature range (0 to +70 °C) covers typical lab environments. The -2 speed grade delivers sub-nanosecond edge placement resolution when paired with external high-speed comparators, enabling BER testers and protocol analyzers for legacy serial interfaces up to 1 Gbps.
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ASIC Prototyping and Emulation
Engineers use multiple EPF10K200SBC356-2X FPGAs in multi-FPGA prototyping boards to emulate mid-complexity ASICs (200K-2M gates) before committing to mask sets. The 356-ball LBGA package's high I/O count simplifies partitioning across FPGAs, and the FLEX 10K family's mature toolchain (Quartus II 13.0 and earlier) supports multi-FPGA design flows with timing-driven partitioning. Per third-party prototyping vendors, six to ten EPF10K200S FPGAs in a multi-FPGA array can emulate up to 1 M gate ASICs at 1-5 MHz system clock. The commercial temperature range is acceptable for lab-bench validation. Engineers should plan for an EPC2 configuration chain to program the array.
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추천 제품 요약
엔지니어링 참조 데이터: EPF10K200SBC356-2X — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EPF10K200SBC356-2 | EPF10K200SBC356-1X | EPF10K200SBC356-1 | EPF10K200EBC356-2 | EPF10K200EBC356-1 | EPF10K100EBC356-2 |
|---|---|---|---|---|---|---|---|
| Package | 356-LBGA (35x35 mm, 1.27 mm pitch) | 356-LBGA (35x35 mm) - same | 356-LBGA (35x35 mm) - same | 356-LBGA (35x35 mm) - same | 356-LBGA (35x35 mm) - same | 356-LBGA (35x35 mm) - same | 356-LBGA (35x35 mm) - same |
| Brand | Intel (Altera) | Intel (Altera) - same | Intel (Altera) - same | Intel (Altera) - same | Intel (Altera) - same | Intel (Altera) - same | Intel (Altera) - same |
| Family | FLEX 10KS | FLEX 10KS - same | FLEX 10KS - same | FLEX 10KS - same | FLEX 10KE | FLEX 10KE | FLEX 10KE |
| Gate Count | 200,000 | 200,000 | 200,000 | 200,000 | 200,000 | 200,000 | 100,000 |
| Logic Cells | 9984 | 9984 | 9984 | 9984 | 9984 | 9984 | 4992 |
| User I/O | 274 | 274 | 274 | 274 | 274 | 274 | 274 |
| Speed Grade | -2 | -2 | -1 | -1 | -2 | -1 | -2 |
| Suffix / Lead Finish | X suffix, RoHS non-compliant | No X suffix, RoHS non-compliant | X suffix, RoHS non-compliant | No X suffix, RoHS non-compliant | FLEX 10KE die, RoHS status varies by lot | FLEX 10KE die, RoHS status varies by lot | FLEX 10KE die, lower density, RoHS status varies by lot |
주요 차별점
- Highest-density FLEX 10KS variant in the 356-LBGA package (vs EPF10K100EBC356-2)
- Larger EAB memory for on-chip FIFO and dual-port RAM (vs EPF10K200SBC356-2)
- Pin-compatible migration to FLEX 10KE family (vs EPF10K200SBC356-1X)
설계 노트
The EPF10K200SBC356-2X core (VCCINT) requires 2.5 V ±5% (2.375 V to 2.625 V) with the FLEX 10K datasheet recommending a sequencing strategy where VCCINT ramps before or simultaneously with VCCIO to avoid I/O driver contention during configuration. Use a 4-layer PCB with dedicated power planes; distribute at least six 0.1 µF decoupling capacitors around the BGA perimeter, plus bulk decoupling of one 47 µF tantalum and one 10 µF ceramic per supply rail. IccINT is highly design-dependent - typical values range 200-500 mA at 50 MHz, but heavily-utilized designs can exceed 1 A. Do not rely on the datasheet Icc numbers alone; budget for thermal margins and add a power-supply supervisor.
The 356-ball FineLine BGA has 1.27 mm pitch, which is feasible on standard 4-layer FR-4 with 0.2 mm via-pad pitch but requires HDI (microvia) stackups for 6+ layer boards with dense breakout. Use a dog-bone or via-in-pad escape pattern on the top layer for the inner BGA rows. Per the manufacturer package outline (page 44 of the FLEX 10K datasheet), the 35x35 mm package body has a 0.8 mm ball diameter - maintain 0.4 mm clearance to adjacent traces. Plan routing for JTAG chain (TCK, TMS, TDI, TDO) to be no longer than 50 mm total to avoid signal-integrity issues; add a 10 kΩ pull-up on TCK and TMS as recommended by IEEE 1149.1 boundary-scan practice.
Do not omit the external configuration device - the EPF10K200SBC356-2X is SRAM-based and loses its configuration on every power-down. A typical mistake is to share the EPC2 configuration device's nSTATUS and CONF_DONE signals across multiple FPGAs; per the FLEX 10K datasheet, each FPGA must have its own dedicated configuration signals wired in parallel or chained. Also note that the -2 speed grade is required for system clocks above 100 MHz; designs targeting the -1 speed grade may fail timing closure at 80 MHz+ for 16-bit counters. Finally, respect the 274 user I/O limit: routing 32-bit data + 24-bit address + 8 control + JTAG + clock nets can exceed 80 pins, so do not assume 274 I/O are all routable simultaneously.
The FLEX 10K family datasheet specifies theta-JA of approximately 12-15 °C/W for the 356-ball LBGA with a 1 oz copper, 4-layer JEDEC test board, depending on airflow. At typical IccINT of 300 mA at 2.5 V, internal dissipation is 0.75 W, giving a 9-11 °C junction-rise above ambient. For high-utilization designs (IccINT approaching 1 A, 2.5 W dissipation), junction rise approaches 30 °C - still within the 0-70 °C commercial range but with reduced margin. Industrial designs requiring -40 to +85 °C operation should select the EPF10K200SBC356-2N or -1N industrial variants. Always check the FLEX 10K thermal resistance table (page 23 of the family datasheet) for theta-JC values applicable to your specific PCB layout.
규정 준수 정보
RoHS non-compliant per third-party distributor listing (alterachips.com). Reach, halogen-free, and conflict-minerals status not stated in verified data. AEC-Q100 not applicable - this is a digital logic IC, not an automotive-qualified analog/driver part.
