EPF10K200SFI672-2N - 200K-Gate FLEX 10KE FPGA, 672-BGA | Intel
부품 번호: EPF10K200SFI672-2N ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $248 | $2,480.00 |
| 100 | $195 | $19,500.00 |
| 500 | $162 | $81,000.00 |
| 1,000 | $138 | $138,000.00 |
EPF10K200SFI672-2N 개요
FLEX 10KE devices belong to the FLEX (Flexible Logic Element matriX) family of SRAM-based FPGAs, with each LE containing a 4-input look-up table, a programmable register, and dedicated carry and cascade chains. FLEX 10KE extends the original FLEX 10K architecture by adding True-Look-Up-Table dual-port embedded array blocks (EABs) that double as 4 Kbit SRAM memories, and by adding FastTrack Interconnect routing that improves timing predictability and density utilization. They sit within the broader hierarchy of SRAM-based programmable logic devices (PLDs), which in turn form a major branch of digital semiconductor ICs.
Key differentiating specifications include 9,984 logic elements, 12 EABs delivering 98,304 RAM bits, 470 user I/Os, a 0.22 um CMOS process, 2.5 V core supply (5.0 V tolerant I/O with PCI compliance), JTAG boundary-scan test per IEEE Std. 1149.1, and 200 MHz internal operation. The embedded JTAG circuitry adds up to 31,250 gates overhead without consuming user logic.
Typical applications include telecommunications line cards, industrial control backplanes, military/aerospace signal processing, and PCI-based add-in card prototyping. The combination of 470 I/Os and ~200K gates supports wide datapath designs including 32-bit microcontrollers, multi-channel DMA engines, and protocol bridges.
When designing with this device, note that it is SRAM-based and therefore requires a configuration ROM (such as an EPC2) on every board - the FLEX 10KE will not retain its configuration through power cycles without external boot storage. The 672-FBGA package has a 27 x 27 mm body with 1.0 mm ball pitch, so PCB layout must support fine-pitch BGA fanout with microvia or via-in-pad technology on most stackups. EOL warnings apply; check Intel/Altera PCN history before new designs.
This page synthesizes datasheet specifications, distributor pricing, drop-in alternatives from the same FLEX 10KE family, and practical design notes that the bare datasheet PDF does not provide in one place.
드롭인 대체품: EPF10K200SFI672-2N — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EPF10K200SFI672-2N (동일 폼 팩터 및 풋프린트) — 차이점: Process Technology, Operating Temperature, RoHS Status, Embedded Array Blocks (EABs), Package.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EPF10K200SFI672-2
✅ 드롭인✓ 재고 있음
$99.5 / 개
데이터시트 보기 →EPF10K200SFI672-2B
✅ 드롭인✓ 재고 있음
$188 / 개
데이터시트 보기 →EPF10K200EFC672-2N
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
EPF10K200EFC672-3
✅ 드롭인✓ 재고 있음
$115 / 개
데이터시트 보기 →EPF10K200SBC600-2
✅ 드롭인✓ 재고 있음
$85 / 개
데이터시트 보기 →EPF10K200SFI672-2N 최대 정격 & 전기적 특성
| Family | FLEX 10KE |
| Device Logic Elements | 9,984 |
| Typical Gates | 200,000 |
| Embedded Memory (EAB) | 12 EABs, 98,304 bits total |
| User I/Os | 470 |
| Process Technology | 0.22 um CMOS |
| Core Supply Voltage | 2.5 V |
| I/O Supply Voltage | 3.3 V (5.0 V tolerant) |
| Operating Temperature Grade | Industrial (-40C to +85C) |
| Speed Grade | -2 (mid) |
| 패키지 | 672-ball FBGA (FineLine BGA), 27 x 27 mm, 1.0 mm pitch |
| 실장 유형 | Surface Mount |
| JTAG Boundary-Scan | IEEE Std. 1149.1 compliant |
| Configuration Method | SRAM-based (requires external boot ROM) |
| RoHS 상태 | Lead-free (N suffix) |
EPF10K200SFI672-2N 672-ball fbga (fineline bga), 27 x 27 mm, 1.0 mm pitch 핀 구성 가이드
EPF10K200SFI672-2N(672-ball fbga (fineline bga), 27 x 27 mm, 1.0 mm pitch 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EPF10K200SFI672-2N.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EPF10K200SFI672-2N 적합 용도: 6 애플리케이션s: Telecom Line Card Glue Logic, Industrial Control Backplane, PCI Add-In Card Prototyping, Military/Aerospace Signal Processing, Legacy System Sustenance (Board Repair), Test & Measurement Instrumentation.
Telecom Line Card Glue Logic
The EPF10K200SFI672-2N fits telecom line cards because its 9,984 logic elements and 470 user I/Os comfortably absorb 32-bit datapath glue between framer, network processor, and SERDES chips. Industrial temperature (-40C to +85C) lets the device survive outside-plant enclosures without thermal derating. The 12 EABs (98 Kbits of dual-port RAM) are sized for typical 256-deep x 32-bit FIFO/lookup-table structures used in HDLC or ATM cell buffering. Source: FLEX 10KE datasheet typical applications.
추천
Industrial Control Backplane
The EPF10K200SFI672-2N is well suited for industrial backplane controllers where 470 I/Os handle parallel sensor and actuator buses, and the industrial temperature range tolerates factory-floor thermal stress. The device's 200K-gate capacity supports custom protocol stacks (Profibus, Modbus, EtherCAT MAC layers) alongside backplane arbitration logic. The 5.0 V tolerant I/Os interface directly to legacy TTL backplanes without level shifters, simplifying PCB design.
추천
PCI Add-In Card Prototyping
The EPF10K200SFI672-2N's PCI-compliant 5.0 V I/Os and 470-pin count let engineers prototype 32-bit/33 MHz PCI add-in cards on a single FPGA without external bus drivers. The 12 EABs provide scratchpad RAM for DMA descriptor tables, while 9,984 LEs implement the bus-master state machine and any application-specific payload logic. Speed grade -2 comfortably meets 33 MHz PCI timing on internal clocked paths.
추천
Military/Aerospace Signal Processing
The industrial temperature grade and established FLEX 10KE silicon pedigree make the EPF10K200SFI672-2N a candidate for military and aerospace signal-processing subsystems where long-term die availability (not commercial EOL) is critical. 200K gates and 470 I/Os accommodate radar timing, MIL-STD-1553 protocol layers, and multi-channel ADC interfaces. Designers should pair it with ruggedized SBCs and screened configuration PROMs to meet mission profile.
추천
Legacy System Sustenance (Board Repair)
The EPF10K200SFI672-2N is the OEM-specified FPGA for many legacy Altera-based boards where the original FLEX 10KE design cannot be re-spun to a newer FPGA family without firmware redevelopment. Stocking this part - or its commercial-temperature drop-in EPF10K200SFI672-2 - allows field repair of installed telecom, industrial, and test equipment. Independent distributors such as Partstack, Vyrian, and Jotrin currently quote inventory for this MPN.
추천
Test & Measurement Instrumentation
The EPF10K200SFI672-2N's 470 I/Os and embedded RAM fit parallel ATE pin-electronics cards where each pin channel requires pattern generation, timing, and capture memory. The 12 EABs deliver 98 Kbits of capture buffer per FPGA, while 9,984 LEs implement per-pin formatting for protocols such as JTAG, SPI, and I2C. Industrial temperature grade handles instrument-internal ambient without additional cooling.
추천
추천 제품 요약
엔지니어링 참조 데이터: EPF10K200SFI672-2N — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EPF10K200SFI672-2 | EPF10K200SFI672-2B | EPF10K200EFC672-2N | EPF10K200EFC672-3 | EPF10K200SBC600-2 |
|---|---|---|---|---|---|---|
| Package | 672-ball FBGA (27x27 mm, 1.0 mm pitch) | 672-ball FBGA - same | 672-ball FBGA - same | 672-ball FBGA - same | 672-ball FBGA - same | 600-ball BGA - same family, different pinout |
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel |
| Family | FLEX 10KE (5.0 V, 2.5 V core) | FLEX 10KE | FLEX 10KE | FLEX 10KA (3.3 V) | FLEX 10KA (3.3 V) | FLEX 10KE |
| Logic Elements | 9,984 | 9,984 | 9,984 | 9,984 | 9,984 | 9,984 |
| Embedded Memory | 98,304 bits (12 EABs) | 98,304 bits | 98,304 bits | 98,304 bits | 98,304 bits | 98,304 bits |
| Temperature Grade | Industrial (-40C to +85C) | Commercial (0C to +70C) | Industrial (-40C to +85C) | Commercial (0C to +70C) | Commercial (0C to +70C) | Commercial (0C to +70C) |
| Speed Grade | -2 (mid) | -2 (mid) | -2 (mid) | -2 (mid) | -3 (slower) | -2 (mid) |
| Core Voltage | 2.5 V | 2.5 V | 2.5 V | 3.3 V | 3.3 V | 2.5 V |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
주요 차별점
- Industrial temperature grade in 672-FBGA package (vs EPF10K200SFC672-2)
- Lead-free RoHS-compliant ball finish (N suffix) (vs EPF10K200SFI672-2B)
- FLEX 10KE 5 V-tolerant I/Os with 2.5 V core (vs EPF10K200EFC672-2N)
설계 노트
The 672-ball FineLine BGA package uses 1.0 mm ball pitch on a 27 x 27 mm body. PCB stackup must support at least 4-6 routing layers with microvia or via-in-pad technology to fan out signals; a 1-2-1 build-up stackup with 0.4 mm laser-drilled microvias is the recommended baseline. Without microvias, signal escape from the inner rows becomes impractical. Confirm the PCB vendor has FLEX 10KE BGA escape patterns qualified before layout start.
FLEX 10KE devices require both a 2.5 V core rail and a 3.3 V I/O rail; the I/O bank can additionally tolerate 5.0 V inputs. The EPF10K200SFI672-2N can draw several hundred mA on the 2.5 V rail depending on toggle rate - decouple with one 100 uF bulk capacitor, four 10 uF ceramics distributed around the package perimeter, and 0.1 uF ceramics placed within 5 mm of each VCC pin group. Power sequencing: VCCINT (2.5 V) must rise no later than VCCIO (3.3 V) to avoid I/O latch-up.
FLEX 10KE is SRAM-based - the bitstream is lost on every power-down. A configuration device (Altera EPC2 or EPC8 family) is mandatory, not optional. The MSEL pins select configuration mode (PS vs PPS) and must be pulled to the correct logic level at power-up. Designers also frequently forget that the JTAG TCK pin should be weakly pulled down to prevent accidental configuration entry during board reset. Estimated: configuration time for a fully-utilized 200K-gate bitstream is approximately 100 ms in PS mode.
Estimated: at 100 MHz toggle rate and 50% utilization, the EPF10K200SFI672-2N dissipates approximately 1.5 W. The 672-FBGA package has theta_JA of roughly 15-18 C/W on a JEDEC 4-layer test board with no airflow, giving a 25C junction rise above ambient. Industrial temperature allows operation up to 85C ambient, so junction stays below 110C - safe but with limited margin. Add thermal vias under the central ball grid and consider bottom-side copper pours if a higher toggle rate is expected.
규정 준수 정보
Lead-free confirmed by N suffix per Altera FLEX 10KE ordering nomenclature. Halogen-free and conflict-minerals status not explicitly published in the verified web data; treat as unknown.
